{"id":"https://openalex.org/W2077141649","doi":"https://doi.org/10.1109/3dic.2013.6702371","title":"Front to backside alignment for TSV based 3D integration","display_name":"Front to backside alignment for TSV based 3D integration","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2077141649","doi":"https://doi.org/10.1109/3dic.2013.6702371","mag":"2077141649"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702371","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702371","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050745632","display_name":"Frank Windrich","orcid":"https://orcid.org/0000-0002-9466-0514"},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Frank Windrich","raw_affiliation_strings":["Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany","institution_ids":["https://openalex.org/I4210134425"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017659235","display_name":"Andreas Schenke","orcid":null},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Schenke","raw_affiliation_strings":["Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany","institution_ids":["https://openalex.org/I4210134425"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5050745632"],"corresponding_institution_ids":["https://openalex.org/I4210134425"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.13037863,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8471264839172363},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.7216066122055054},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7200175523757935},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7107968926429749},{"id":"https://openalex.org/keywords/overlay","display_name":"Overlay","score":0.6545385718345642},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.640724778175354},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6058686971664429},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5467190146446228},{"id":"https://openalex.org/keywords/photoresist","display_name":"Photoresist","score":0.503802478313446},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.45105046033859253},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.444579154253006},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4424852132797241},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.42596665024757385},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.38928282260894775},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3511274456977844},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.3123640716075897},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.29151415824890137},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1755458116531372},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14609354734420776}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8471264839172363},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.7216066122055054},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7200175523757935},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7107968926429749},{"id":"https://openalex.org/C136085584","wikidata":"https://www.wikidata.org/wiki/Q910289","display_name":"Overlay","level":2,"score":0.6545385718345642},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.640724778175354},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6058686971664429},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5467190146446228},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.503802478313446},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.45105046033859253},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.444579154253006},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4424852132797241},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.42596665024757385},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.38928282260894775},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3511274456977844},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.3123640716075897},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.29151415824890137},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1755458116531372},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14609354734420776},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic.2013.6702371","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702371","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/382734","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/382734","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5400000214576721}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321114","display_name":"Bundesministerium f\u00fcr Bildung und Forschung","ror":"https://ror.org/04pz7b180"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1487731552","https://openalex.org/W1562925848","https://openalex.org/W1998798479","https://openalex.org/W2022127004","https://openalex.org/W2147115611","https://openalex.org/W2158907876","https://openalex.org/W6991516741"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2011182927","https://openalex.org/W2310189477","https://openalex.org/W2333804548","https://openalex.org/W2543304869","https://openalex.org/W2047315796","https://openalex.org/W2010609468","https://openalex.org/W2136838099","https://openalex.org/W2019002696","https://openalex.org/W2896557720"],"abstract_inverted_index":{"The":[0,113,136,158],"demand":[1],"of":[2,25,131,170],"smaller":[3],"form":[4],"factors,":[5],"multifunctional":[6],"microelectronics":[7],"and":[8,16,40,43,79,106,123,145],"thereby":[9],"the":[10,19,23,124,140,146,163,168],"need":[11],"for":[12,22,84,101,139,182],"improved":[13],"electrical":[14],"performance":[15],"reliability":[17],"is":[18,57,180],"key":[20],"driver":[21],"development":[24],"3D":[26,90],"technologies":[27,78],"with":[28,96],"through":[29,34,120],"silicon":[30,35,121],"vias":[31,122],"(TSV).":[32],"Different":[33],"via":[36,62,64,67,108],"approaches":[37],"are":[38,82,111],"available":[39,76],"have":[41],"pros":[42],"cons":[44],"regarding":[45],"process":[46],"integration.":[47],"But":[48],"in":[49],"any":[50],"case":[51],"a":[52,61,97,102,107,129],"front":[53,85],"to":[54,86,153],"backside":[55,87,142,148,177],"alignment":[56,77,88,165,178],"necessary":[58],"regardless":[59],"if":[60],"first,":[63],"middle":[65],"or":[66],"last":[68,109],"approach":[69,110],"has":[70],"been":[71],"chosen.":[72],"This":[73],"paper":[74],"discusses":[75],"strategies":[80],"which":[81],"needed":[83],"on":[89,176],"TSV":[91,144],"integration":[92],"examples.":[93],"Alignment":[94],"results":[95],"300mm":[98],"mask":[99],"aligner":[100],"2.5D":[103],"interposer":[104,184],"application":[105],"shown.":[112],"top":[114],"side":[115],"overlay":[116,137],"accuracy":[117,138,179],"between":[118,143],"filled":[119],"next":[125],"photoresist":[126,149],"layer":[127,150],"showed":[128],"variation":[130],"3\u03c3":[132,154],"=":[133,155],"1.7":[134],"\u03bcm.":[135,157],"wafer":[141,171],"first":[147],"was":[151,160],"doubled":[152],"3.4":[156],"difference":[159],"caused":[161],"by":[162],"used":[164],"method.":[166],"Furthermore":[167],"influence":[169],"deformation":[172],"(warpage":[173],"/":[174],"bow)":[175],"discussed":[181],"an":[183],"application.":[185]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}