{"id":"https://openalex.org/W2161989618","doi":"https://doi.org/10.1109/cicc.2001.929842","title":"Silicon-germanium BiCMOS technology and a CAD environment for 2-40 GHz VLSI mixed-signal ICs","display_name":"Silicon-germanium BiCMOS technology and a CAD environment for 2-40 GHz VLSI mixed-signal ICs","publication_year":2002,"publication_date":"2002-11-13","ids":{"openalex":"https://openalex.org/W2161989618","doi":"https://doi.org/10.1109/cicc.2001.929842","mag":"2161989618"},"language":"en","primary_location":{"id":"doi:10.1109/cicc.2001.929842","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2001.929842","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2001 Custom Integrated Circuits Conference (Cat. No.01CH37169)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5054038218","display_name":"S. Subbanna","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"S. Subbanna","raw_affiliation_strings":["Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA"],"affiliations":[{"raw_affiliation_string":"Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049979563","display_name":"Lauren Larson","orcid":"https://orcid.org/0000-0002-7391-3869"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"L. Larson","raw_affiliation_strings":["IBM Research Center of Excellence, Encinitas, CA, USA"],"affiliations":[{"raw_affiliation_string":"IBM Research Center of Excellence, Encinitas, CA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004106328","display_name":"G. Freeman","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Freeman","raw_affiliation_strings":["Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA"],"affiliations":[{"raw_affiliation_string":"Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019707974","display_name":"D. Ahlgren","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Ahlgren","raw_affiliation_strings":["Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA"],"affiliations":[{"raw_affiliation_string":"Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113283941","display_name":"K. Stein","orcid":"https://orcid.org/0009-0005-4706-5797"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Stein","raw_affiliation_strings":["Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA"],"affiliations":[{"raw_affiliation_string":"Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067526080","display_name":"C. Dickey","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Dickey","raw_affiliation_strings":["IBM Microelectronics, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043488200","display_name":"J. Mecke","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Mecke","raw_affiliation_strings":["IBM Microelectronics, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110267032","display_name":"Andres Rello Rincon","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Rincon","raw_affiliation_strings":["IBM Microelectronics, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004620539","display_name":"P. Bacon","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"P. Bacon","raw_affiliation_strings":["IBM Microelectronics RFIC Design Center, Lowell, MA, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics RFIC Design Center, Lowell, MA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030543471","display_name":"R. Groves","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Groves","raw_affiliation_strings":["Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA"],"affiliations":[{"raw_affiliation_string":"Communications Research and Development Center, IBM Microelectronics, Hopewell Junction, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027599634","display_name":"M. Soyuer","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Soyuer","raw_affiliation_strings":["Research Division, IBM, Yorktown Heights, NY, USA"],"affiliations":[{"raw_affiliation_string":"Research Division, IBM, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081921507","display_name":"D.L. Harame","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Harame","raw_affiliation_strings":["IBM Microelectronics, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019401839","display_name":"James Dunn","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Dunn","raw_affiliation_strings":["IBM Microelectronics, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"IBM Microelectronics, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102985614","display_name":"Daniel B. Rowe","orcid":"https://orcid.org/0000-0002-8713-2158"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. Rowe","raw_affiliation_strings":["Sierra Monolithics, Inc., Redondo Beach, CA, USA"],"affiliations":[{"raw_affiliation_string":"Sierra Monolithics, Inc., Redondo Beach, CA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003400533","display_name":"W. Chon","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. Chon","raw_affiliation_strings":["Sierra Monolithics, Inc., Redondo Beach, CA, USA"],"affiliations":[{"raw_affiliation_string":"Sierra Monolithics, Inc., Redondo Beach, CA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072969651","display_name":"David A. Herman","orcid":"https://orcid.org/0000-0002-4381-4114"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Herman","raw_affiliation_strings":["Research Division, IBM, Yorktown Heights, NY, USA"],"affiliations":[{"raw_affiliation_string":"Research Division, IBM, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5023200609","display_name":"B.S. Meyerson","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Meyerson","raw_affiliation_strings":["Research Division, IBM, Yorktown Heights, NY, USA"],"affiliations":[{"raw_affiliation_string":"Research Division, IBM, Yorktown Heights, NY, USA","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":17,"corresponding_author_ids":["https://openalex.org/A5054038218"],"corresponding_institution_ids":["https://openalex.org/I1341412227"],"apc_list":null,"apc_paid":null,"fwci":1.0183,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.78020411,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"559","last_page":"566"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bicmos","display_name":"BiCMOS","score":0.8479071259498596},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.78706955909729},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.617523193359375},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.6143327355384827},{"id":"https://openalex.org/keywords/silicon-germanium","display_name":"Silicon-germanium","score":0.5168036222457886},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4782511293888092},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.46981126070022583},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.43744349479675293},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.43363434076309204},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4319690763950348},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.4192487597465515},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.4113022983074188},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.40615907311439514},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.3476664423942566},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2628568410873413},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.11117503046989441},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.10954645276069641},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.06922104954719543}],"concepts":[{"id":"https://openalex.org/C62427370","wikidata":"https://www.wikidata.org/wiki/Q173416","display_name":"BiCMOS","level":4,"score":0.8479071259498596},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.78706955909729},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.617523193359375},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.6143327355384827},{"id":"https://openalex.org/C2780389399","wikidata":"https://www.wikidata.org/wiki/Q367849","display_name":"Silicon-germanium","level":3,"score":0.5168036222457886},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4782511293888092},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.46981126070022583},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.43744349479675293},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.43363434076309204},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4319690763950348},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.4192487597465515},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.4113022983074188},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40615907311439514},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.3476664423942566},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2628568410873413},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.11117503046989441},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.10954645276069641},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.06922104954719543},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/cicc.2001.929842","is_oa":false,"landing_page_url":"https://doi.org/10.1109/cicc.2001.929842","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE 2001 Custom Integrated Circuits Conference (Cat. No.01CH37169)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5299999713897705,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320465","display_name":"Sugar Research and Development Corporation","ror":null},{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2004238586"],"related_works":["https://openalex.org/W1594634106","https://openalex.org/W1492027935","https://openalex.org/W2031235560","https://openalex.org/W2140183546","https://openalex.org/W2105454559","https://openalex.org/W2510447057","https://openalex.org/W2101337515","https://openalex.org/W2161335888","https://openalex.org/W4255700119","https://openalex.org/W2517605246"],"abstract_inverted_index":{"SiGe":[0],"BiCMOS":[1],"technology":[2,9,26,65],"provides":[3],"a":[4,19,31,36,78],"stable,":[5],"ultra-high":[6],"performance,":[7],"semiconductor":[8],"capable":[10],"of":[11,21,38],"supporting":[12],"large":[13],"mixed-signal":[14,42],"VLSI":[15],"circuit":[16,40,43,52],"designs":[17],"for":[18],"variety":[20,37],"emerging":[22],"communications":[23],"applications.":[24],"This":[25,58],"has":[27,66],"been":[28],"wedded":[29],"to":[30,49],"CAD":[32],"system":[33],"that":[34],"supports":[35],"high-performance":[39],"designs,":[41],"block":[44],"re-use,":[45],"and":[46],"the":[47,55,62,74],"ability":[48],"accurately":[50],"predict":[51],"performance":[53],"at":[54],"highest":[56],"frequencies.":[57],"paper":[59],"will":[60],"summarize":[61],"progress":[63],"this":[64],"made":[67],"in":[68,71],"recent":[69],"years":[70],"moving":[72],"from":[73],"research":[75],"laboratory":[76],"into":[77],"production":[79],"environment.":[80]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}