{"id":"https://openalex.org/W2345339908","doi":"https://doi.org/10.1109/haptics.2016.7463166","title":"3-D printed haptic devices for educational applications","display_name":"3-D printed haptic devices for educational applications","publication_year":2016,"publication_date":"2016-04-01","ids":{"openalex":"https://openalex.org/W2345339908","doi":"https://doi.org/10.1109/haptics.2016.7463166","mag":"2345339908"},"language":"en","primary_location":{"id":"doi:10.1109/haptics.2016.7463166","is_oa":false,"landing_page_url":"https://doi.org/10.1109/haptics.2016.7463166","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Haptics Symposium (HAPTICS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-355215","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009746938","display_name":"Melisa Orta Martinez","orcid":"https://orcid.org/0000-0002-1027-5177"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Melisa Orta Martinez","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064903569","display_name":"Tania K. Morimoto","orcid":"https://orcid.org/0000-0001-5319-8995"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tania K. Morimoto","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048079759","display_name":"Annalisa Taylor","orcid":"https://orcid.org/0000-0002-7204-4956"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Annalisa T. Taylor","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035788495","display_name":"Aaron C. Barron","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aaron C. Barron","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057975273","display_name":"J. D. Akzl Pultorak","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. D. Akzl Pultorak","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071591736","display_name":"Jeanny H. Wang","orcid":"https://orcid.org/0000-0002-7303-1874"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jeanny Wang","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034013488","display_name":"Agnes Calasanz-Kaiser","orcid":null},"institutions":[{"id":"https://openalex.org/I4210163657","display_name":"Crest Middle School","ror":"https://ror.org/04cfxct26","country_code":"US","type":"education","lineage":["https://openalex.org/I4210163657"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Agnes Calasanz-Kaiser","raw_affiliation_strings":["Graham Middle School, Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Graham Middle School, Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210163657"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001979226","display_name":"Richard L. Davis","orcid":"https://orcid.org/0000-0002-6175-9200"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Richard Lee Davis","raw_affiliation_strings":["School of Education, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"School of Education, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065614058","display_name":"Paulo Blikstein","orcid":"https://orcid.org/0000-0003-3941-1088"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paulo Blikstein","raw_affiliation_strings":["School of Education, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"School of Education, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5067958710","display_name":"Allison M. Okamura","orcid":"https://orcid.org/0000-0002-6912-1666"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Allison M. Okamura","raw_affiliation_strings":["Department of Mechanical Engineering, Stanford University, Stanford, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Stanford University, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5009746938"],"corresponding_institution_ids":["https://openalex.org/I97018004"],"apc_list":null,"apc_paid":null,"fwci":7.4837,"has_fulltext":false,"cited_by_count":51,"citation_normalized_percentile":{"value":0.9744795,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"126","last_page":"133"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11687","display_name":"Teleoperation and Haptic Systems","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11687","display_name":"Teleoperation and Haptic Systems","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9922999739646912,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10648","display_name":"Virtual Reality Applications and Impacts","score":0.9815000295639038,"subfield":{"id":"https://openalex.org/subfields/1709","display_name":"Human-Computer