{"id":"https://openalex.org/W2019300773","doi":"https://doi.org/10.1109/3dic.2013.6702352","title":"Design of 60 GHz contactless probe system for RDL in passive silicon interposer","display_name":"Design of 60 GHz contactless probe system for RDL in passive silicon interposer","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2019300773","doi":"https://doi.org/10.1109/3dic.2013.6702352","mag":"2019300773"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702352","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702352","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5054607255","display_name":"Edward J. Suh","orcid":null},"institutions":[{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Edward J. Suh","raw_affiliation_strings":["Electrical and Computer Engineering, North Carolina State University, Raleigh, NC","Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, North Carolina State University, Raleigh, NC","institution_ids":["https://openalex.org/I137902535"]},{"raw_affiliation_string":"Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA","institution_ids":["https://openalex.org/I137902535"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074605796","display_name":"Paul D. Franzon","orcid":"https://orcid.org/0000-0002-6048-5770"},"institutions":[{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul D Franzon","raw_affiliation_strings":["Electrical and Computer Engineering, North Carolina State University, Raleigh, NC","Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering, North Carolina State University, Raleigh, NC","institution_ids":["https://openalex.org/I137902535"]},{"raw_affiliation_string":"Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA","institution_ids":["https://openalex.org/I137902535"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5054607255"],"corresponding_institution_ids":["https://openalex.org/I137902535"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08567565,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"31","issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.6922522187232971},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.6667917966842651},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.6347774863243103},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.6267816424369812},{"id":"https://openalex.org/keywords/ground-plane","display_name":"Ground plane","score":0.587035059928894},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5566909313201904},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5395476222038269},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5331007242202759},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.5078473687171936},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.39204496145248413},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.37301337718963623},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.23292216658592224},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.21450528502464294},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17899146676063538},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.17002415657043457},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.11501893401145935},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.08853897452354431}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6922522187232971},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.6667917966842651},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6347774863243103},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.6267816424369812},{"id":"https://openalex.org/C88764893","wikidata":"https://www.wikidata.org/wiki/Q1547722","display_name":"Ground plane","level":3,"score":0.587035059928894},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5566909313201904},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5395476222038269},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5331007242202759},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.5078473687171936},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.39204496145248413},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.37301337718963623},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.23292216658592224},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.21450528502464294},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17899146676063538},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.17002415657043457},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.11501893401145935},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08853897452354431},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702352","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702352","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1520110107","https://openalex.org/W1848632088","https://openalex.org/W1990828594","https://openalex.org/W1992107520","https://openalex.org/W2033638245","https://openalex.org/W2094077523","https://openalex.org/W2107398534","https://openalex.org/W2147294417","https://openalex.org/W4285719527","https://openalex.org/W6638714153","https://openalex.org/W6658955145"],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2768092448","https://openalex.org/W2895758062","https://openalex.org/W2048683560","https://openalex.org/W2044770004","https://openalex.org/W1966070768","https://openalex.org/W1994341348","https://openalex.org/W2953512238","https://openalex.org/W2217967073","https://openalex.org/W4387574169"],"abstract_inverted_index":{"A":[0,79,96],"probe":[1,21,69],"design":[2],"for":[3],"detecting":[4],"discontinuities":[5],"of":[6,46,66,98,111,126],"a":[7,23,30,122],"redistribution":[8],"layer":[9],"(RDL)":[10],"on":[11,29],"TSV":[12],"silicon":[13],"interposer":[14],"is":[15,22],"presented":[16],"in":[17,55],"this":[18],"paper.":[19],"The":[20,43,61],"60":[24],"GHz":[25],"contactless":[26,68],"system":[27],"based":[28],"quarter-wavelength":[31],"directional":[32],"coupler,":[33],"using":[34],"the":[35,67,99,109,112,127,132],"capacitive":[36],"coupling":[37,106],"effects":[38,107],"between":[39],"two":[40,104],"signal":[41,52,102,130],"traces.":[42],"probes":[44],"consists":[45],"one":[47,51],"ground":[48],"plane":[49],"and":[50,64,75,124,134],"trace":[53],"embedded":[54],"BCB,":[56],"low":[57],"dielectric":[58],"constant":[59],"insulator.":[60],"length,":[62],"width,":[63],"thickness":[65],"are":[70],"749.3":[71],"um,":[72,74,77],"100.584":[73],"10.414":[76],"respectively.":[78,138],"time-domain":[80],"reflectometery":[81],"(TDR)":[82],"pulse":[83],"with":[84],"10":[85],"ps":[86],"rise":[87],"time":[88],"makes":[89],"it":[90],"possible":[91],"to":[92],"obtain":[93],"high":[94],"resolution.":[95],"variation":[97],"probe's":[100,128],"TDR":[101,129],"through":[103],"capacitance":[105],"indicates":[108],"location":[110],"open":[113,133],"or":[114],"short":[115,135],"circuit":[116,136],"fault":[117],"where":[118],"RDL":[119],"has.":[120],"Reaching":[121],"peak":[123],"dip":[125],"represents":[131],"sites,":[137]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}