{"id":"https://openalex.org/W2085412167","doi":"https://doi.org/10.1109/3dic.2013.6702330","title":"Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits","display_name":"Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W2085412167","doi":"https://doi.org/10.1109/3dic.2013.6702330","mag":"2085412167"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2013.6702330","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702330","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048147021","display_name":"Yann Civale","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Yann Civale","raw_affiliation_strings":["Dow Corning Europe S.A., Parc Industriel Zone C, Seneffe, Belgium","Dow Corning Eur. S.A., Seneffe, Belgium"],"affiliations":[{"raw_affiliation_string":"Dow Corning Europe S.A., Parc Industriel Zone C, Seneffe, Belgium","institution_ids":[]},{"raw_affiliation_string":"Dow Corning Eur. S.A., Seneffe, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060149780","display_name":"H. Meynen","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Herman Meynen","raw_affiliation_strings":["Dow Corning Europe S.A., Parc Industriel Zone C, Seneffe, Belgium","Dow Corning Eur. S.A., Seneffe, Belgium"],"affiliations":[{"raw_affiliation_string":"Dow Corning Europe S.A., Parc Industriel Zone C, Seneffe, Belgium","institution_ids":[]},{"raw_affiliation_string":"Dow Corning Eur. S.A., Seneffe, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110912843","display_name":"Ranjith John","orcid":null},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]},{"id":"https://openalex.org/I179059509","display_name":"Dow Chemical (Japan)","ror":"https://ror.org/041y80p71","country_code":"JP","type":"company","lineage":["https://openalex.org/I179059509","https://openalex.org/I4210133143"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Ranjith S. E. John","raw_affiliation_strings":["Dow Corning Corporation, Midland, MI, USA","Dow\u2010Corning Corp., Midland, MI, USA"],"affiliations":[{"raw_affiliation_string":"Dow Corning Corporation, Midland, MI, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"Dow\u2010Corning Corp., Midland, MI, USA","institution_ids":["https://openalex.org/I179059509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102218533","display_name":"Pengfei Fu","orcid":"https://orcid.org/0009-0000-9834-3295"},"institutions":[{"id":"https://openalex.org/I179059509","display_name":"Dow Chemical (Japan)","ror":"https://ror.org/041y80p71","country_code":"JP","type":"company","lineage":["https://openalex.org/I179059509","https://openalex.org/I4210133143"]},{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Peng-Fei Fu","raw_affiliation_strings":["Dow Corning Corporation, Midland, MI, USA","Dow\u2010Corning Corp., Midland, MI, USA"],"affiliations":[{"raw_affiliation_string":"Dow Corning Corporation, Midland, MI, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"Dow\u2010Corning Corp., Midland, MI, USA","institution_ids":["https://openalex.org/I179059509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082287429","display_name":"Craig Yeakle","orcid":null},"institutions":[{"id":"https://openalex.org/I179059509","display_name":"Dow Chemical (Japan)","ror":"https://ror.org/041y80p71","country_code":"JP","type":"company","lineage":["https://openalex.org/I179059509","https://openalex.org/I4210133143"]},{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Craig R. Yeakle","raw_affiliation_strings":["Dow Corning Corporation, Midland, MI, USA","Dow\u2010Corning Corp., Midland, MI, USA"],"affiliations":[{"raw_affiliation_string":"Dow Corning Corporation, Midland, MI, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"Dow\u2010Corning Corp., Midland, MI, USA","institution_ids":["https://openalex.org/I179059509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100371311","display_name":"Sheng Wang","orcid":"https://orcid.org/0000-0003-2605-2768"},"institutions":[{"id":"https://openalex.org/I179059509","display_name":"Dow Chemical (Japan)","ror":"https://ror.org/041y80p71","country_code":"JP","type":"company","lineage":["https://openalex.org/I179059509","https://openalex.org/I4210133143"]},{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Sheng Wang","raw_affiliation_strings":["Dow Corning Corporation, Midland, MI, USA","Dow\u2010Corning Corp., Midland, MI, USA"],"affiliations":[{"raw_affiliation_string":"Dow Corning Corporation, Midland, MI, USA","institution_ids":["https://openalex.org/I1338503839"]},{"raw_affiliation_string":"Dow\u2010Corning Corp., Midland, MI, USA","institution_ids":["https://openalex.org/I179059509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018241122","display_name":"Stefan Krausse","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165638","display_name":"SUSS MicroTec (Germany)","ror":"https://ror.org/05vcgwf09","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210165638"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Stefan Krausse","raw_affiliation_strings":["Suss Microtec Lithography GmbH, Sternenfels, Germany","SUSS MicroTec Lithography GmbH,Sternenfels,Germany"],"affiliations":[{"raw_affiliation_string":"Suss Microtec Lithography GmbH, Sternenfels, Germany","institution_ids":["https://openalex.org/I4210165638"]},{"raw_affiliation_string":"SUSS MicroTec Lithography GmbH,Sternenfels,Germany","institution_ids":["https://openalex.org/I4210165638"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043559550","display_name":"Thomas Rapps","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165638","display_name":"SUSS MicroTec (Germany)","ror":"https://ror.org/05vcgwf09","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210165638"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thomas Rapps","raw_affiliation_strings":["Suss Microtec Lithography GmbH, Sternenfels, Germany","SUSS MicroTec Lithography GmbH,Sternenfels,Germany"],"affiliations":[{"raw_affiliation_string":"Suss Microtec Lithography GmbH, Sternenfels, Germany","institution_ids":["https://openalex.org/I4210165638"]},{"raw_affiliation_string":"SUSS MicroTec Lithography GmbH,Sternenfels,Germany","institution_ids":["https://openalex.org/I4210165638"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082450358","display_name":"Stefan