{"id":"https://openalex.org/W3139588702","doi":"https://doi.org/10.1109/wsc.2011.6147906","title":"Application of tool science techniques to improve tool efficiency for a dry etch cluster tool","display_name":"Application of tool science techniques to improve tool efficiency for a dry etch cluster tool","publication_year":2011,"publication_date":"2011-12-01","ids":{"openalex":"https://openalex.org/W3139588702","doi":"https://doi.org/10.1109/wsc.2011.6147906","mag":"3139588702"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2011.6147906","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2011.6147906","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013959191","display_name":"Robert M. Havey","orcid":"https://orcid.org/0000-0003-4040-8169"},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert Havey","raw_affiliation_strings":["Micron Technology, Inc., Manassas, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc., Manassas, VA, USA","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100331148","display_name":"Lixin Wang","orcid":"https://orcid.org/0000-0001-9008-169X"},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lixin Wang","raw_affiliation_strings":["Micron Technology, Inc., Manassas, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc., Manassas, VA, USA","institution_ids":["https://openalex.org/I11912373"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5009682633","display_name":"DongJin Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I11912373","display_name":"Micron (United States)","ror":"https://ror.org/02fv52296","country_code":"US","type":"company","lineage":["https://openalex.org/I11912373"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"DongJin Kim","raw_affiliation_strings":["Micron Technology, Inc., Manassas, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micron Technology, Inc., Manassas, VA, USA","institution_ids":["https://openalex.org/I11912373"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I11912373"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"18","issue":null,"first_page":"1921","last_page":"1926"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11125","display_name":"Petri Nets in System Modeling","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11125","display_name":"Petri Nets in System Modeling","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11741","display_name":"Flexible and Reconfigurable Manufacturing Systems","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.8176804780960083},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6420702934265137},{"id":"https://openalex.org/keywords/scheduling","display_name":"Scheduling (production processes)","score":0.5913324356079102},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.572739839553833},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.527502179145813},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.49779438972473145},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.4948398470878601},{"id":"https://openalex.org/keywords/petri-net","display_name":"Petri net","score":0.45487862825393677},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.39551442861557007},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.36074477434158325},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.32233303785324097},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.28912782669067383},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27500003576278687},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2101142406463623},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.19587573409080505},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.135198175907135}],"concepts":[{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.8176804780960083},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6420702934265137},{"id":"https://openalex.org/C206729178","wikidata":"https://www.wikidata.org/wiki/Q2271896","display_name":"Scheduling (production processes)","level":2,"score":0.5913324356079102},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.572739839553833},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.527502179145813},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.49779438972473145},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.4948398470878601},{"id":"https://openalex.org/C38677869","wikidata":"https://www.wikidata.org/wiki/Q724168","display_name":"Petri net","level":2,"score":0.45487862825393677},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.39551442861557007},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.36074477434158325},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.32233303785324097},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.28912782669067383},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27500003576278687},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2101142406463623},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.19587573409080505},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.135198175907135},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/wsc.2011.6147906","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2011.6147906","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2011 Winter Simulation Conference (WSC)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.416.3223","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.416.3223","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.informs-sim.org/wsc11papers/172.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6499999761581421}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1996109622","https://openalex.org/W2095626931","https://openalex.org/W2106659191","https://openalex.org/W2148575040","https://openalex.org/W2159411172","https://openalex.org/W4242037947"],"related_works":["https://openalex.org/W2097017947","https://openalex.org/W321763734","https://openalex.org/W2384756178","https://openalex.org/W3150852698","https://openalex.org/W1948936326","https://openalex.org/W2106176016","https://openalex.org/W2361830001","https://openalex.org/W2065745548","https://openalex.org/W1986437495","https://openalex.org/W2042432413"],"abstract_inverted_index":{"Semiconductor":[0],"manufacturing":[1],"is":[2,18],"a":[3,19,23,74],"capital-intensive":[4],"industry.":[5],"How":[6],"to":[7,26,42,89],"utilize":[8],"billions":[9],"of":[10,12,73,95],"dollars":[11],"equipment":[13],"as":[14,16],"efficiently":[15],"possible":[17],"critical":[20],"factor":[21],"for":[22],"semiconductor":[24],"manufacturer":[25],"succeed":[27],"in":[28,110],"stiff":[29],"competition.":[30],"Unlike":[31],"operations":[32,60],"management":[33],"techniques,":[34],"like":[35],"planning":[36],"and":[37,59,77,108],"scheduling,":[38],"which":[39],"are":[40],"proven":[41],"improve":[43,105],"tool":[44,51,56,76,101,106],"performance":[45],"by":[46],"controlling":[47],"WIP":[48],"(work-in-process)":[49],"movement,":[50],"science":[52,102],"techniques":[53,103],"focus":[54],"on":[55],"architecture,":[57],"components":[58],"inside":[61],"the":[62,91,96],"tool.":[63,97],"In":[64],"this":[65],"paper,":[66],"we":[67],"first":[68],"studied":[69],"process":[70,80],"time":[71],"behavior":[72],"cluster":[75],"fixed":[78],"inefficient":[79],"sequence.":[81],"A":[82],"Petri":[83],"Net":[84],"model":[85],"was":[86],"then":[87],"created":[88],"determine":[90],"internal":[92],"bottleneck":[93],"component":[94],"Results":[98],"indicated":[99],"that":[100],"helped":[104],"efficiency":[107],"resulted":[109],"significant":[111],"cost":[112],"savings.":[113]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}