{"id":"https://openalex.org/W2047489005","doi":"https://doi.org/10.1109/3dic.2012.6262944","title":"3D stacking using Cu-Cu direct bonding","display_name":"3D stacking using Cu-Cu direct bonding","publication_year":2012,"publication_date":"2012-01-01","ids":{"openalex":"https://openalex.org/W2047489005","doi":"https://doi.org/10.1109/3dic.2012.6262944","mag":"2047489005"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2012.6262944","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262944","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101300200","display_name":"Y. H. Hu","orcid":null},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]},{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE","US"],"is_corresponding":false,"raw_author_name":"Y. H. Hu","raw_affiliation_strings":["TSMC assignee at IMEC","TSMC assignee, IMEC, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC assignee at IMEC","institution_ids":["https://openalex.org/I1334877674"]},{"raw_affiliation_string":"TSMC assignee, IMEC, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111546847","display_name":"C. S. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. S. Liu","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074390581","display_name":"Mirng-Ji Lii","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"M. J. Lii","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063785314","display_name":"Kenneth June Rebibis","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"K. J. Rebibis","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061504157","display_name":"Anne Jourdain","orcid":"https://orcid.org/0000-0002-5741-3020"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"A. Jourdain","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071223809","display_name":"Antonio Manna","orcid":"https://orcid.org/0000-0001-9776-3300"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"A. L. Manna","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112402799","display_name":"Gerald Beyer","orcid":"https://orcid.org/0009-0009-6367-3046"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"G. Beyer","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"E. Beyne","raw_affiliation_strings":["IMEC, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108758641","display_name":"C. H. Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. H. Yu","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":9,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.9993,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.78737564,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8141301274299622},{"id":"https://openalex.org/keywords/bumping","display_name":"Bumping","score":0.8041778802871704},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6516493558883667},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6265533566474915},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6084157228469849},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5660859942436218},{"id":"https://openalex.org/keywords/scanning-electron-microscope","display_name":"Scanning electron microscope","score":0.5362541079521179},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5292529463768005},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.5260255932807922},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5224838852882385},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5142549872398376},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.48568663001060486},{"id":"https://openalex.org/keywords/delamination","display_name":"Delamination (geology)","score":0.47847339510917664},{"id":"https://openalex.org/keywords/thermocompression-bonding","display_name":"Thermocompression bonding","score":0.46409836411476135},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36695873737335205},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2537907660007477},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.23088794946670532},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.19874578714370728}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8141301274299622},{"id":"https://openalex.org/C2776512755","wikidata":"https://www.wikidata.org/wiki/Q632543","display_name":"Bumping","level":2,"score":0.8041778802871704},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6516493558883667},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6265533566474915},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6084157228469849},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5660859942436218},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.5362541079521179},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5292529463768005},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.5260255932807922},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5224838852882385},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5142549872398376},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.48568663001060486},{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.47847339510917664},{"id":"https://openalex.org/C201845621","wikidata":"https://www.wikidata.org/wiki/Q1111341","display_name":"Thermocompression bonding","level":3,"score":0.46409836411476135},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36695873737335205},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2537907660007477},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.23088794946670532},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.19874578714370728},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/3dic.2012.6262944","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2012.6262944","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1979542923","https://openalex.org/W2032281090","https://openalex.org/W2057259846","https://openalex.org/W6658708280"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2090223096","https://openalex.org/W4385893376","https://openalex.org/W3211414309","https://openalex.org/W1490391629","https://openalex.org/W2085087240","https://openalex.org/W4242763231","https://openalex.org/W2073815131","https://openalex.org/W1991554466"],"abstract_inverted_index":{"Cu-Cu":[0,87,187],"bonding":[1,88],"provides":[2],"advantages":[3],"such":[4],"as":[5,34],"cost":[6],"effective":[7],"process,":[8],"fine":[9],"pitch,":[10],"and":[11,32,38,48,69,106,173],"low":[12],"resistance":[13],"to":[14,57,112,119,142],"advanced":[15],"3D":[16,20,84],"IC":[17],"technology.":[18],"For":[19],"stacking,":[21],"TSV":[22,149],"Cu":[23],"nail":[24,99,117],"can":[25],"be":[26],"revealed":[27],"by":[28,89],"wafer":[29],"backside":[30],"process":[31,43],"used":[33,141],"interconnect":[35],"between":[36,176],"top":[37],"bottom":[39],"die.":[40],"No":[41,102],"extra":[42],"like":[44],"RDL":[45],"(Re-Distribution":[46],"Layer)":[47],"bumping":[49],"are":[50,110,151],"required,":[51],"thus,":[52],"\u03bcbump":[53],"pitch":[54,131],"is":[55,62,140,166],"equivalent":[56],"TSVs":[58,98,124,164],"pitch.":[59],"Further":[60],"there":[61],"no":[63],"inter-metallic":[64],"compound":[65],"(IMC)":[66],"layer":[67],"formation":[68],"thus":[70],"improve":[71],"the":[72,80,114],"mechanical":[73],"reliability.":[74],"In":[75],"this":[76],"work,":[77],"we":[78,179],"report":[79],"results":[81],"achieved":[82],"for":[83,163,183],"staking":[85],"with":[86,128],"using":[90],"TCB":[91,121],"(Thermal":[92],"Compression":[93],"Bonding)":[94],"process.":[95],"Three":[96],"different":[97],"structures":[100,118],"named":[101],"Nail,":[103],"Flat":[104],"Surface,":[105],"Dome":[107],"Shape,":[108],"respectively":[109],"choose":[111],"study":[113],"impact":[115],"of":[116,132,170],"various":[120],"conditions.":[122],"The":[123],"have":[125],"5\u03bcm":[126],"diameter":[127],"a":[129,159],"minimum":[130],"10\u03bcm.":[133],"Cross":[134],"section":[135],"SEM":[136],"(Scanning":[137],"Electron":[138],"Microscope)":[139],"identify":[143],"interface-bonding":[144],"qualities.":[145],"Electrical":[146],"characterizations":[147],"on":[148,155,186],"chains":[150],"also":[152],"performed.":[153],"Based":[154],"above":[156],"specifics":[157],"results,":[158],"best":[160],"performing":[161],"structure":[162],"nails":[165],"selected":[167],"in":[168],"term":[169],"electrical":[171],"connections":[172],"good":[174],"adhesions":[175],"dies.":[177],"Finally,":[178],"propose":[180],"some":[181],"suggestions":[182],"future":[184],"work":[185],"bonding.":[188]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}