Interaction"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/haptic-technology","display_name":"Haptic technology","score":0.865506649017334},{"id":"https://openalex.org/keywords/kinesthetic-learning","display_name":"Kinesthetic learning","score":0.8002705574035645},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6285710334777832},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.6185095310211182},{"id":"https://openalex.org/keywords/mechatronics","display_name":"Mechatronics","score":0.5442225933074951},{"id":"https://openalex.org/keywords/multimedia","display_name":"Multimedia","score":0.5287259221076965},{"id":"https://openalex.org/keywords/class","display_name":"Class (philosophy)","score":0.47512203454971313},{"id":"https://openalex.org/keywords/fidelity","display_name":"Fidelity","score":0.45149490237236023},{"id":"https://openalex.org/keywords/human\u2013computer-interaction","display_name":"Human\u2013computer interaction","score":0.41098111867904663},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.26973941922187805},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2561572790145874},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.18857499957084656},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.10542649030685425}],"concepts":[{"id":"https://openalex.org/C152086174","wikidata":"https://www.wikidata.org/wiki/Q3030571","display_name":"Haptic technology","level":2,"score":0.865506649017334},{"id":"https://openalex.org/C55457006","wikidata":"https://www.wikidata.org/wiki/Q3647098","display_name":"Kinesthetic learning","level":2,"score":0.8002705574035645},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6285710334777832},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.6185095310211182},{"id":"https://openalex.org/C28704281","wikidata":"https://www.wikidata.org/wiki/Q180165","display_name":"Mechatronics","level":2,"score":0.5442225933074951},{"id":"https://openalex.org/C49774154","wikidata":"https://www.wikidata.org/wiki/Q131765","display_name":"Multimedia","level":1,"score":0.5287259221076965},{"id":"https://openalex.org/C2777212361","wikidata":"https://www.wikidata.org/wiki/Q5127848","display_name":"Class (philosophy)","level":2,"score":0.47512203454971313},{"id":"https://openalex.org/C2776459999","wikidata":"https://www.wikidata.org/wiki/Q2119376","display_name":"Fidelity","level":2,"score":0.45149490237236023},{"id":"https://openalex.org/C107457646","wikidata":"https://www.wikidata.org/wiki/Q207434","display_name":"Human\u2013computer interaction","level":1,"score":0.41098111867904663},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.26973941922187805},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2561572790145874},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.18857499957084656},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.10542649030685425},{"id":"https://openalex.org/C138496976","wikidata":"https://www.wikidata.org/wiki/Q175002","display_name":"Developmental psychology","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/haptics.2016.7463166","is_oa":false,"landing_page_url":"https://doi.org/10.1109/haptics.2016.7463166","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE Haptics Symposium (HAPTICS)","raw_type":"proceedings-article"},{"id":"pmh:oai:DiVA.org:kth-355215","is_oa":true,"landing_page_url":"http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-355215","pdf_url":null,"source":{"id":"https://openalex.org/S4306401559","display_name":"KTH Publication Database DiVA (KTH Royal Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},{"id":"pmh:oai:DiVA.org:kth-367817","is_oa":true,"landing_page_url":"http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-367817","pdf_url":null,"source":{"id":"https://openalex.org/S4306401559","display_name":"KTH Publication Database DiVA (KTH Royal Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:DiVA.org:kth-355215","is_oa":true,"landing_page_url":"http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-355215","pdf_url":null,"source":{"id":"https://openalex.org/S4306401559","display_name":"KTH Publication Database DiVA (KTH Royal Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"sustainable_development_goals":[{"display_name":"Quality