{"id":"https://openalex.org/W4406612375","doi":"https://doi.org/10.1109/wsc63780.2024.10838987","title":"Spline Interpolation-Based Multi-Scale Model for Etching in a Chlorine-Argon Inductively Coupled Plasma","display_name":"Spline Interpolation-Based Multi-Scale Model for Etching in a Chlorine-Argon Inductively Coupled Plasma","publication_year":2024,"publication_date":"2024-12-15","ids":{"openalex":"https://openalex.org/W4406612375","doi":"https://doi.org/10.1109/wsc63780.2024.10838987"},"language":"en","primary_location":{"id":"doi:10.1109/wsc63780.2024.10838987","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc63780.2024.10838987","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083434497","display_name":"Lado Filipovic","orcid":"https://orcid.org/0000-0003-1687-5058"},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Lado Filipovic","raw_affiliation_strings":["CDL for Multi-Scale Process Modeling of Semiconductor Devices and Sensors at the Institute for Microelectronics, TU Wien,Vienna,Austria,1040"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CDL for Multi-Scale Process Modeling of Semiconductor Devices and Sensors at the Institute for Microelectronics, TU Wien,Vienna,Austria,1040","institution_ids":["https://openalex.org/I145847075"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101742175","display_name":"Tobias Reiter","orcid":"https://orcid.org/0000-0002-5638-9129"},"institutions":[{"id":"https://openalex.org/I145847075","display_name":"TU Wien","ror":"https://ror.org/04d836q62","country_code":"AT","type":"education","lineage":["https://openalex.org/I145847075"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Tobias Reiter","raw_affiliation_strings":["CDL for Multi-Scale Process Modeling of Semiconductor Devices and Sensors at the Institute for Microelectronics, TU Wien,Vienna,Austria,1040"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CDL for Multi-Scale Process Modeling of Semiconductor Devices and Sensors at the Institute for Microelectronics, TU Wien,Vienna,Austria,1040","institution_ids":["https://openalex.org/I145847075"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I145847075"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.39375788,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1907","last_page":"1918"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10781","display_name":"Plasma Diagnostics and Applications","score":0.8192999958992004,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10781","display_name":"Plasma Diagnostics and Applications","score":0.8192999958992004,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10173","display_name":"Computational Fluid Dynamics and Aerodynamics","score":0.7562000155448914,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11751","display_name":"Lattice Boltzmann Simulation Studies","score":0.6949999928474426,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductively-coupled-plasma","display_name":"Inductively coupled plasma","score":0.7712235450744629},{"id":"https://openalex.org/keywords/argon","display_name":"Argon","score":0.646575927734375},{"id":"https://openalex.org/keywords/interpolation","display_name":"Interpolation (computer graphics)","score":0.5890209674835205},{"id":"https://openalex.org/keywords/spline","display_name":"Spline (mechanical)","score":0.5503586530685425},{"id":"https://openalex.org/keywords/chlorine","display_name":"Chlorine","score":0.5425087213516235},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5015795230865479},{"id":"https://openalex.org/keywords/spline-interpolation","display_name":"Spline interpolation","score":0.4505137801170349},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.4179079532623291},{"id":"https://openalex.org/keywords/plasma","display_name":"Plasma","score":0.4001098871231079},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3971579670906067},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37532898783683777},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.34134167432785034},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.29043814539909363},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1608276665210724},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.14052227139472961},{"id":"https://openalex.org/keywords/atomic-physics","display_name":"Atomic physics","score":0.13579535484313965},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12433567643165588},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1125042736530304},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.07909685373306274},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.07467725872993469},{"id":"https://openalex.org/keywords/nuclear-physics","display_name":"Nuclear physics","score":0.0735081136226654},{"id":"https://openalex.org/keywords/environmental-chemistry","display_name":"Environmental chemistry","score":0.065694659948349},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.058153361082077026}],"concepts":[{"id":"https://openalex.org/C95974651","wikidata":"https://www.wikidata.org/wiki/Q2454436","display_name":"Inductively coupled plasma","level":3,"score":0.7712235450744629},{"id":"https://openalex.org/C547737533","wikidata":"https://www.wikidata.org/wiki/Q696","display_name":"Argon","level":2,"score":0.646575927734375},{"id":"https://openalex.org/C137800194","wikidata":"https://www.wikidata.org/wiki/Q11713455","display_name":"Interpolation (computer graphics)","level":3,"score":0.5890209674835205},{"id":"https://openalex.org/C10390562","wikidata":"https://www.wikidata.org/wiki/Q581809","display_name":"Spline (mechanical)","level":2,"score":0.5503586530685425},{"id":"https://openalex.org/C505241676","wikidata":"https://www.wikidata.org/wiki/Q688","display_name":"Chlorine","level":2,"score":0.5425087213516235},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5015795230865479},{"id":"https://openalex.org/C31447003","wikidata":"https://www.wikidata.org/wiki/Q545002","display_name":"Spline interpolation","level":3,"score":0.4505137801170349},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.4179079532623291},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.4001098871231079},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3971579670906067},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37532898783683777},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.34134167432785034},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.29043814539909363},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1608276665210724},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.14052227139472961},{"id":"https://openalex.org/C184779094","wikidata":"https://www.wikidata.org/wiki/Q26383","display_name":"Atomic physics","level":1,"score":0.13579535484313965},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12433567643165588},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1125042736530304},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.07909685373306274},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.07467725872993469},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.0735081136226654},{"id":"https://openalex.org/C107872376","wikidata":"https://www.wikidata.org/wiki/Q321355","display_name":"Environmental chemistry","level":1,"score":0.065694659948349},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.058153361082077026},{"id":"https://openalex.org/C205203396","wikidata":"https://www.wikidata.org/wiki/Q612143","display_name":"Bilinear interpolation","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C104114177","wikidata":"https://www.wikidata.org/wiki/Q79782","display_name":"Motion (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc63780.2024.10838987","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc63780.2024.10838987","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W153353184","https://openalex.org/W1549773065","https://openalex.org/W1969852806","https://openalex.org/W1979547047","https://openalex.org/W1987856106","https://openalex.org/W1991113069","https://openalex.org/W1992147354","https://openalex.org/W2027523812","https://openalex.org/W2033248441","https://openalex.org/W2044173093","https://openalex.org/W2054610270","https://openalex.org/W2067048626","https://openalex.org/W2068658414","https://openalex.org/W2071653142","https://openalex.org/W2127212879","https://openalex.org/W2164076082","https://openalex.org/W2182773255","https://openalex.org/W2407969995","https://openalex.org/W2535908487","https://openalex.org/W2903196925","https://openalex.org/W3131407763","https://openalex.org/W3196091311","https://openalex.org/W4289782288","https://openalex.org/W4292162315","https://openalex.org/W4309081234","https://openalex.org/W4321353335","https://openalex.org/W4327729665","https://openalex.org/W4388209636","https://openalex.org/W4393321049"],"related_works":["https://openalex.org/W1874930357","https://openalex.org/W1965605760","https://openalex.org/W2089774915","https://openalex.org/W2046026412","https://openalex.org/W2787646063","https://openalex.org/W2002288548","https://openalex.org/W2102842245","https://openalex.org/W4392640306","https://openalex.org/W2057046968","https://openalex.org/W4230334724"],"abstract_inverted_index":{"A":[0],"multi-variable":[1],"spline":[2],"interpolation":[3],"is":[4,30,72,117],"used":[5,73],"in":[6,107],"order":[7],"to":[8,74,88],"quickly":[9],"obtain":[10],"the":[11,43,47,51,55,58,63,66,91,108,122,125,130],"wafer":[12],"incident":[13],"fluxes":[14,95],"from":[15,119,129],"inside":[16],"an":[17],"inductively":[18],"coupled":[19],"plasma":[20,104],"chamber":[21,39,56],"with":[22],"a":[23,34,76,100],"chlorine":[24,59],"and":[25,65,121,136],"argon":[26],"chemistry.":[27],"The":[28,70,94,113],"data":[29,71],"obtained":[31],"by":[32],"performing":[33],"total":[35],"of":[36,82,90],"18":[37],"750":[38],"simulations":[40],"while":[41],"varying":[42],"inputs":[44],"which":[45],"include":[46],"inductive":[48],"coil":[49],"power,":[50],"gas":[52,60],"flow":[53],"rate,":[54],"pressure,":[57],"concentration":[61],"ratio,":[62],"temperature,":[64],"applied":[67],"bias":[68],"voltage.":[69],"generate":[75],"six-dimensional":[77],"hypercube":[78],"for":[79],"each":[80,85],"flux":[81],"interest":[83],"where":[84],"dimension":[86],"corresponds":[87],"one":[89],"varied":[92],"parameters.":[93],"are":[96],"then":[97],"incorporated":[98],"into":[99],"semi-empirical":[101],"feature":[102],"scale":[103],"etching":[105],"model":[106,123],"process":[109],"simulation":[110],"tool":[111],"ViennaPS.":[112],"chemical":[114,131],"sticking":[115],"coefficient":[116],"derived":[118],"measurements":[120],"includes":[124],"etch":[126,132],"rate":[127],"resulting":[128],"component,":[133],"ion":[134],"sputtering,":[135],"ion-enhanced":[137],"etching.":[138]},"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}