{"id":"https://openalex.org/W2058358179","doi":"https://doi.org/10.1109/54.808196","title":"Technology for IP reuse and portability","display_name":"Technology for IP reuse and portability","publication_year":1999,"publication_date":"1999-01-01","ids":{"openalex":"https://openalex.org/W2058358179","doi":"https://doi.org/10.1109/54.808196","mag":"2058358179"},"language":"en","primary_location":{"id":"doi:10.1109/54.808196","is_oa":false,"landing_page_url":"https://doi.org/10.1109/54.808196","pdf_url":null,"source":{"id":"https://openalex.org/S73404582","display_name":"IEEE Design & Test of Computers","issn_l":"0740-7475","issn":["0740-7475","1558-1918"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test of Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027522214","display_name":"T. Thomas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154792","display_name":"Virtual Technology (United States)","ror":"https://ror.org/054grzz74","country_code":"US","type":"company","lineage":["https://openalex.org/I4210154792"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"T. Thomas","raw_affiliation_strings":["Virtual Silicon Technology","Virtual Silicon Technol. Inc., Sunnyvale, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Virtual Silicon Technology","institution_ids":["https://openalex.org/I4210154792"]},{"raw_affiliation_string":"Virtual Silicon Technol. Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210154792"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5027522214"],"corresponding_institution_ids":["https://openalex.org/I4210154792"],"apc_list":null,"apc_paid":null,"fwci":1.8669,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.84750617,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"16","issue":"4","first_page":"7","last_page":"13"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.848800003528595,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.848800003528595,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10624","display_name":"Silicon and Solar Cell Technologies","score":0.7699000239372253,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.7630000114440918,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reuse","display_name":"Reuse","score":0.850351095199585},{"id":"https://openalex.org/keywords/software-portability","display_name":"Software portability","score":0.7674487829208374},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.552534282207489},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.5457583665847778},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.5327223539352417},{"id":"https://openalex.org/keywords/time-to-market","display_name":"Time to market","score":0.4997975826263428},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4817540645599365},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.4429779052734375},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.43823009729385376},{"id":"https://openalex.org/keywords/intellectual-property","display_name":"Intellectual property","score":0.42905646562576294},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.39009255170822144},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.38386255502700806},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.19082295894622803}],"concepts":[{"id":"https://openalex.org/C206588197","wikidata":"https://www.wikidata.org/wiki/Q846574","display_name":"Reuse","level":2,"score":0.850351095199585},{"id":"https://openalex.org/C63000827","wikidata":"https://www.wikidata.org/wiki/Q3080428","display_name":"Software portability","level":2,"score":0.7674487829208374},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.552534282207489},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.5457583665847778},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.5327223539352417},{"id":"https://openalex.org/C2779229675","wikidata":"https://www.wikidata.org/wiki/Q445235","display_name":"Time to market","level":2,"score":0.4997975826263428},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4817540645599365},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4429779052734375},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.43823009729385376},{"id":"https://openalex.org/C34974158","wikidata":"https://www.wikidata.org/wiki/Q131257","display_name":"Intellectual property","level":2,"score":0.42905646562576294},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.39009255170822144},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38386255502700806},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.19082295894622803},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C548081761","wikidata":"https://www.wikidata.org/wiki/Q180388","display_name":"Waste management","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/54.808196","is_oa":false,"landing_page_url":"https://doi.org/10.1109/54.808196","pdf_url":null,"source":{"id":"https://openalex.org/S73404582","display_name":"IEEE Design & Test of Computers","issn_l":"0740-7475","issn":["0740-7475","1558-1918"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test of Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6399999856948853,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2410366623","https://openalex.org/W2146154997","https://openalex.org/W2150084438","https://openalex.org/W2542547697","https://openalex.org/W2607447167","https://openalex.org/W2100322987","https://openalex.org/W1498721867","https://openalex.org/W1583557603","https://openalex.org/W2108827571","https://openalex.org/W2183741735"],"abstract_inverted_index":{"Discusses":[0],"the":[1,14,35,54,65],"value":[2],"of":[3,10,39,67],"reuse":[4,62],"from":[5],"a":[6],"system":[7],"house's":[8],"point":[9],"view":[11],"and":[12,22,37,41,52,63],"outlines":[13],"industry":[15],"challenges":[16],"caused":[17],"by":[18],"shorter":[19],"time":[20],"frames":[21],"increased":[23],"complexities.":[24],"The":[25],"author":[26],"has":[27],"spent":[28],"close":[29],"to":[30,34,59],"30":[31],"years":[32],"dedicated":[33],"design":[36,43,51],"use":[38],"silicon":[40,50],"related":[42],"methodologies.":[44],"He":[45],"pioneered":[46],"standard-cell":[47],"libraries":[48],"for":[49],"introduced":[53],"customer-owned":[55],"tooling":[56],"(COT)":[57],"flow":[58],"enable":[60],"component":[61],"control":[64],"movement":[66],"intellectual":[68],"property.":[69]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}