{"id":"https://openalex.org/W3004723660","doi":"https://doi.org/10.1109/asicon47005.2019.8983690","title":"Synergistic Effect of BTI and Process Variations on Impact and Monitoring of Combination Circuit","display_name":"Synergistic Effect of BTI and Process Variations on Impact and Monitoring of Combination Circuit","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3004723660","doi":"https://doi.org/10.1109/asicon47005.2019.8983690","mag":"3004723660"},"language":"en","primary_location":{"id":"doi:10.1109/asicon47005.2019.8983690","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983690","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050920606","display_name":"Linzhe Li","orcid":"https://orcid.org/0000-0002-4941-3127"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Linzhe Li","raw_affiliation_strings":["Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","Microelectronics Center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100651217","display_name":"Liyi Xiao","orcid":null},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liyi Xiao","raw_affiliation_strings":["Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","Microelectronics Center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028530320","display_name":"Jie Li","orcid":"https://orcid.org/0000-0002-7075-4145"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Li","raw_affiliation_strings":["Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","Microelectronics Center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101915942","display_name":"He Liu","orcid":"https://orcid.org/0000-0002-9196-4213"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"He Liu","raw_affiliation_strings":["Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","Microelectronics Center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103236320","display_name":"Zhigang Mao","orcid":"https://orcid.org/0000-0001-9431-9853"},"institutions":[{"id":"https://openalex.org/I204983213","display_name":"Harbin Institute of Technology","ror":"https://ror.org/01yqg2h08","country_code":"CN","type":"education","lineage":["https://openalex.org/I204983213"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhigang Mao","raw_affiliation_strings":["Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","Microelectronics Center, Harbin Institute of Technology, Harbin, China"],"affiliations":[{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology,Harbin,China,150001","institution_ids":["https://openalex.org/I204983213"]},{"raw_affiliation_string":"Microelectronics Center, Harbin Institute of Technology, Harbin, China","institution_ids":["https://openalex.org/I204983213"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5050920606"],"corresponding_institution_ids":["https://openalex.org/I204983213"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.16221213,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5579944252967834},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.45104241371154785},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4463271498680115},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33166828751564026},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2296944558620453},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.08121392130851746}],"concepts":[{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5579944252967834},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.45104241371154785},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4463271498680115},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33166828751564026},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2296944558620453},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.08121392130851746}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon47005.2019.8983690","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983690","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6700000166893005}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2343169104","https://openalex.org/W4252001751"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"With":[0],"the":[1,13,24,38,44,52,58,75,91],"technology":[2],"node":[3],"scaling":[4],"down,":[5],"aging":[6,83],"effect":[7,28],"and":[8,29,43,61,79],"process":[9,30],"variations":[10],"have":[11],"become":[12],"most":[14],"critical":[15],"reliability":[16],"issues":[17],"for":[18],"integrated":[19],"circuit.":[20],"In":[21],"this":[22],"paper,":[23],"influence":[25],"of":[26,40,46,54,93,98],"BTI":[27],"variation":[31],"on":[32],"threshold":[33,55],"voltage":[34],"is":[35],"analyzed.":[36],"Then,":[37],"delay":[39,78,100],"logic":[41,59],"gate":[42,60],"change":[45,53,97],"subthreshold":[47,80,107],"current":[48,81],"are":[49,64],"deduced":[50],"from":[51],"voltage.":[56],"Finally,":[57],"ISCAS85":[62],"circuit":[63,94,99],"simulated":[65],"by":[66,105],"HSPICE":[67],"in":[68],"PTM":[69],"45nm":[70],"model.":[71],"Simulation":[72],"results":[73],"show":[74],"relationship":[76],"between":[77],"with":[82],"time,":[84],"which":[85],"can":[86,101],"be":[87,102],"used":[88],"to":[89],"predict":[90],"degradation":[92],"parameters.":[95],"The":[96],"quickly":[103],"monitored":[104],"measuring":[106],"current.":[108]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}