{"id":"https://openalex.org/W1978249501","doi":"https://doi.org/10.1109/ccece.2014.6901111","title":"Electromigration testing of wire bonds","display_name":"Electromigration testing of wire bonds","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W1978249501","doi":"https://doi.org/10.1109/ccece.2014.6901111","mag":"1978249501"},"language":"en","primary_location":{"id":"doi:10.1109/ccece.2014.6901111","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2014.6901111","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 27th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014083435","display_name":"Michael David Hook","orcid":"https://orcid.org/0000-0002-2625-4354"},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Michael Hook","raw_affiliation_strings":["Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","institution_ids":["https://openalex.org/I151746483"]},{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada","institution_ids":["https://openalex.org/I151746483"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017609606","display_name":"Di Xu","orcid":"https://orcid.org/0000-0002-1344-2495"},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Di Xu","raw_affiliation_strings":["Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","institution_ids":["https://openalex.org/I151746483"]},{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada","institution_ids":["https://openalex.org/I151746483"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036838070","display_name":"M. Mayer","orcid":"https://orcid.org/0000-0001-5624-7828"},"institutions":[{"id":"https://openalex.org/I151746483","display_name":"University of Waterloo","ror":"https://ror.org/01aff2v68","country_code":"CA","type":"education","lineage":["https://openalex.org/I151746483"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Michael Mayer","raw_affiliation_strings":["Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario","institution_ids":["https://openalex.org/I151746483"]},{"raw_affiliation_string":"Department of Mechanical and Mechatronics Engineering, University of Waterloo, Ontario N2L 3G6, Canada","institution_ids":["https://openalex.org/I151746483"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5014083435"],"corresponding_institution_ids":["https://openalex.org/I151746483"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.04730434,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9156228303909302},{"id":"https://openalex.org/keywords/degree-celsius","display_name":"Degree Celsius","score":0.7064477801322937},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6556788682937622},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.6274956464767456},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.6197850704193115},{"id":"https://openalex.org/keywords/current-density","display_name":"Current density","score":0.458588570356369},{"id":"https://openalex.org/keywords/electrical-resistance-and-conductance","display_name":"Electrical resistance and conductance","score":0.4339252710342407},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.4204517900943756},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3794131875038147},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.36709702014923096},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.3491731286048889},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28080934286117554},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.15526288747787476},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.12717995047569275},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11050206422805786},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0763598084449768},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.07264888286590576}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9156228303909302},{"id":"https://openalex.org/C6425155","wikidata":"https://www.wikidata.org/wiki/Q25267","display_name":"Degree Celsius","level":2,"score":0.7064477801322937},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6556788682937622},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.6274956464767456},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6197850704193115},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.458588570356369},{"id":"https://openalex.org/C94857076","wikidata":"https://www.wikidata.org/wiki/Q106603432","display_name":"Electrical resistance and conductance","level":2,"score":0.4339252710342407},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4204517900943756},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3794131875038147},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.36709702014923096},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.3491731286048889},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28080934286117554},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.15526288747787476},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.12717995047569275},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11050206422805786},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0763598084449768},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.07264888286590576},{"id":"https://openalex.org/C43617362","wikidata":"https://www.wikidata.org/wiki/Q170050","display_name":"Chromatography","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ccece.2014.6901111","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ccece.2014.6901111","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 27th Canadian Conference on Electrical and Computer Engineering (CCECE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1524316427","https://openalex.org/W1530647237","https://openalex.org/W1897423780","https://openalex.org/W1973301822","https://openalex.org/W1976788390","https://openalex.org/W2000344826","https://openalex.org/W2000455170","https://openalex.org/W2003806889","https://openalex.org/W2004712986","https://openalex.org/W2005694031","https://openalex.org/W2007719944","https://openalex.org/W2023267814","https://openalex.org/W2024878069","https://openalex.org/W2029860376","https://openalex.org/W2031888695","https://openalex.org/W2045701385","https://openalex.org/W2050040658","https://openalex.org/W2075922832","https://openalex.org/W2085426101","https://openalex.org/W2092792429","https://openalex.org/W2103332948","https://openalex.org/W2147557075"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2012384475","https://openalex.org/W1533678123","https://openalex.org/W3211288765","https://openalex.org/W2211409192","https://openalex.org/W2013482566","https://openalex.org/W1990596417","https://openalex.org/W4231742212","https://openalex.org/W2056347143"],"abstract_inverted_index":{"Wire":[0,38],"bonding":[1],"is":[2],"the":[3,15,47,85,99],"dominant":[4],"first-level":[5],"interconnection":[6],"technology":[7],"for":[8,24,70],"packaging":[9],"of":[10,17,77,101,107,113,121,160],"microelectronics.":[11],"This":[12],"paper":[13],"presents":[14],"results":[16],"testing":[18,108],"silver":[19,139],"and":[20,53,94,132,157],"gold":[21,89],"wire":[22,103],"bonds":[23],"electromigration":[25,145],"with":[26],"substrate":[27],"temperatures":[28,134],"from":[29,144],"100":[30],"degrees":[31,36,79,115,137],"Celsius":[32,80],"to":[33],"over":[34],"200":[35],"Celsius.":[37,116],"resistances":[39],"were":[40,49],"measured":[41],"during":[42],"testing,":[43,46],"and,":[44],"following":[45],"wires":[48,58,90,140],"imaged":[50],"by":[51,150],"optical":[52],"scanning":[54],"electron":[55],"microscopy.":[56],"Silver":[57],"withstood":[59],"4":[60],"\u00d7":[61,123],"10":[62,124],"<sup":[63,125],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[64,126],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">5</sup>":[65,127],"amperes":[66,128],"per":[67,129],"square":[68,130],"centimeter":[69,131],"180":[71],"hours":[72,106,159],"at":[73,109],"a":[74,95,110,118],"peak":[75,111,133],"temperature":[76,112],"190":[78],"without":[81],"detectable":[82],"damage.":[83],"For":[84,117],"same":[86],"current":[87,119],"density,":[88],"showed":[91,141],"surface":[92],"cracking":[93],"small":[96],"increase":[97],"in":[98],"resistance":[100],"one":[102],"after":[104,154],"330":[105],"350":[114],"density":[120],"2.5":[122],"above":[135],"600":[136],"Celsius,":[138],"severe":[142],"distortion":[143],"along":[146],"grain":[147],"boundaries,":[148],"followed":[149],"open":[151],"circuit":[152],"failures":[153],"between":[155],"35":[156],"50":[158],"testing.":[161]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-25T21:42:39.735039","created_date":"2025-10-10T00:00:00"}