{"id":"https://openalex.org/W4255062562","doi":"https://doi.org/10.1109/wsc.2014.7020081","title":"Cloud manufacturing application in semiconductor industry","display_name":"Cloud manufacturing application in semiconductor industry","publication_year":2014,"publication_date":"2014-12-01","ids":{"openalex":"https://openalex.org/W4255062562","doi":"https://doi.org/10.1109/wsc.2014.7020081"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2014.7020081","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2014.7020081","pdf_url":null,"source":{"id":"https://openalex.org/S4363608779","display_name":"Proceedings of the Winter Simulation Conference 2014","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Winter Simulation Conference 2014","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085775609","display_name":"Xinghao Wu","orcid":"https://orcid.org/0000-0002-6987-3972"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xinghao Wu","raw_affiliation_strings":["College of Electronics & Information Engineering, Tongji University, Shanghai, P.R. CHINA"],"affiliations":[{"raw_affiliation_string":"College of Electronics & Information Engineering, Tongji University, Shanghai, P.R. CHINA","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108299588","display_name":"Fei Qiao","orcid":"https://orcid.org/0000-0002-5322-4847"},"institutions":[{"id":"https://openalex.org/I116953780","display_name":"Tongji University","ror":"https://ror.org/03rc6as71","country_code":"CN","type":"education","lineage":["https://openalex.org/I116953780"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fei Qiao","raw_affiliation_strings":["College of Electronics & Information Engineering, Tongji University, Shanghai, P.R. CHINA"],"affiliations":[{"raw_affiliation_string":"College of Electronics & Information Engineering, Tongji University, Shanghai, P.R. CHINA","institution_ids":["https://openalex.org/I116953780"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054472017","display_name":"Kwok Poon","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kwok Poon","raw_affiliation_strings":["Serus Corporation, Santa Clara, CA, USA"],"affiliations":[{"raw_affiliation_string":"Serus Corporation, Santa Clara, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5085775609"],"corresponding_institution_ids":["https://openalex.org/I116953780"],"apc_list":null,"apc_paid":null,"fwci":1.9972,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.90792291,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"2376","last_page":"2383"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9700000286102295,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9358000159263611,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cloud-computing","display_name":"Cloud computing","score":0.7929630279541016},{"id":"https://openalex.org/keywords/cloud-manufacturing","display_name":"Cloud manufacturing","score":0.7912570834159851},{"id":"https://openalex.org/keywords/outsourcing","display_name":"Outsourcing","score":0.7882729768753052},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.6514222025871277},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.6445087790489197},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.6234453916549683},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5943231582641602},{"id":"https://openalex.org/keywords/manufacturing","display_name":"Manufacturing","score":0.5570738315582275},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.4548918902873993},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45242416858673096},{"id":"https://openalex.org/keywords/process-development-execution-system","display_name":"Process development execution system","score":0.45063772797584534},{"id":"https://openalex.org/keywords/advanced-manufacturing","display_name":"Advanced manufacturing","score":0.3855285048484802},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3196168541908264},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.30400216579437256},{"id":"https://openalex.org/keywords/marketing","display_name":"Marketing","score":0.08964172005653381},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.08492442965507507},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.06874603033065796}],"concepts":[{"id":"https://openalex.org/C79974875","wikidata":"https://www.wikidata.org/wiki/Q483639","display_name":"Cloud computing","level":2,"score":0.7929630279541016},{"id":"https://openalex.org/C2778819808","wikidata":"https://www.wikidata.org/wiki/Q5135707","display_name":"Cloud manufacturing","level":3,"score":0.7912570834159851},{"id":"https://openalex.org/C46934059","wikidata":"https://www.wikidata.org/wiki/Q61515","display_name":"Outsourcing","level":2,"score":0.7882729768753052},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.6514222025871277},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.6445087790489197},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.6234453916549683},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5943231582641602},{"id":"https://openalex.org/C175700187","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing","level":2,"score":0.5570738315582275},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.4548918902873993},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45242416858673096},{"id":"https://openalex.org/C201547687","wikidata":"https://www.wikidata.org/wiki/Q7247240","display_name":"Process development execution system","level":3,"score":0.45063772797584534},{"id":"https://openalex.org/C77854861","wikidata":"https://www.wikidata.org/wiki/Q4686346","display_name":"Advanced manufacturing","level":2,"score":0.3855285048484802},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3196168541908264},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.30400216579437256},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.08964172005653381},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08492442965507507},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.06874603033065796},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc.2014.7020081","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2014.7020081","pdf_url":null,"source":{"id":"https://openalex.org/S4363608779","display_name":"Proceedings of the Winter Simulation Conference 2014","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Winter Simulation Conference 2014","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.46000000834465027,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335134","display_name":"National Institutes of Natural Sciences","ror":"https://ror.org/055n47h92"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W27499367","https://openalex.org/W1583938996","https://openalex.org/W1981616524","https://openalex.org/W2028005328","https://openalex.org/W2032465429","https://openalex.org/W2039119838","https://openalex.org/W2045075507","https://openalex.org/W2047910981","https://openalex.org/W2070231578","https://openalex.org/W2085495361","https://openalex.org/W2094012039","https://openalex.org/W2094613725","https://openalex.org/W2137980298","https://openalex.org/W2144809067","https://openalex.org/W2275530856","https://openalex.org/W6601111259","https://openalex.org/W6635206852","https://openalex.org/W6694821995"],"related_works":["https://openalex.org/W2006997784","https://openalex.org/W2088099448","https://openalex.org/W4242034722","https://openalex.org/W2749265467","https://openalex.org/W2079801865","https://openalex.org/W2086281524","https://openalex.org/W2015346596","https://openalex.org/W2919763864","https://openalex.org/W2357131003","https://openalex.org/W2234566255"],"abstract_inverted_index":{"This":[0],"paper":[1],"aims":[2],"to":[3,17,28,33,67],"shed":[4],"some":[5],"light":[6],"on":[7],"how":[8,69],"the":[9,18,26,29,44,52,70,75,78,85],"concept":[10],"of":[11,35,47],"cloud":[12,48,58,71],"manufacturing":[13,20,31,49,72],"has":[14,73],"been":[15],"applied":[16],"semiconductor":[19,30,53,86],"operations.":[21],"It":[22],"starts":[23],"with":[24],"describing":[25],"challenges":[27],"due":[32],"evolving":[34],"outsourcing":[36],"business":[37],"model":[38],"in":[39,84],"global":[40],"context,":[41],"then":[42],"discusses":[43],"different":[45],"forms":[46],"and":[50,80],"proposes":[51],"industry":[54],"oriented":[55],"architecture":[56],"for":[57,77],"manufacturing.":[59],"Serus":[60],"is":[61],"used":[62],"as":[63],"a":[64],"case":[65],"study":[66],"share":[68],"created":[74],"values":[76],"customer":[79],"its":[81],"outsourced":[82],"suppliers":[83],"industry.":[87]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}