{"id":"https://openalex.org/W2075644959","doi":"https://doi.org/10.1109/essderc.2014.6948781","title":"The Factory Integration Roadmap in Semiconductor manufacturing","display_name":"The Factory Integration Roadmap in Semiconductor manufacturing","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2075644959","doi":"https://doi.org/10.1109/essderc.2014.6948781","mag":"2075644959"},"language":"en","primary_location":{"id":"doi:10.1109/essderc.2014.6948781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034510935","display_name":"James Moyne","orcid":"https://orcid.org/0000-0002-4702-6553"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"James Moyne","raw_affiliation_strings":["Applied Materials, Applied Global Services, 363 Robyn Drive, Canton, MI, U.S.A"],"affiliations":[{"raw_affiliation_string":"Applied Materials, Applied Global Services, 363 Robyn Drive, Canton, MI, U.S.A","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066239172","display_name":"Martin Schellenberger","orcid":"https://orcid.org/0000-0003-3727-1763"},"institutions":[{"id":"https://openalex.org/I160414472","display_name":"Schott (Germany)","ror":"https://ror.org/000q08p21","country_code":"DE","type":"company","lineage":["https://openalex.org/I160414472"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Martin Schellenberger","raw_affiliation_strings":["Fraunhofer Institute, Schottkystrasse 10, 91058 Erlangen, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute, Schottkystrasse 10, 91058 Erlangen, Germany","institution_ids":["https://openalex.org/I160414472"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037984481","display_name":"L. Pfitzner","orcid":null},"institutions":[{"id":"https://openalex.org/I160414472","display_name":"Schott (Germany)","ror":"https://ror.org/000q08p21","country_code":"DE","type":"company","lineage":["https://openalex.org/I160414472"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Lothar Pfitzner","raw_affiliation_strings":["Fraunhofer Institute, Schottkystrasse 10, 91058 Erlangen, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute, Schottkystrasse 10, 91058 Erlangen, Germany","institution_ids":["https://openalex.org/I160414472"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5034510935"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.6158,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.76009769,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"154","last_page":"156"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11741","display_name":"Flexible and Reconfigurable Manufacturing Systems","score":0.7829999923706055,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11741","display_name":"Flexible and Reconfigurable Manufacturing Systems","score":0.7829999923706055,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.7731999754905701,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.7163000106811523,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/factory","display_name":"Factory (object-oriented programming)","score":0.8003439903259277},{"id":"https://openalex.org/keywords/technology-roadmap","display_name":"Technology roadmap","score":0.7101660370826721},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.7098106145858765},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.6997487545013428},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.6467384696006775},{"id":"https://openalex.org/keywords/manufacturing","display_name":"Manufacturing","score":0.4686906337738037},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4635225236415863},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4064694046974182},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.39123740792274475},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.22372883558273315},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13592076301574707}],"concepts":[{"id":"https://openalex.org/C40149104","wikidata":"https://www.wikidata.org/wiki/Q5620977","display_name":"Factory (object-oriented programming)","level":2,"score":0.8003439903259277},{"id":"https://openalex.org/C2780156850","wikidata":"https://www.wikidata.org/wiki/Q2144097","display_name":"Technology roadmap","level":2,"score":0.7101660370826721},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.7098106145858765},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.6997487545013428},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.6467384696006775},{"id":"https://openalex.org/C175700187","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing","level":2,"score":0.4686906337738037},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4635225236415863},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4064694046974182},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.39123740792274475},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.22372883558273315},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13592076301574707},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/essderc.2014.6948781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/essderc.2014.6948781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 44th European Solid State Device Research Conference (ESSDERC)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/387612","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/387612","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4300000071525574}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1862469596","https://openalex.org/W2151998100","https://openalex.org/W3018215545","https://openalex.org/W2128049084","https://openalex.org/W2513899473","https://openalex.org/W4245918331","https://openalex.org/W2056444329","https://openalex.org/W1979703647","https://openalex.org/W2796831252","https://openalex.org/W49478446"],"abstract_inverted_index":{"The":[0,22],"International":[1],"Technology":[2],"Roadmap":[3],"for":[4,32,65,80],"Semiconductors":[5],"(ITRS)":[6],"is":[7],"probably":[8],"the":[9,15,18,47,99],"single":[10],"most":[11],"important":[12],"document":[13],"governing":[14],"direction":[16],"of":[17,82,86,94],"semiconductor":[19,33,100],"manufacturing":[20,101],"industry.":[21,102],"Factory":[23],"Integration":[24],"(FI)":[25],"chapter":[26],"seeks":[27],"to":[28,98],"define":[29],"a":[30,43,52],"roadmap":[31,39],"factories":[34],"and":[35,57,69,74,92],"enterprise":[36],"systems.":[37],"This":[38],"has":[40],"gone":[41],"through":[42],"significant":[44],"revision":[45],"over":[46],"past":[48],"2":[49],"years":[50],"with":[51],"focus":[53],"on":[54],"commonality,":[55],"integration,":[56],"data":[58],"driven.":[59],"New":[60],"sub-chapters":[61],"have":[62,77],"been":[63,78],"created":[64],"prediction,":[66],"big":[67],"data,":[68],"control":[70],"systems":[71],"architectures.":[72],"Challenges":[73],"potential":[75],"solutions":[76],"identified":[79],"each":[81],"these":[83],"sub-chapters,":[84],"some":[85],"which":[87,95],"are":[88,96],"common":[89],"across":[90],"industries,":[91],"others":[93],"unique":[97]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}