{"id":"https://openalex.org/W2152399433","doi":"https://doi.org/10.1109/4.726545","title":"A 2.6-GByte/s multipurpose chip-to-chip interface","display_name":"A 2.6-GByte/s multipurpose chip-to-chip interface","publication_year":1998,"publication_date":"1998-01-01","ids":{"openalex":"https://openalex.org/W2152399433","doi":"https://doi.org/10.1109/4.726545","mag":"2152399433"},"language":"en","primary_location":{"id":"doi:10.1109/4.726545","is_oa":false,"landing_page_url":"https://doi.org/10.1109/4.726545","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074012261","display_name":"Brian Lau","orcid":"https://orcid.org/0000-0001-8615-8244"},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"B. Lau","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054468568","display_name":"Yiu-Fai Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiu-Fai Chan","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085149070","display_name":"A. Moncayo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Moncayo","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026089519","display_name":"J. Ho","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Ho","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108364163","display_name":"M.J. Allen","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Allen","raw_affiliation_strings":["Intel Corporation, Folsom, CA, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Folsom, CA, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044798152","display_name":"J. Salmon","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Salmon","raw_affiliation_strings":["Intel Corporation, Folsom, CA, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Folsom, CA, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030310932","display_name":"J. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Liu","raw_affiliation_strings":["Intel Corporation, Folsom, CA, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Folsom, CA, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067779049","display_name":"M. Muthal","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Muthal","raw_affiliation_strings":["Intel Corporation, Santa Clara, CA, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078984669","display_name":"C. Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Lee","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113352189","display_name":"T. Nguyen","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Nguyen","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040482821","display_name":"Bryce Horine","orcid":"https://orcid.org/0000-0002-4092-5134"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Horine","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109523865","display_name":"Michael Leddige","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Leddige","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024877253","display_name":"Kuojim Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kuojim Huang","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051536708","display_name":"J. Wei","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Wei","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036430035","display_name":"Leung Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Leung Yu","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069598295","display_name":"R. Tarver","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Tarver","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111967262","display_name":"Y. Hsia","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuwen Hsia","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111459321","display_name":"R. Vu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Vu","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040396965","display_name":"F. Tsern","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Tsern","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089520488","display_name":"Haw-Jyh Liaw","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Haw-Jyh Liaw","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003525351","display_name":"John Hudson","orcid":"https://orcid.org/0000-0001-8153-6859"},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Hudson","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074111688","display_name":"Du Van Nguyen","orcid":"https://orcid.org/0000-0002-3431-9322"},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Nguyen","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091386568","display_name":"Kevin Donnelly","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Donnelly","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080732445","display_name":"R. Crisp","orcid":null},"institutions":[{"id":"https://openalex.org/I4210095722","display_name":"Rambus (United States)","ror":"https://ror.org/00pn5a327","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095722"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Crisp","raw_affiliation_strings":["Rambus, Inc., Mountain View, CA, USA"],"affiliations":[{"raw_affiliation_string":"Rambus, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210095722"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":24,"corresponding_author_ids":["https://openalex.org/A5074012261"],"corresponding_institution_ids":["https://openalex.org/I4210095722"],"apc_list":null,"apc_paid":null,"fwci":3.6599,"has_fulltext":false,"cited_by_count":24,"citation_normalized_percentile":{"value":0.92921312,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"33","issue":"11","first_page":"1617","last_page":"1626"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/megabit","display_name":"Megabit","score":0.7423151731491089},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6211179494857788},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5845593214035034},{"id":"https://openalex.org/keywords/byte","display_name":"Byte","score":0.543747067451477},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5390950441360474},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.4719865620136261},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.4686058759689331},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.459343284368515},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4139256775379181},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.410595178604126},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33012354373931885},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.259986937046051},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.14806631207466125},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11756348609924316}],"concepts":[{"id":"https://openalex.org/C185177783","wikidata":"https://www.wikidata.org/wiki/Q3332814","display_name":"Megabit","level":2,"score":0.7423151731491089},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6211179494857788},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5845593214035034},{"id":"https://openalex.org/C43364308","wikidata":"https://www.wikidata.org/wiki/Q8799","display_name":"Byte","level":2,"score":0.543747067451477},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5390950441360474},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4719865620136261},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4686058759689331},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.459343284368515},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4139256775379181},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.410595178604126},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33012354373931885},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.259986937046051},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.14806631207466125},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11756348609924316},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/4.726545","is_oa":false,"landing_page_url":"https://doi.org/10.1109/4.726545","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.46000000834465027}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1522886908","https://openalex.org/W2009275112","https://openalex.org/W2109331676","https://openalex.org/W2172683575","https://openalex.org/W4239480297"],"related_works":["https://openalex.org/W2155719671","https://openalex.org/W3148726441","https://openalex.org/W2469229085","https://openalex.org/W1983214964","https://openalex.org/W2467408428","https://openalex.org/W2020139811","https://openalex.org/W2542548909","https://openalex.org/W1552191932","https://openalex.org/W2138592424","https://openalex.org/W2082547827"],"abstract_inverted_index":{"A":[0],"2.6":[1],"GByte/s":[2],"megacell":[3],"that":[4],"interfaces":[5],"to":[6,29,42],"single":[7],"or":[8,13],"double":[9],"byte":[10],"wide":[11],"DRAMs":[12],"logic":[14],"chips":[15],"is":[16],"implemented":[17],"using":[18],"0.35-0.18":[19],"/spl":[20],"mu/m":[21],"CMOS":[22],"technologies.":[23],"Special":[24],"I/O":[25],"circuits":[26],"are":[27,40],"used":[28,41],"guarantee":[30],"800":[31],"Mbit/s/pin":[32],"data":[33],"rate.":[34],"Microwave":[35],"PC":[36],"board":[37],"design":[38],"methodologies":[39],"achieve":[43],"the":[44],"maximum":[45],"possible":[46],"interconnect":[47],"bandwidth.":[48]},"counts_by_year":[{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}