{"id":"https://openalex.org/W3144156131","doi":"https://doi.org/10.1109/wsc.2011.6147909","title":"A detailed model for a high-mix low-volume ASIC fab","display_name":"A detailed model for a high-mix low-volume ASIC fab","publication_year":2011,"publication_date":"2011-12-01","ids":{"openalex":"https://openalex.org/W3144156131","doi":"https://doi.org/10.1109/wsc.2011.6147909","mag":"3144156131"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2011.6147909","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2011.6147909","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080693111","display_name":"Mike Gissrau","orcid":null},"institutions":[{"id":"https://openalex.org/I2799978770","display_name":"X-Fab (Germany)","ror":"https://ror.org/030bh9196","country_code":"DE","type":"company","lineage":["https://openalex.org/I2799978770"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Mike Gissrau","raw_affiliation_strings":["X-FAB Dresden GmbH & Company KG, Dresden, Germany"],"affiliations":[{"raw_affiliation_string":"X-FAB Dresden GmbH & Company KG, Dresden, Germany","institution_ids":["https://openalex.org/I2799978770"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110728745","display_name":"Oliver Rose","orcid":null},"institutions":[{"id":"https://openalex.org/I4210165059","display_name":"Hochschule f\u00fcr Technik und Wirtschaft Dresden \u2013 University of Applied Sciences","ror":"https://ror.org/05q5pk319","country_code":"DE","type":"education","lineage":["https://openalex.org/I4210165059"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Oliver Rose","raw_affiliation_strings":["Institute of Applied Computer Science, Dresden University of Technology, Dresden, Germany"],"affiliations":[{"raw_affiliation_string":"Institute of Applied Computer Science, Dresden University of Technology, Dresden, Germany","institution_ids":["https://openalex.org/I4210165059"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5080693111"],"corresponding_institution_ids":["https://openalex.org/I2799978770"],"apc_list":null,"apc_paid":null,"fwci":2.2667,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.9004516,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1948","last_page":"1958"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9815000295639038,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9815000295639038,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9704999923706055,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.963699996471405,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/factory","display_name":"Factory (object-oriented programming)","score":0.8075222969055176},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7116900682449341},{"id":"https://openalex.org/keywords/data-modeling","display_name":"Data modeling","score":0.563232958316803},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5419730544090271},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.5212196111679077},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.483109712600708},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4826553463935852},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46752357482910156},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4462941586971283},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.43391868472099304},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.40874502062797546},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.377934992313385},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.33219635486602783},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.29702550172805786},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2276856005191803},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1634252369403839},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.09997713565826416}],"concepts":[{"id":"https://openalex.org/C40149104","wikidata":"https://www.wikidata.org/wiki/Q5620977","display_name":"Factory (object-oriented programming)","level":2,"score":0.8075222969055176},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7116900682449341},{"id":"https://openalex.org/C67186912","wikidata":"https://www.wikidata.org/wiki/Q367664","display_name":"Data modeling","level":2,"score":0.563232958316803},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5419730544090271},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.5212196111679077},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.483109712600708},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4826553463935852},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46752357482910156},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4462941586971283},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.43391868472099304},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.40874502062797546},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.377934992313385},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.33219635486602783},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.29702550172805786},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2276856005191803},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1634252369403839},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.09997713565826416},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/wsc.2011.6147909","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2011.6147909","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.416.6487","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.416.6487","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.informs-sim.org/wsc11papers/175.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.550000011920929,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1565210221","https://openalex.org/W1992870153","https://openalex.org/W2097984481","https://openalex.org/W2119974213","https://openalex.org/W2169772335","https://openalex.org/W4249800246","https://openalex.org/W4298441116"],"related_works":["https://openalex.org/W2170726572","https://openalex.org/W2146435486","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W2394172622","https://openalex.org/W1594978932","https://openalex.org/W2083418455","https://openalex.org/W2140718007","https://openalex.org/W2025046394"],"abstract_inverted_index":{"Looking":[0],"for":[1],"newimprovement":[2],"options":[3],"such":[4],"as":[5,24,26],"newdispatching":[6],"rules":[7],"of":[8,30,59,78,100],"an":[9],"existing":[10],"semiconductor":[11],"fabrication":[12],"facility,":[13],"a":[14,79],"detailed":[15],"model":[16,91,102],"is":[17,71,97],"indispensable":[18],"to":[19,54],"check":[20],"the":[21,31,36,45,51,55,60,66,76,98,101],"data":[22,52],"quality":[23],"well":[25],"detecting":[27],"main":[28],"influences":[29],"facility":[32],"and":[33,57],"finally":[34],"testing":[35],"new":[37],"optimization":[38],"approaches.":[39],"In":[40,63,83],"this":[41,64],"paper,":[42],"we":[43,85],"describe":[44],"whole":[46],"modeling":[47,67],"process":[48],"starting":[49],"from":[50],"acquisition":[53],"verification":[56],"validation":[58,99],"resulting":[61],"model.":[62],"study,":[65],"tool":[68],"AnyLogic":[69],"6":[70],"used.":[72],"The":[73],"evaluation":[74],"reveals":[75],"importance":[77],"reliable":[80],"factory":[81,105],"database.":[82],"addition,":[84],"show":[86],"first":[87],"ideas":[88],"about":[89],"automated":[90],"generation.":[92],"An":[93],"other":[94],"important":[95],"problem":[96],"against":[103],"real":[104],"performance":[106],"indicators.":[107]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}