{"id":"https://openalex.org/W7125604251","doi":"https://doi.org/10.1109/wsc68292.2025.11338867","title":"Real-Time Metrology Capacity Optimization in Semiconductor Manufacturing","display_name":"Real-Time Metrology Capacity Optimization in Semiconductor Manufacturing","publication_year":2025,"publication_date":"2025-12-07","ids":{"openalex":"https://openalex.org/W7125604251","doi":"https://doi.org/10.1109/wsc68292.2025.11338867"},"language":null,"primary_location":{"id":"doi:10.1109/wsc68292.2025.11338867","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc68292.2025.11338867","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5123755718","display_name":"Mathis Martin","orcid":null},"institutions":[{"id":"https://openalex.org/I3019848993","display_name":"Mines Saint-\u00c9tienne","ror":"https://ror.org/05a1dws80","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264","https://openalex.org/I205703379","https://openalex.org/I3019848993"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Mathis Martin","raw_affiliation_strings":["Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France","institution_ids":["https://openalex.org/I3019848993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123766811","display_name":"St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s","orcid":null},"institutions":[{"id":"https://openalex.org/I3019848993","display_name":"Mines Saint-\u00c9tienne","ror":"https://ror.org/05a1dws80","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264","https://openalex.org/I205703379","https://openalex.org/I3019848993"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"St\u00e9phane Dauz\u00e8re-P\u00e9r\u00e8s","raw_affiliation_strings":["Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France","institution_ids":["https://openalex.org/I3019848993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084485824","display_name":"Claude Yugma","orcid":"https://orcid.org/0000-0001-7749-0480"},"institutions":[{"id":"https://openalex.org/I3019848993","display_name":"Mines Saint-\u00c9tienne","ror":"https://ror.org/05a1dws80","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264","https://openalex.org/I205703379","https://openalex.org/I3019848993"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Claude Yugma","raw_affiliation_strings":["Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mines Saint-Étienne, Univ. Clermont Auvergne,Gardanne,France","institution_ids":["https://openalex.org/I3019848993"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5115591115","display_name":"Aymen Mili","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Aymen Mili","raw_affiliation_strings":["STMicroelectronics,Crolles,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics,Crolles,France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091191136","display_name":"Renaud Roussel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Renaud Roussel","raw_affiliation_strings":["STMicroelectronics,Crolles,France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics,Crolles,France","institution_ids":["https://openalex.org/I4210104693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1664","last_page":"1675"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.21449999511241913,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.21449999511241913,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.1168999969959259,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.04190000146627426,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/metrology","display_name":"Metrology","score":0.6536999940872192},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5271999835968018},{"id":"https://openalex.org/keywords/manufacturing-process","display_name":"Manufacturing process","score":0.35260000824928284},{"id":"https://openalex.org/keywords/capacity-planning","display_name":"Capacity planning","score":0.2994000017642975}],"concepts":[{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.6536999940872192},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5271999835968018},{"id":"https://openalex.org/C2987875673","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing process","level":2,"score":0.35260000824928284},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3513999879360199},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.31709998846054077},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.31360000371932983},{"id":"https://openalex.org/C2781007418","wikidata":"https://www.wikidata.org/wiki/Q1456934","display_name":"Capacity planning","level":2,"score":0.2994000017642975},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2802000045776367},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.26930001378059387},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2578999996185303}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc68292.2025.11338867","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc68292.2025.11338867","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5056042671203613,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2020460778","https://openalex.org/W2103117824","https://openalex.org/W2151186428","https://openalex.org/W2950584441","https://openalex.org/W2968212577","https://openalex.org/W3148425971","https://openalex.org/W3157589894","https://openalex.org/W4295250553","https://openalex.org/W4312198874","https://openalex.org/W4377089140","https://openalex.org/W4392882583"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2026-01-25T00:00:00"}