{"id":"https://openalex.org/W1973683980","doi":"https://doi.org/10.1109/3dic.2010.5751459","title":"3D system on chip memory interface based on modeled capacitive coupling interconnections","display_name":"3D system on chip memory interface based on modeled capacitive coupling interconnections","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W1973683980","doi":"https://doi.org/10.1109/3dic.2010.5751459","mag":"1973683980"},"language":"en","primary_location":{"id":"doi:10.1109/3dic.2010.5751459","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751459","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025943165","display_name":"M. Scandiuzzo","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"M. Scandiuzzo","raw_affiliation_strings":["ARCES, University of Bologna, Italy","ARCES - University of Bologna, Italy#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]},{"raw_affiliation_string":"ARCES - University of Bologna, Italy#TAB#","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049036865","display_name":"R. Cardu","orcid":null},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","IT"],"is_corresponding":false,"raw_author_name":"R. Cardu","raw_affiliation_strings":["STMicroelectronics, Agrate-Brianza, Italy","STMicroelectronics - Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate-Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics - Agrate Brianza, Italy","institution_ids":["https://openalex.org/I131827901"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013835073","display_name":"S. Cani","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"S. Cani","raw_affiliation_strings":["ARCES, University of Bologna, Italy","ARCES - University of Bologna, Italy#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]},{"raw_affiliation_string":"ARCES - University of Bologna, Italy#TAB#","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040636999","display_name":"S. Spolzino","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"S. Spolzino","raw_affiliation_strings":["ARCES, University of Bologna, Italy","ARCES - University of Bologna, Italy#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]},{"raw_affiliation_string":"ARCES - University of Bologna, Italy#TAB#","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109974823","display_name":"L. Perugini","orcid":null},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"L. Perugini","raw_affiliation_strings":["ARCES, University of Bologna, Italy","ARCES - University of Bologna, Italy#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]},{"raw_affiliation_string":"ARCES - University of Bologna, Italy#TAB#","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112425045","display_name":"E. Franchi","orcid":null},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","IT"],"is_corresponding":false,"raw_author_name":"E. Franchi","raw_affiliation_strings":["STMicroelectronics, Agrate-Brianza, Italy","STMicroelectronics - Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate-Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics - Agrate Brianza, Italy","institution_ids":["https://openalex.org/I131827901"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044201884","display_name":"R. Canegallo","orcid":"https://orcid.org/0000-0002-3381-0697"},"institutions":[{"id":"https://openalex.org/I9360294","display_name":"University of Bologna","ror":"https://ror.org/01111rn36","country_code":"IT","type":"education","lineage":["https://openalex.org/I9360294"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"R. Canegallo","raw_affiliation_strings":["ARCES, University of Bologna, Italy","ARCES - University of Bologna, Italy#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ARCES, University of Bologna, Italy","institution_ids":["https://openalex.org/I9360294"]},{"raw_affiliation_string":"ARCES - University of Bologna, Italy#TAB#","institution_ids":["https://openalex.org/I9360294"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040667886","display_name":"R. Guerrieri","orcid":"https://orcid.org/0000-0002-8601-6884"},"institutions":[{"id":"https://openalex.org/I131827901","display_name":"STMicroelectronics (Switzerland)","ror":"https://ror.org/00wm3b005","country_code":"CH","type":"company","lineage":["https://openalex.org/I131827901"]},{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["CH","IT"],"is_corresponding":false,"raw_author_name":"R. Guerrieri","raw_affiliation_strings":["STMicroelectronics, Agrate-Brianza, Italy","STMicroelectronics - Agrate Brianza, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Agrate-Brianza, Italy","institution_ids":["https://openalex.org/I4210154781"]},{"raw_affiliation_string":"STMicroelectronics - Agrate