{"id":"https://openalex.org/W3004784361","doi":"https://doi.org/10.1109/asicon47005.2019.8983546","title":"A 0.9/1.8/2.4GHz-reconfigurable LNA with Inductor and Capacitor Tuning for IoT Application in 65nm CMOS","display_name":"A 0.9/1.8/2.4GHz-reconfigurable LNA with Inductor and Capacitor Tuning for IoT Application in 65nm CMOS","publication_year":2019,"publication_date":"2019-10-01","ids":{"openalex":"https://openalex.org/W3004784361","doi":"https://doi.org/10.1109/asicon47005.2019.8983546","mag":"3004784361"},"language":"en","primary_location":{"id":"doi:10.1109/asicon47005.2019.8983546","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983546","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064229348","display_name":"Xinpeng Xing","orcid":"https://orcid.org/0000-0002-5535-9577"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I3131625388","display_name":"University Town of Shenzhen","ror":"https://ror.org/05f5j6225","country_code":"CN","type":"education","lineage":["https://openalex.org/I3131625388"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xinpeng Xing","raw_affiliation_strings":["Graduate School at Shenzhen, Tsinghua University,Shenzhen,China,518055","Graduate School at Shenzhen, Tsinghua University, Shenzhen, China"],"affiliations":[{"raw_affiliation_string":"Graduate School at Shenzhen, Tsinghua University,Shenzhen,China,518055","institution_ids":["https://openalex.org/I3131625388","https://openalex.org/I99065089"]},{"raw_affiliation_string":"Graduate School at Shenzhen, Tsinghua University, Shenzhen, China","institution_ids":["https://openalex.org/I3131625388","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053370045","display_name":"Pengyi Cao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pengyi Cao","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052172658","display_name":"Haigang Feng","orcid":"https://orcid.org/0000-0002-8377-1171"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I3131625388","display_name":"University Town of Shenzhen","ror":"https://ror.org/05f5j6225","country_code":"CN","type":"education","lineage":["https://openalex.org/I3131625388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haigang Feng","raw_affiliation_strings":["Graduate School at Shenzhen, Tsinghua University,Shenzhen,China,518055","Graduate School at Shenzhen, Tsinghua University, Shenzhen, China"],"affiliations":[{"raw_affiliation_string":"Graduate School at Shenzhen, Tsinghua University,Shenzhen,China,518055","institution_ids":["https://openalex.org/I3131625388","https://openalex.org/I99065089"]},{"raw_affiliation_string":"Graduate School at Shenzhen, Tsinghua University, Shenzhen, China","institution_ids":["https://openalex.org/I3131625388","https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100356864","display_name":"Zhihua Wang","orcid":"https://orcid.org/0000-0001-6567-0759"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhihua Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University,Beijing,China,100084","Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5064229348"],"corresponding_institution_ids":["https://openalex.org/I3131625388","https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.1623391,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.8329936265945435},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.829592227935791},{"id":"https://openalex.org/keywords/internet-of-things","display_name":"Internet of Things","score":0.6268855929374695},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.6145155429840088},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4691675305366516},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4544014632701874},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3561030626296997},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2765924632549286},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1822611689567566},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.12316262722015381}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.8329936265945435},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.829592227935791},{"id":"https://openalex.org/C81860439","wikidata":"https://www.wikidata.org/wiki/Q251212","display_name":"Internet of Things","level":2,"score":0.6268855929374695},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.6145155429840088},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4691675305366516},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4544014632701874},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3561030626296997},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2765924632549286},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1822611689567566},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.12316262722015381}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/asicon47005.2019.8983546","is_oa":false,"landing_page_url":"https://doi.org/10.1109/asicon47005.2019.8983546","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 13th International Conference on ASIC (ASICON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.9100000262260437,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1824449396","https://openalex.org/W1983449932","https://openalex.org/W2070049670","https://openalex.org/W2083740551","https://openalex.org/W2288839938","https://openalex.org/W2517483045","https://openalex.org/W2753147044","https://openalex.org/W2783841678","https://openalex.org/W6638360437","https://openalex.org/W6696290426"],"related_works":["https://openalex.org/W2027630214","https://openalex.org/W2048093852","https://openalex.org/W2798896958","https://openalex.org/W2165645320","https://openalex.org/W4386264909","https://openalex.org/W3013760104","https://openalex.org/W2229772108","https://openalex.org/W4391036621","https://openalex.org/W2109445684","https://openalex.org/W2081082331"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,17,114],"0.9/1.8/2.4GHz-reconfigurable":[4],"low":[5],"noise":[6,90],"amplifier":[7],"(LNA)":[8],"for":[9],"IoT":[10],"applications.":[11],"An":[12],"input":[13,98],"transformer":[14],"consisting":[15],"of":[16,70],"primary":[18],"coil":[19],"and":[20,49,61,88,96,102],"two":[21],"secondary":[22],"coils":[23],"is":[24,40,59,111],"proposed":[25,42,57],"in":[26,33,63],"the":[27,45,81,97],"LNA":[28,58,83,108],"to":[29,43],"ensure":[30],"impedance":[31],"matching":[32],"three":[34],"bands.":[35],"Mutual":[36],"inductance":[37,46],"enhancement":[38],"scheme":[39],"also":[41],"boost":[44],"Q":[47],"value":[48],"improve":[50],"circuit":[51],"performance":[52],"without":[53],"power":[54,109,116],"overhead.":[55],"The":[56,76,94,107],"designed":[60],"simulated":[62],"TSMC":[64],"65nm":[65],"CMOS":[66],"with":[67],"an":[68],"area":[69],"1.32mm":[71],"<sup":[72],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[73],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[74],".":[75],"post-layout":[77],"simulations":[78],"show":[79],"that":[80],"presented":[82],"achieves":[84],"14.5/16/17.5dB":[85],"voltage":[86],"gain":[87],"2.8/2.5/2.0dB":[89],"figure":[91],"at":[92,104],"0.9/1.8/2.4GHz.":[93],"S11":[95],"P1dB":[99],"are":[100],"-8.8/-11/-9.6dB":[101],"-11/-17/-19dBm":[103],"0.9/1.8/2.4GHz":[105],"respectively.":[106],"consumption":[110],"4mW":[112],"from":[113],"1.2V":[115],"supply.":[117]},"counts_by_year":[{"year":2023,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}