Lutter","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165638","display_name":"SUSS MicroTec (Germany)","ror":"https://ror.org/05vcgwf09","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210165638"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Stefan Lutter","raw_affiliation_strings":["Suss Microtec Lithography GmbH, Sternenfels, Germany","SUSS MicroTec Lithography GmbH,Sternenfels,Germany"],"affiliations":[{"raw_affiliation_string":"Suss Microtec Lithography GmbH, Sternenfels, Germany","institution_ids":["https://openalex.org/I4210165638"]},{"raw_affiliation_string":"SUSS MicroTec Lithography GmbH,Sternenfels,Germany","institution_ids":["https://openalex.org/I4210165638"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5048147021"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.13663218,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9929999709129333,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9890999794006348,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7992265224456787},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.6422240734100342},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5717897415161133},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5526797771453857},{"id":"https://openalex.org/keywords/adhesive-bonding","display_name":"Adhesive bonding","score":0.5451161861419678},{"id":"https://openalex.org/keywords/coating","display_name":"Coating","score":0.5383449792861938},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.5377820134162903},{"id":"https://openalex.org/keywords/silicone","display_name":"Silicone","score":0.5265793204307556},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.519513726234436},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.501554012298584},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.44329774379730225},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.42997485399246216},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.42198652029037476},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.34883272647857666},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22339758276939392},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.21493753790855408},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.09756699204444885},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.0749412477016449}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7992265224456787},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.6422240734100342},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5717897415161133},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5526797771453857},{"id":"https://openalex.org/C2779278059","wikidata":"https://www.wikidata.org/wiki/Q352525","display_name":"Adhesive bonding","level":4,"score":0.5451161861419678},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5383449792861938},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.5377820134162903},{"id":"https://openalex.org/C2779769944","wikidata":"https://www.wikidata.org/wiki/Q146439","display_name":"Silicone","level":2,"score":0.5265793204307556},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.519513726234436},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.501554012298584},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.44329774379730225},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.42997485399246216},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.42198652029037476},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.34883272647857666},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22339758276939392},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.21493753790855408},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.09756699204444885},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0749412477016449},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2013.6702330","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2013.6702330","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4300000071525574,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2017915771","https://openalex.org/W2020859763","https://openalex.org/W2025100454","https://openalex.org/W2036193138","https://openalex.org/W2137349419","https://openalex.org/W2146531121","https://openalex.org/W2154133941","https://openalex.org/W2167848093","https://openalex.org/W2169924167"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2333804548","https://openalex.org/W4399621287","https://openalex.org/W1968957853","https://openalex.org/W4780431"],"abstract_inverted_index":{"Dow":[0,57,126],"Corning":[1,58,127],"developed":[2],"a":[3,40,110,133,144],"silicone-based":[4],"room":[5,49],"temperature":[6,50],"temporary":[7,128],"bonding":[8,51,70,79,129],"and":[9,21,52,71,80,83,105,121,130,149],"mechanical":[10,53],"debonding":[11,72,81,131],"solution":[12,135],"to":[13,107],"overcome":[14],"the":[15,37,56,89,101,117,125,137,140],"current":[16],"limitations":[17],"of":[18,26,39,91,139,147],"existing":[19],"materials":[20],"processes":[22],"for":[23,84,143],"next":[24],"generation":[25],"2.5D":[27,148],"&":[28],"3D":[29,150],"IC":[30],"packages;":[31],"The":[32,94],"material":[33,46],"properties":[34],"make":[35,124],"possible":[36],"use":[38],"simple":[41],"process":[42,103],"sequence":[43,119],"which":[44],"includes":[45],"spin":[47],"coating,":[48],"debonding.":[54],"Whereas":[55],"bi-layer":[59],"approach":[60,132],"has":[61],"been":[62],"reported":[63,96],"recently":[64],"[1],":[65],"this":[66,98],"study":[67],"focuses":[68],"on":[69],"performance":[73],"obtained":[74],"with":[75,109],"SUSS":[76],"MicroTec":[77],"automated":[78],"equipment":[82],"adhesive":[85],"layer":[86],"thickness":[87],"in":[88,97],"range":[90,146],"100":[92],"\u03bcm.":[93],"results":[95],"study,":[99],"particularly":[100],"good":[102],"control":[104],"ability":[106],"debond":[108],"low":[111],"force":[112],"(<;30":[113],"N)":[114],"while":[115],"keeping":[116],"overall":[118],"short":[120],"thus":[122],"cost-effective,":[123],"versatile":[134],"towards":[136],"validation":[138],"TSV":[141],"technology":[142],"wide":[145],"stacked":[151],"ICs":[152],"applications.":[153]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-02-25T23:00:34.991745","created_date":"2025-10-10T00:00:00"}