{"id":"https://openalex.org/W2036185910","doi":"https://doi.org/10.1109/i2mtc.2014.6860831","title":"Wideband measurement method for prognosis of soldering failure on electronic boards","display_name":"Wideband measurement method for prognosis of soldering failure on electronic boards","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W2036185910","doi":"https://doi.org/10.1109/i2mtc.2014.6860831","mag":"2036185910"},"language":"en","primary_location":{"id":"doi:10.1109/i2mtc.2014.6860831","is_oa":false,"landing_page_url":"https://doi.org/10.1109/i2mtc.2014.6860831","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001135021","display_name":"Francesco Adamo","orcid":"https://orcid.org/0000-0002-4128-7170"},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"F. Adamo","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066675101","display_name":"G. Andria","orcid":"https://orcid.org/0000-0001-6765-9860"},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"G. Andria","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040509788","display_name":"Attilio Di Nisio","orcid":"https://orcid.org/0000-0002-4166-7755"},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"A. Di Nisio","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042792331","display_name":"Nicola Giaquinto","orcid":"https://orcid.org/0000-0001-9209-4195"},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"N. Giaquinto","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007208196","display_name":"Valeria L. Scarano","orcid":null},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"V. L. Scarano","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019230358","display_name":"Maurizio Spadavecchia","orcid":"https://orcid.org/0000-0002-7827-1156"},"institutions":[{"id":"https://openalex.org/I68618741","display_name":"Polytechnic University of Bari","ror":"https://ror.org/03c44v465","country_code":"IT","type":"education","lineage":["https://openalex.org/I68618741"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"M. Spadavecchia","raw_affiliation_strings":["Politecnico di Bari, Bari, Puglia, IT","Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy"],"affiliations":[{"raw_affiliation_string":"Politecnico di Bari, Bari, Puglia, IT","institution_ids":["https://openalex.org/I68618741"]},{"raw_affiliation_string":"Dept. of Electr. & Inf. Eng., Politec. di Bari, Bari, Italy","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5001135021"],"corresponding_institution_ids":["https://openalex.org/I68618741"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.08801413,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"693","last_page":"696"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9927999973297119,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.8807885646820068},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7735222578048706},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.619218111038208},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5409681797027588},{"id":"https://openalex.org/keywords/physics-of-failure","display_name":"Physics of failure","score":0.488825261592865},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.45585522055625916},{"id":"https://openalex.org/keywords/wideband","display_name":"Wideband","score":0.42290329933166504},{"id":"https://openalex.org/keywords/lead","display_name":"Lead (geology)","score":0.42035210132598877},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.41364485025405884},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4025239944458008},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35953301191329956},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34955140948295593},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3076053857803345},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2897222638130188},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1878688633441925},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.1434292495250702}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8807885646820068},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7735222578048706},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.619218111038208},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5409681797027588},{"id":"https://openalex.org/C2778306610","wikidata":"https://www.wikidata.org/wiki/Q7189696","display_name":"Physics of failure","level":4,"score":0.488825261592865},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.45585522055625916},{"id":"https://openalex.org/C2780202535","wikidata":"https://www.wikidata.org/wiki/Q4524457","display_name":"Wideband","level":2,"score":0.42290329933166504},{"id":"https://openalex.org/C2777093003","wikidata":"https://www.wikidata.org/wiki/Q6508345","display_name":"Lead (geology)","level":2,"score":0.42035210132598877},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.41364485025405884},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4025239944458008},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35953301191329956},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34955140948295593},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3076053857803345},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2897222638130188},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1878688633441925},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.1434292495250702},{"id":"https://openalex.org/C114793014","wikidata":"https://www.wikidata.org/wiki/Q52109","display_name":"Geomorphology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/i2mtc.2014.6860831","is_oa":false,"landing_page_url":"https://doi.org/10.1109/i2mtc.2014.6860831","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1967897059","https://openalex.org/W1977057782","https://openalex.org/W2029516310","https://openalex.org/W2029618958","https://openalex.org/W2054360491","https://openalex.org/W2063598795","https://openalex.org/W2080521670","https://openalex.org/W2093279898","https://openalex.org/W2119648665","https://openalex.org/W2127229650","https://openalex.org/W2164704391","https://openalex.org/W2166197241","https://openalex.org/W2169569774","https://openalex.org/W7036950152"],"related_works":["https://openalex.org/W2142654563","https://openalex.org/W2108945888","https://openalex.org/W2101041421","https://openalex.org/W1489929582","https://openalex.org/W2060995412","https://openalex.org/W1914592835","https://openalex.org/W2598049802","https://openalex.org/W579237087","https://openalex.org/W2185950501","https://openalex.org/W2034989919"],"abstract_inverted_index":{"Reliability":[0],"specifications":[1],"for":[2,8,42,59,87],"solder":[3,63,84],"joints,":[4],"as":[5,7],"well":[6],"all":[9],"electronic":[10,21,88],"components,":[11],"become":[12],"a":[13,93,120,126],"fundamental":[14],"element":[15],"in":[16],"the":[17,48,66,75,101,105,110],"qualification":[18],"of":[19,50,62,82],"an":[20,43],"product.":[22],"This":[23,70],"importance":[24],"increases":[25],"if":[26],"new":[27,127],"lead-free":[28,83],"alloys":[29],"are":[30],"considered":[31],"and":[32,47,73],"then":[33],"under":[34],"test.":[35],"An":[36,116],"accelerated":[37],"thermal":[38],"test":[39],"is":[40,53,65,114,131],"proposed":[41],"early":[44],"reliability":[45,80,135],"evaluation":[46],"definition":[49],"failure":[51,60,94,106],"parameters":[52],"addressed.":[54],"The":[55],"traditional":[56],"technique":[57],"employed":[58],"monitoring":[61,78],"joints":[64],"DC":[67,76,111],"resistance":[68,77,112],"measurement.":[69],"paper":[71],"reviews":[72],"assesses":[74],"during":[79],"tests":[81],"materials":[85],"used":[86],"boards":[89],"production.":[90],"Moreover":[91],"through":[92],"prognosis":[95],"measurement":[96],"technique,":[97],"considering":[98],"wideband":[99],"measurements,":[100],"possibility":[102],"to":[103,133],"identify":[104],"occurrence":[107],"earlier":[108],"than":[109],"method":[113],"evaluated.":[115],"experimental":[117],"study":[118],"on":[119],"pass":[121],"band":[122],"filter":[123],"soldered":[124],"by":[125],"lead":[128],"free":[129],"alloy":[130],"performed":[132],"evaluate":[134],"performance.":[136]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}