{"id":"https://openalex.org/W3134249943","doi":"https://doi.org/10.1109/iceic51217.2021.9369757","title":"Switching and heat-dissipation performance analysis of an LTCC-based leadless surface mount package using a power factor correction converter","display_name":"Switching and heat-dissipation performance analysis of an LTCC-based leadless surface mount package using a power factor correction converter","publication_year":2021,"publication_date":"2021-01-31","ids":{"openalex":"https://openalex.org/W3134249943","doi":"https://doi.org/10.1109/iceic51217.2021.9369757","mag":"3134249943"},"language":"en","primary_location":{"id":"doi:10.1109/iceic51217.2021.9369757","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceic51217.2021.9369757","pdf_url":null,"source":{"id":"https://openalex.org/S4306498844","display_name":"2021 International Conference on Electronics, Information, and Communication (ICEIC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 International Conference on Electronics, Information, and Communication (ICEIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037292981","display_name":"Dong Yun Jung","orcid":"https://orcid.org/0000-0002-4793-7584"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Dong Yun Jung","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030293662","display_name":"Hyun Gyu Jang","orcid":"https://orcid.org/0000-0003-3502-1613"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyun Gyu Jang","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082148896","display_name":"Doohyung Cho","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Doohyung Cho","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064365103","display_name":"Sung-Kyu Kwon","orcid":"https://orcid.org/0000-0002-0343-7086"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungkyu Kwon","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111945790","display_name":"Jong Il Won","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jong Il Won","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085080347","display_name":"Seong Hyun Lee","orcid":"https://orcid.org/0000-0003-4096-3242"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong Hyun Lee","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110326731","display_name":"Kun Sik Park","orcid":null},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kun Sik Park","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061856067","display_name":"Jong\u2010Won Lim","orcid":"https://orcid.org/0000-0003-4994-8102"},"institutions":[{"id":"https://openalex.org/I142401562","display_name":"Electronics and Telecommunications Research Institute","ror":"https://ror.org/03ysstz10","country_code":"KR","type":"facility","lineage":["https://openalex.org/I142401562","https://openalex.org/I2801339556","https://openalex.org/I4210144908","https://openalex.org/I4387152098"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jong-Won Lim","raw_affiliation_strings":["Electronics and Telecommunications Research Institute, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Electronics and Telecommunications Research Institute, Daejeon, Korea","institution_ids":["https://openalex.org/I142401562"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004683252","display_name":"Yong Ha Lee","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yong Ha Lee","raw_affiliation_strings":["Y.TECH, Daejeon, Korea"],"affiliations":[{"raw_affiliation_string":"Y.TECH, Daejeon, Korea","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5037292981"],"corresponding_institution_ids":["https://openalex.org/I142401562"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.01445403,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5508109927177429},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5101988315582275},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.4925304353237152},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.47944822907447815},{"id":"https://openalex.org/keywords/silicon-carbide","display_name":"Silicon carbide","score":0.46263355016708374},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.4373719394207001},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4347870349884033},{"id":"https://openalex.org/keywords/schottky-diode","display_name":"Schottky diode","score":0.41752636432647705},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32893961668014526},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.28818216919898987},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.28641068935394287},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.17547842860221863},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.1583620011806488},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1466417908668518}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5508109927177429},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5101988315582275},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.4925304353237152},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.47944822907447815},{"id":"https://openalex.org/C2780722187","wikidata":"https://www.wikidata.org/wiki/Q412356","display_name":"Silicon carbide","level":2,"score":0.46263355016708374},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.4373719394207001},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4347870349884033},{"id":"https://openalex.org/C205200001","wikidata":"https://www.wikidata.org/wiki/Q176066","display_name":"Schottky diode","level":3,"score":0.41752636432647705},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32893961668014526},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.28818216919898987},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.28641068935394287},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17547842860221863},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1583620011806488},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1466417908668518},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iceic51217.2021.9369757","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceic51217.2021.9369757","pdf_url":null,"source":{"id":"https://openalex.org/S4306498844","display_name":"2021 International Conference on Electronics, Information, and Communication (ICEIC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 International Conference on Electronics, Information, and Communication (ICEIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8299999833106995}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321681","display_name":"Ministry of Trade, Industry and Energy","ror":"https://ror.org/008nkqk13"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W579496837","https://openalex.org/W1545626572","https://openalex.org/W2121983510","https://openalex.org/W2773624881","https://openalex.org/W2889987629","https://openalex.org/W2914926353","https://openalex.org/W2944736860","https://openalex.org/W2986077237","https://openalex.org/W4205259921"],"related_works":["https://openalex.org/W2347486132","https://openalex.org/W2316789606","https://openalex.org/W2350340797","https://openalex.org/W4293224283","https://openalex.org/W2950501077","https://openalex.org/W2133687845","https://openalex.org/W2904257419","https://openalex.org/W1986017419","https://openalex.org/W4322764371","https://openalex.org/W4200422976"],"abstract_inverted_index":{"We":[0],"propose":[1],"a":[2,18,34,46,100,152],"low-temperature":[3],"co-fired":[4],"ceramic":[5],"(LTCC)-based":[6],"leadless":[7],"surface":[8],"mount":[9],"package":[10,148,169],"to":[11,33,52,74,80,128],"improve":[12,81],"switching":[13],"and":[14,56,79,106,142,172],"heat-dissipation":[15,82,143,174],"properties":[16],"of":[17,42,83,103,110,145],"power":[19,140,153],"semiconductor.":[20],"A":[21],"silicon":[22],"carbide":[23],"(SiC)":[24],"Schottky":[25],"barrier":[26],"diode":[27],"(SBD)":[28],"bare":[29,137],"die":[30],"is":[31,50],"embedded":[32,69],"cavity":[35],"in":[36,70,120],"the":[37,71,76,84,121,129,135,146,167],"LTCC-based":[38],"multi-layer":[39,72],"substrate.":[40],"Instead":[41],"conventional":[43,130],"aluminum":[44],"wires,":[45],"flat":[47],"copper":[48],"clip":[49],"used":[51],"reduce":[53],"parasitic":[54],"inductance":[55],"electrical":[57,77],"resistance":[58,78],"caused":[59],"by":[60],"bond":[61],"wires.":[62],"Multiple":[63],"vias":[64],"filled":[65],"with":[66,160],"silver":[67],"are":[68],"substrate":[73],"decrease":[75],"package.":[85],"The":[86,139],"measured":[87],"reverse":[88,101],"recovery":[89],"charge":[90],"(Q":[91],"<inf":[92,123],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[93,108,112,124],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">rr</inf>":[94,125],")":[95],"was":[96,149],"18.02":[97],"nC":[98],"at":[99],"voltage":[102],"300":[104],"V":[105],"<tex":[107,111],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$di/dt$</tex>":[109],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">$300\\":[113],"\\mathrm{A}/\\mu\\mathrm{s}$</tex>":[114],".":[115],"It":[116],"exhibits":[117],"18.7%":[118],"improvement":[119],"Q":[122],"as":[126],"compared":[127],"TO-220":[131],"packaged":[132],"product":[133],"using":[134],"same":[136],"die.":[138],"loss":[141],"performances":[144],"proposed":[147,168],"evaluated":[150],"through":[151],"factor":[154],"correction":[155],"(PFC)":[156],"converter.":[157],"In":[158],"comparison":[159],"commercial":[161],"products,":[162],"we":[163],"can":[164],"see":[165],"that":[166],"has":[170],"low-loss":[171],"high":[173],"properties.":[175]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}