{"id":"https://openalex.org/W2120149280","doi":"https://doi.org/10.1109/5.915376","title":"Interconnect limits on gigascale integration (GSI) in the 21st century","display_name":"Interconnect limits on gigascale integration (GSI) in the 21st century","publication_year":2001,"publication_date":"2001-03-01","ids":{"openalex":"https://openalex.org/W2120149280","doi":"https://doi.org/10.1109/5.915376","mag":"2120149280"},"language":"en","primary_location":{"id":"doi:10.1109/5.915376","is_oa":false,"landing_page_url":"https://doi.org/10.1109/5.915376","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101674529","display_name":"Jeffrey A. Davis","orcid":"https://orcid.org/0000-0001-8849-6933"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"J.A. Davis","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080582358","display_name":"V. Ramakrishnan","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Venkatesan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006941049","display_name":"A. E. Kaloyeros","orcid":"https://orcid.org/0009-0009-7370-5363"},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Kaloyeros","raw_affiliation_strings":["Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA","[Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA]"],"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"[Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA]","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035207629","display_name":"M. Beylansky","orcid":null},"institutions":[{"id":"https://openalex.org/I392282","display_name":"University at Albany, State University of New York","ror":"https://ror.org/012zs8222","country_code":"US","type":"education","lineage":["https://openalex.org/I392282"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Beylansky","raw_affiliation_strings":["Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA","[Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA]"],"affiliations":[{"raw_affiliation_string":"Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA","institution_ids":["https://openalex.org/I392282"]},{"raw_affiliation_string":"[Center for Advanced Thin Film Technology Department of Physics, State University of New York, Albany, NY, USA]","institution_ids":["https://openalex.org/I392282"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088221384","display_name":"S.J. Souri","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S.J. Souri","raw_affiliation_strings":["Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075851236","display_name":"Kaustav Banerjee","orcid":"https://orcid.org/0000-0001-5344-0921"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Banerjee","raw_affiliation_strings":["Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065754731","display_name":"Krishna C. Saraswat","orcid":"https://orcid.org/0000-0003-1894-6315"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K.C. Saraswat","raw_affiliation_strings":["Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of Stanford, Stanford, CA, USA","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"[Department of Electrical Engineering, University of Stanford, Stanford, CA, USA]","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111876274","display_name":"Arif Rahman","orcid":"https://orcid.org/0000-0002-6115-9870"},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Rahman","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA","Dept. of Electrical Engineering & Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Dept. of Electrical Engineering & Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA","institution_ids":["https://openalex.org/I63966007"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085687046","display_name":"R. Reif","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Reif","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041468877","display_name":"J.D. Meindl","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.D. Meindl","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5101674529"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":37.8677,"has_fulltext":false,"cited_by_count":510,"citation_normalized_percentile":{"value":0.99899436,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":98,"max":100},"biblio":{"volume":"89","issue":"3","first_page":"305","last_page":"324"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.8018158674240112},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.5162534713745117},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.4921347498893738},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.4716184437274933},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4473968744277954},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4457041323184967},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3972129821777344},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2935773432254791},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.25842392444610596},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.18879792094230652},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.18125560879707336},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.10131755471229553}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8018158674240112},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.5162534713745117},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.4921347498893738},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.4716184437274933},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4473968744277954},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4457041323184967},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3972129821777344},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