Brianza, Italy","institution_ids":["https://openalex.org/I131827901"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5885,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.70137187,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9918000102043152,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.7521244287490845},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6774966716766357},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6183909177780151},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6138507127761841},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.6033705472946167},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5391263365745544},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5348303318023682},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.48941102623939514},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.47516319155693054},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.21668708324432373},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19870266318321228},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.18372973799705505},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1707375943660736},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08715566992759705}],"concepts":[{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.7521244287490845},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6774966716766357},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6183909177780151},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6138507127761841},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.6033705472946167},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5391263365745544},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5348303318023682},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.48941102623939514},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.47516319155693054},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.21668708324432373},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19870266318321228},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.18372973799705505},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1707375943660736},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08715566992759705},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/3dic.2010.5751459","is_oa":false,"landing_page_url":"https://doi.org/10.1109/3dic.2010.5751459","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","raw_type":"proceedings-article"},{"id":"pmh:oai:cris.unibo.it:11585/97465","is_oa":false,"landing_page_url":"http://hdl.handle.net/11585/97465","pdf_url":null,"source":{"id":"https://openalex.org/S4306402579","display_name":"Archivio istituzionale della ricerca (Alma Mater Studiorum Universit\u00e0 di Bologna)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4210117483","host_organization_name":"Istituto di Ematologia di Bologna","host_organization_lineage":["https://openalex.org/I4210117483"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8999999761581421}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1489597939","https://openalex.org/W1538352461","https://openalex.org/W1569021891","https://openalex.org/W2019629963","https://openalex.org/W2023264348","https://openalex.org/W2025980530","https://openalex.org/W2057259846","https://openalex.org/W2060337673","https://openalex.org/W2076133809","https://openalex.org/W2089090919","https://openalex.org/W2111732008","https://openalex.org/W2114264455","https://openalex.org/W2120427739","https://openalex.org/W2127687175","https://openalex.org/W2130238922","https://openalex.org/W2139730616","https://openalex.org/W2144062734","https://openalex.org/W2159163292","https://openalex.org/W2166984288","https://openalex.org/W2170305090","https://openalex.org/W2172281986","https://openalex.org/W2175000298","https://openalex.org/W2295688064","https://openalex.org/W3146284279","https://openalex.org/W6634003223","https://openalex.org/W6655493159","https://openalex.org/W6679429058","https://openalex.org/W6680835552","https://openalex.org/W6681051133"],"related_works":["https://openalex.org/W3014521742","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4386230336","https://openalex.org/W4306968100","https://openalex.org/W2171986175","https://openalex.org/W2089791793","https://openalex.org/W2065289416","https://openalex.org/W2017236304","https://openalex.org/W2136854845"],"abstract_inverted_index":{"A":[0],"memory":[1,61],"interface":[2,46,62],"for":[3,38],"a":[4,64],"3D":[5,26,60],"System-on-a-Chip":[6,57],"based":[7],"on":[8],"capacitive":[9,36],"coupling":[10,37],"is":[11],"implemented":[12],"in":[13,54],"90nm":[14],"CMOS":[15],"technology.":[16],"The":[17,31,45,59],"design":[18],"choices":[19],"have":[20],"been":[21],"driven":[22],"by":[23],"an":[24,55,70,77],"innovative":[25],"extraction":[27],"and":[28,76],"simulation":[29],"flow.":[30],"presented":[32],"work":[33],"exploits":[34],"AC":[35],"chip-to-chip":[39],"communication":[40],"running":[41],"up":[42],"to":[43],"250MHz.":[44],"transfers":[47],"128":[48],"bit":[49],"words":[50],"between":[51],"stacked":[52],"SRAMs":[53],"ARM-based":[56],"(SoC).":[58],"achieves":[63],"total":[65],"throughput":[66],"of":[67,74,80],"32Gbit/sec":[68],"with":[69],"average":[71],"energy":[72],"consumption":[73],"35\u03bcW/Gbit/sec":[75],"area":[78],"occupancy":[79],"0.05mm":[81],"<sup":[82],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[83],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[84],".":[85]},"counts_by_year":[{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}