{"id":"https://openalex.org/W4233573190","doi":"https://doi.org/10.1109/wsc.2018.8632349","title":"GENERIC DATA MODEL FOR SEMICONDUCTOR MANUFACTURING SUPPLY CHAINS","display_name":"GENERIC DATA MODEL FOR SEMICONDUCTOR MANUFACTURING SUPPLY CHAINS","publication_year":2018,"publication_date":"2018-12-01","ids":{"openalex":"https://openalex.org/W4233573190","doi":"https://doi.org/10.1109/wsc.2018.8632349"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2018.8632349","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2018.8632349","pdf_url":null,"source":{"id":"https://openalex.org/S4363607834","display_name":"2018 Winter Simulation Conference (WSC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5002139281","display_name":"Georg Laipple","orcid":null},"institutions":[{"id":"https://openalex.org/I889804353","display_name":"Robert Bosch (Germany)","ror":"https://ror.org/01fe0jt45","country_code":"DE","type":"company","lineage":["https://openalex.org/I889804353"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Georg Laipple","raw_affiliation_strings":["Robert Bosch GmbH, Reutlingen, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Robert Bosch GmbH, Reutlingen, GERMANY","institution_ids":["https://openalex.org/I889804353"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028102263","display_name":"St\u00e9phane Dauz\u00e8re\u2010P\u00e9r\u00e8s","orcid":"https://orcid.org/0000-0002-3566-3248"},"institutions":[{"id":"https://openalex.org/I3019848993","display_name":"Mines Saint-\u00c9tienne","ror":"https://ror.org/05a1dws80","country_code":"FR","type":"education","lineage":["https://openalex.org/I203339264","https://openalex.org/I205703379","https://openalex.org/I3019848993"]},{"id":"https://openalex.org/I4210099416","display_name":"Laboratoire d'Informatique, de Mod\u00e9lisation et d'Optimisation des Syst\u00e8mes","ror":"https://ror.org/00t3fpp34","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I198244214","https://openalex.org/I198244214","https://openalex.org/I203339264","https://openalex.org/I205703379","https://openalex.org/I3019848993","https://openalex.org/I4210099416","https://openalex.org/I4210123221","https://openalex.org/I4210159245","https://openalex.org/I4387154249"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Stephane Dauzere-Peres","raw_affiliation_strings":["Mines Saint-Etienne, Univ. Clermont Auvergne CNRS, UMR 6158 LIMOS, CMP, Gardanne, FRANCE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mines Saint-Etienne, Univ. Clermont Auvergne CNRS, UMR 6158 LIMOS, CMP, Gardanne, FRANCE","institution_ids":["https://openalex.org/I3019848993","https://openalex.org/I4210099416"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017645849","display_name":"Thomas Ponsignon","orcid":"https://orcid.org/0000-0002-1727-0424"},"institutions":[{"id":"https://openalex.org/I137594350","display_name":"Infineon Technologies (Germany)","ror":"https://ror.org/005kw6t15","country_code":"DE","type":"company","lineage":["https://openalex.org/I137594350"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thomas Ponsignon","raw_affiliation_strings":["Infineon Technologies AG, Neubiberg, GERMANY"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Infineon Technologies AG, Neubiberg, GERMANY","institution_ids":["https://openalex.org/I137594350"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073387018","display_name":"Philippe Vialletelle","orcid":"https://orcid.org/0000-0002-5782-169X"},"institutions":[{"id":"https://openalex.org/I4210094169","display_name":"STMicroelectronics (India)","ror":"https://ror.org/00ft7bw25","country_code":"IN","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210094169"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Philippe Vialletelle","raw_affiliation_strings":["STMicroelectronics, Crolles, FRANCE"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Crolles, FRANCE","institution_ids":["https://openalex.org/I4210094169"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.4457,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.93278464,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"3615","last_page":"3626"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9854999780654907,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9854999780654907,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9851999878883362,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11741","display_name":"Flexible and Reconfigurable Manufacturing Systems","score":0.9839000105857849,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.6940641403198242},{"id":"https://openalex.org/keywords/conceptual-model","display_name":"Conceptual model","score":0.6861517429351807},{"id":"https://openalex.org/keywords/cleanroom","display_name":"Cleanroom","score":0.6640498638153076},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6134432554244995},{"id":"https://openalex.org/keywords/supply-chain","display_name":"Supply chain","score":0.5903523564338684},{"id":"https://openalex.org/keywords/data-modeling","display_name":"Data modeling","score":0.5231529474258423},{"id":"https://openalex.org/keywords/production-planning","display_name":"Production