2935773432254791},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.25842392444610596},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.18879792094230652},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.18125560879707336},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10131755471229553},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/5.915376","is_oa":false,"landing_page_url":"https://doi.org/10.1109/5.915376","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8199999928474426,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":47,"referenced_works":["https://openalex.org/W1502068584","https://openalex.org/W1513140202","https://openalex.org/W1533690373","https://openalex.org/W1556480701","https://openalex.org/W1593627329","https://openalex.org/W1603767330","https://openalex.org/W1816385972","https://openalex.org/W1872673121","https://openalex.org/W1907380980","https://openalex.org/W1970296212","https://openalex.org/W1982945044","https://openalex.org/W1995174375","https://openalex.org/W1995875735","https://openalex.org/W1999161909","https://openalex.org/W2005226599","https://openalex.org/W2005815402","https://openalex.org/W2008527609","https://openalex.org/W2012804698","https://openalex.org/W2013125835","https://openalex.org/W2024625835","https://openalex.org/W2026328359","https://openalex.org/W2028954821","https://openalex.org/W2036347478","https://openalex.org/W2040255651","https://openalex.org/W2054972379","https://openalex.org/W2059204735","https://openalex.org/W2079432774","https://openalex.org/W2088258348","https://openalex.org/W2105412309","https://openalex.org/W2108368155","https://openalex.org/W2111050606","https://openalex.org/W2116382776","https://openalex.org/W2120062652","https://openalex.org/W2120714605","https://openalex.org/W2124013960","https://openalex.org/W2126970815","https://openalex.org/W2133863299","https://openalex.org/W2142992648","https://openalex.org/W2143016004","https://openalex.org/W2146306637","https://openalex.org/W2150471110","https://openalex.org/W2168506183","https://openalex.org/W2172100210","https://openalex.org/W2532146322","https://openalex.org/W3039083618","https://openalex.org/W4285751802","https://openalex.org/W4299506498"],"related_works":["https://openalex.org/W2347486132","https://openalex.org/W2350340797","https://openalex.org/W2079984045","https://openalex.org/W4293224283","https://openalex.org/W2316789606","https://openalex.org/W2950501077","https://openalex.org/W2368601041","https://openalex.org/W2582182843","https://openalex.org/W2360060283","https://openalex.org/W2744119985"],"abstract_inverted_index":{"Twenty-first":[0],"century":[1],"opportunities":[2],"for":[3,137,210],"GSI":[4],"will":[5],"be":[6],"governed":[7],"in":[8,62,145,167,220],"part":[9],"by":[10,72,116,123,152],"a":[11],"hierarchy":[12],"of":[13,37,95,133,179,188,201,207,223],"physical":[14],"limits":[15,30],"on":[16],"interconnects":[17,97],"whose":[18],"levels":[19,135],"are":[20,31,70,172],"codified":[21],"as":[22],"fundamental,":[23],"material,":[24],"device,":[25],"circuit,":[26],"and":[27,40,50,76,82,91,170,212],"system.":[28],"Fundamental":[29],"derived":[32],"from":[33],"the":[34,54,57,80,128,131,154,177,199,205,214,228],"basic":[35],"axioms":[36],"electromagnetic,":[38],"communication,":[39],"thermodynamic":[41],"theories,":[42],"which":[43,190],"immutably":[44],"restrict":[45],"interconnect":[46,85,89,103,196,221],"performance,":[47],"energy":[48],"dissipation,":[49],"noise":[51],"reduction.":[52],"At":[53,79,127],"material":[55],"level,":[56,84,130],"conductor":[58],"resistivity":[59],"increases":[60,88,114],"substantially":[61],"sub-50-nm":[63],"technology":[64],"due":[65],"to":[66,100,118,174,193,225],"scattering":[67],"mechanisms":[68],"that":[69,106,121,143,151,165],"controlled":[71],"quantum":[73],"mechanical":[74],"phenomena":[75],"structural/morphological":[77],"effects.":[78],"device":[81],"circuit":[83],"scaling":[86,94],"significantly":[87,157,194],"crosstalk":[90,115],"latency.":[92],"Reverse":[93],"global":[96],"causes":[98],"inductance":[99,113],"influence":[101],"on-chip":[102],"transients":[104],"such":[105,150],"even":[107],"with":[108,176],"ideal":[109],"return":[110],"paths,":[111],"mutual":[112],"up":[117,224],"60%":[119],"over":[120],"predicted":[122],"conventional":[124],"RC":[125],"models.":[126],"system":[129],"number":[132,155,200],"metal":[134],"explodes":[136],"highly":[138],"connected":[139],"2-D":[140],"logic":[141],"megacells":[142],"double":[144],"size":[146],"every":[147],"two":[148],"years":[149],"2014":[153],"is":[156,185,191],"larger":[158],"than":[159],"ITRS":[160],"projections.":[161],"This":[162],"result":[163],"emphasizes":[164],"changes":[166],"design,":[168],"technology,":[169],"architecture":[171],"needed":[173],"cope":[175],"onslaught":[178],"wiring":[180,215],"demands.":[181],"One":[182],"potential":[183],"solution":[184],"3-D":[186],"integration":[187],"transistors,":[189],"expected":[192],"improve":[195],"performance.":[197],"Increasing":[198],"active":[202],"layers,":[203],"including":[204],"use":[206],"separate":[208],"layers":[209],"repeaters,":[211],"optimizing":[213],"network,":[216],"yields":[217],"an":[218],"improvement":[219],"performance":[222],"145%":[226],"at":[227],"50-nm":[229],"node.":[230]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":12},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":14},{"year":2018,"cited_by_count":11},{"year":2017,"cited_by_count":20},{"year":2016,"cited_by_count":10},{"year":2015,"cited_by_count":12},{"year":2014,"cited_by_count":17},{"year":2013,"cited_by_count":22},{"year":2012,"cited_by_count":31}],"updated_date":"2026-03-09T08:58:05.943551","created_date":"2025-10-10T00:00:00"}