Education","id":"https://metadata.un.org/sdg/4","score":0.47999998927116394}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W147728794","https://openalex.org/W1490889509","https://openalex.org/W1566232966","https://openalex.org/W1981788401","https://openalex.org/W1987764007","https://openalex.org/W2016343678","https://openalex.org/W2016724894","https://openalex.org/W2024455083","https://openalex.org/W2032406331","https://openalex.org/W2044013801","https://openalex.org/W2069666544","https://openalex.org/W2069925356","https://openalex.org/W2107207454","https://openalex.org/W2109987039","https://openalex.org/W2117040175","https://openalex.org/W2120542232","https://openalex.org/W2131156534","https://openalex.org/W2131563149","https://openalex.org/W2146405965","https://openalex.org/W2154400847","https://openalex.org/W2166350184","https://openalex.org/W2586307227","https://openalex.org/W2730205379","https://openalex.org/W4244933696","https://openalex.org/W6605961966","https://openalex.org/W6633738765","https://openalex.org/W6733039430"],"related_works":["https://openalex.org/W3111440524","https://openalex.org/W2558272010","https://openalex.org/W2327210927","https://openalex.org/W4229057662","https://openalex.org/W2044297498","https://openalex.org/W3195731900","https://openalex.org/W2074483596","https://openalex.org/W2952163316","https://openalex.org/W1991401042","https://openalex.org/W2604504363"],"abstract_inverted_index":{"Haptic":[0],"technology":[1],"has":[2],"the":[3,9,36,44,54,68,137,181,193,198],"potential":[4],"to":[5,48,56,100,161,183],"expand":[6],"and":[7,21,53,104,120,147,163,167,186,208,230],"transform":[8],"ways":[10],"that":[11,81,158],"students":[12,160],"can":[13,82],"experience":[14,128],"a":[15,71,75,98,108,117,121,165,215],"variety":[16],"of":[17,35,39,70,91,141,200,218],"science,":[18],"technology,":[19],"engineering,":[20],"math":[22],"(STEM)":[23],"topics.":[24],"Designing":[25],"kinesthetic":[26],"haptic":[27,60,79,169],"devices":[28],"for":[29,226],"educational":[30,133],"applications":[31],"is":[32,212,238],"challenging":[33],"because":[34],"competing":[37],"objectives":[38],"using":[40,129,188],"low-cost":[41],"components,":[42],"making":[43],"device":[45,72],"robust":[46,166],"enough":[47],"be":[49,83,184],"handled":[50],"by":[51,85],"students,":[52],"desire":[55],"render":[57],"high":[58],"fidelity":[59],"virtual":[61],"environments.":[62],"In":[63],"this":[64],"paper,":[65],"we":[66,135],"present":[67],"evolution":[69],"called":[73],"\"Hapkit\":":[74],"low":[76],"cost,":[77],"one-degree-of-freedom":[78],"kit":[80],"assembled":[84],"students.":[86],"From":[87],"2013-2015,":[88],"different":[89],"versions":[90],"Hapkit":[92,130,153],"were":[93],"used":[94],"in":[95,131,139,228],"courses":[96],"as":[97,204],"tool":[99],"teach":[101],"haptics,":[102],"physics,":[103],"control.":[105],"These":[106],"include":[107],"Massive":[109],"Open":[110],"Online":[111],"Course":[112],"(MOOC),":[113],"two":[114],"undergraduate":[115],"courses,":[116],"graduate":[118],"course,":[119],"middle":[122],"school":[123],"class.":[124],"Based":[125],"on":[126],"our":[127],"these":[132],"environments,":[134],"evolved":[136],"design":[138,182,194,237],"terms":[140],"its":[142],"structural":[143,177],"materials,":[144],"drive":[145],"mechanism,":[146],"mechatronic":[148],"components.":[149],"Our":[150],"latest":[151],"design,":[152],"3.0,":[154],"includes":[155],"several":[156],"features":[157],"allow":[159],"manufacture":[162],"assemble":[164],"high-fidelity":[168],"device.":[170],"First,":[171],"it":[172,224],"uses":[173],"3-D":[174,201],"printed":[175],"plastic":[176],"material,":[178],"which":[179,222],"allows":[180],"built":[185],"customized":[187],"readily":[189],"available":[190,239],"tools.":[191],"Second,":[192],"takes":[195],"into":[196],"account":[197],"limitations":[199],"printing,":[202],"such":[203],"warping":[205],"during":[206],"printing":[207],"poor":[209],"tolerances.":[210],"This":[211],"achieved":[213],"at":[214,240],"materials":[216],"cost":[217],"approximately":[219],"US":[220],"$50,":[221],"makes":[223],"feasible":[225],"distribution":[227],"classroom":[229],"online":[231],"education":[232],"settings.":[233],"The":[234],"open":[235],"source":[236],"http://hapkit.stanford.edu.":[241]},"counts_by_year":[{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":9},{"year":2019,"cited_by_count":11},{"year":2018,"cited_by_count":6},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":3}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}