planning","score":0.5020368099212646},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.4913400709629059},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4368320107460022},{"id":"https://openalex.org/keywords/production","display_name":"Production (economics)","score":0.42463287711143494},{"id":"https://openalex.org/keywords/data-model","display_name":"Data model (GIS)","score":0.42106354236602783},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.4003087878227234},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26687920093536377},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.15517309308052063},{"id":"https://openalex.org/keywords/database","display_name":"Database","score":0.1131950318813324},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.10456818342208862},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.099408358335495},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.08676445484161377}],"concepts":[{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.6940641403198242},{"id":"https://openalex.org/C13606891","wikidata":"https://www.wikidata.org/wiki/Q2623243","display_name":"Conceptual model","level":2,"score":0.6861517429351807},{"id":"https://openalex.org/C127094628","wikidata":"https://www.wikidata.org/wiki/Q794827","display_name":"Cleanroom","level":2,"score":0.6640498638153076},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6134432554244995},{"id":"https://openalex.org/C108713360","wikidata":"https://www.wikidata.org/wiki/Q1824206","display_name":"Supply chain","level":2,"score":0.5903523564338684},{"id":"https://openalex.org/C67186912","wikidata":"https://www.wikidata.org/wiki/Q367664","display_name":"Data modeling","level":2,"score":0.5231529474258423},{"id":"https://openalex.org/C2777909354","wikidata":"https://www.wikidata.org/wiki/Q1386523","display_name":"Production planning","level":3,"score":0.5020368099212646},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.4913400709629059},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4368320107460022},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.42463287711143494},{"id":"https://openalex.org/C100463513","wikidata":"https://www.wikidata.org/wiki/Q5227322","display_name":"Data model (GIS)","level":2,"score":0.42106354236602783},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4003087878227234},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26687920093536377},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.15517309308052063},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.1131950318813324},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.10456818342208862},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.099408358335495},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08676445484161377},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc.2018.8632349","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2018.8632349","pdf_url":null,"source":{"id":"https://openalex.org/S4363607834","display_name":"2018 Winter Simulation Conference (WSC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W427288698","https://openalex.org/W1986401175","https://openalex.org/W2532859745","https://openalex.org/W2053663974","https://openalex.org/W2157651641","https://openalex.org/W2766492700","https://openalex.org/W2805929002","https://openalex.org/W2405042200","https://openalex.org/W2152112785","https://openalex.org/W2362290039"],"abstract_inverted_index":{"Semiconductor":[0],"manufacturing":[1,30,44,101],"systems,":[2],"with":[3,122],"several":[4],"hundreds":[5],"of":[6,118,125,137,142],"different":[7],"production":[8,24,56],"steps,":[9],"reentrant":[10],"loops,":[11],"cleanroom":[12],"conditions":[13],"and":[14,26,40,46,128,135],"a":[15,69,81],"job":[16],"shop":[17],"organization,":[18],"are":[19,147],"probably":[20],"the":[21,29,75,105,116,138,143],"most":[22],"complex":[23],"systems":[25,57],"so":[27],"is":[28],"data":[31,71,84,108,145],"structure.":[32],"This":[33,78,110],"high":[34],"complexity":[35],"requires":[36],"precise":[37],"planning,":[38],"modelling":[39,52],"simulation":[41],"to":[42,67],"improve":[43],"transparencies":[45],"avoid":[47],"planning":[48],"inefficiencies.":[49],"Although":[50],"many":[51],"approaches":[53],"for":[54,86],"semiconductor":[55,87,97,100,119],"have":[58],"been":[59,65],"published,":[60],"much":[61],"less":[62],"work":[63],"has":[64],"conducted":[66],"define":[68],"common":[70,82,123],"model":[72,85,111,146],"that":[73],"supports":[74],"industrial":[76],"complexity.":[77],"paper":[79],"presents":[80],"conceptual":[83,107,144],"supply":[88,120],"chains,":[89],"developed":[90],"in":[91],"close":[92],"collaboration":[93],"by":[94],"three":[95],"European":[96],"manufacturers.":[98],"Described":[99],"use":[102],"cases":[103],"motivate":[104],"proposed":[106],"model.":[109],"includes":[112],"master":[113],"entities,":[114,130],"defining":[115],"structure":[117],"chains":[121],"definitions":[124],"key":[126],"elements,":[127],"tracing":[129],"describing":[131],"time":[132],"dependent":[133],"changes":[134],"events":[136],"system.":[139],"Expected":[140],"benefits":[141],"also":[148],"discussed.":[149]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}