{"id":"https://openalex.org/W4255673338","doi":"https://doi.org/10.1109/wsc.2018.8632431","title":"A GENERIC VMI MEASUREMENT AND APPLICATION IN THE SEMICONDUCTOR INDUSTRY","display_name":"A GENERIC VMI MEASUREMENT AND APPLICATION IN THE SEMICONDUCTOR INDUSTRY","publication_year":2018,"publication_date":"2018-12-01","ids":{"openalex":"https://openalex.org/W4255673338","doi":"https://doi.org/10.1109/wsc.2018.8632431"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2018.8632431","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2018.8632431","pdf_url":null,"source":{"id":"https://openalex.org/S4363607834","display_name":"2018 Winter Simulation Conference (WSC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108643318","display_name":"Hans Ehm","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hans Ehm","raw_affiliation_strings":["Infineon Technologies AG, Neubiberg, Bavaria, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, Neubiberg, Bavaria, GERMANY","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051425751","display_name":"Frederic Jankowiak","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Frederic Jankowiak","raw_affiliation_strings":["Infineon Technologies AG, Neubiberg, Bavaria, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, Neubiberg, Bavaria, GERMANY","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037327014","display_name":"Veronika Filser","orcid":null},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Veronika Filser","raw_affiliation_strings":["Infineon Technologies AG, Neubiberg, Bavaria, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, Neubiberg, Bavaria, GERMANY","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103883596","display_name":"Tim Lauer","orcid":"https://orcid.org/0009-0003-1625-1672"},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tim Lauer","raw_affiliation_strings":["Infineon Technologies AG, Neubiberg, Bavaria, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, Neubiberg, Bavaria, GERMANY","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090435705","display_name":"Anh\u2010Tu Nguyen","orcid":"https://orcid.org/0000-0002-9636-3927"},"institutions":[{"id":"https://openalex.org/I103855431","display_name":"HAN University of Applied Sciences","ror":"https://ror.org/0500gea42","country_code":"NL","type":"education","lineage":["https://openalex.org/I103855431"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Anh Nguyen","raw_affiliation_strings":["Hogeschool van Arnhem en Nijmegen, Arnhem, Gelderland, THE NETHERLANDS"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hogeschool van Arnhem en Nijmegen, Arnhem, Gelderland, THE NETHERLANDS","institution_ids":["https://openalex.org/I103855431"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"3449","last_page":"3460"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.7414000034332275,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.7414000034332275,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12692","display_name":"Magnetic Field Sensors Techniques","score":0.6579999923706055,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.6731716990470886},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4482472538948059},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3557301163673401},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21779093146324158}],"concepts":[{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.6731716990470886},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4482472538948059},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3557301163673401},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21779093146324158}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc.2018.8632431","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2018.8632431","pdf_url":null,"source":{"id":"https://openalex.org/S4363607834","display_name":"2018 Winter Simulation Conference (WSC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5699999928474426,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W4391913857","https://openalex.org/W2350741829","https://openalex.org/W4233807266"],"abstract_inverted_index":{"Vendor":[0],"managed":[1],"inventory":[2,25,46],"(VMI)":[3],"is":[4,49,82,97,123],"a":[5,78,86,89,100,106,125],"widespread":[6],"supply":[7],"chain":[8],"collaboration":[9,94],"model.":[10,95],"To":[11],"avoid":[12],"product":[13,59],"shortage":[14],"and":[15,23,62,71,128],"excessive":[16],"stocks,":[17],"various":[18],"measurement":[19,103],"approaches":[20,34],"defining":[21],"minimum":[22],"maximum":[24],"levels":[26],"have":[27],"been":[28],"designed.":[29],"None":[30],"of":[31,39,44,92,124,137],"the":[32,37,42,45,68,135],"known":[33],"take":[35],"up":[36],"aspect":[38],"responsibility":[40],"regarding":[41],"status":[43],"levels.":[47],"This":[48,96],"especially":[50],"important":[51],"in":[52],"industries":[53],"facing":[54],"long":[55],"process":[56,107,116],"times,":[57],"short":[58],"life":[60],"cycles":[61],"volatile":[63],"demand":[64],"patterns,":[65],"such":[66],"as":[67,121],"semiconductor":[69],"industry":[70],"their":[72],"downstream":[73],"customers.":[74],"Within":[75],"this":[76,93],"work,":[77],"VMI":[79,102,139],"classification":[80],"checklist":[81],"established":[83],"to":[84,108,134],"build":[85],"basis":[87],"for":[88,111],"common":[90],"understanding":[91],"followed":[98],"by":[99],"generic":[101],"approach":[104],"including":[105],"assign":[109],"responsibilities":[110],"poor":[112],"performance.":[113],"The":[114],"novel":[115],"distinguishes":[117],"from":[118],"other":[119],"measures,":[120],"it":[122],"bilateral":[126],"nature":[127],"parameters":[129],"can":[130],"be":[131],"fitted":[132],"uniquely":[133],"needs":[136],"different":[138],"partnerships.":[140]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}