{"id":"https://openalex.org/W3144660553","doi":"https://doi.org/10.1109/wsc.2010.5678953","title":"AMHS factors enabling small wafer lot manufacturing in semiconductor wafer fabs","display_name":"AMHS factors enabling small wafer lot manufacturing in semiconductor wafer fabs","publication_year":2010,"publication_date":"2010-12-01","ids":{"openalex":"https://openalex.org/W3144660553","doi":"https://doi.org/10.1109/wsc.2010.5678953","mag":"3144660553"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2010.5678953","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2010.5678953","pdf_url":null,"source":{"id":"https://openalex.org/S4363608948","display_name":"Proceedings of the 2010 Winter Simulation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2010 Winter Simulation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014159473","display_name":"Jesus A. Jimenez","orcid":"https://orcid.org/0000-0001-6300-2714"},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jesus A. Jimenez","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058246860","display_name":"Alexander Grosser","orcid":null},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alexander Grosser","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075232128","display_name":"Charitha Adikaram","orcid":null},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Charitha Adikaram","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089033981","display_name":"Victoria Luc\u00eda D\u00e1vila Osorio","orcid":"https://orcid.org/0000-0001-9456-6299"},"institutions":[{"id":"https://openalex.org/I13511017","display_name":"Texas State University","ror":"https://ror.org/05h9q1g27","country_code":"US","type":"education","lineage":["https://openalex.org/I13511017"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Victoria Davila","raw_affiliation_strings":["Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA"],"affiliations":[{"raw_affiliation_string":"Ingram School of Engineering, Texas State University, San Marcos, San Marcos, TX, USA","institution_ids":["https://openalex.org/I13511017"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003409323","display_name":"Robert Wright","orcid":"https://orcid.org/0000-0001-5411-4108"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Robert Wright","raw_affiliation_strings":["International SEMATECH Manufacturing Initiative, Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"International SEMATECH Manufacturing Initiative, Austin, TX, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103329531","display_name":"Michael G H Bell","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Michael Bell","raw_affiliation_strings":["International SEMATECH Manufacturing Initiative, Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"International SEMATECH Manufacturing Initiative, Austin, TX, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5014159473"],"corresponding_institution_ids":["https://openalex.org/I13511017"],"apc_list":null,"apc_paid":null,"fwci":7.1031,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.97238372,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"2575","last_page":"2585"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9921000003814697,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12782","display_name":"Assembly Line Balancing Optimization","score":0.9894999861717224,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8279728889465332},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.5692641735076904},{"id":"https://openalex.org/keywords/factory","display_name":"Factory (object-oriented programming)","score":0.5661649703979492},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5588563084602356},{"id":"https://openalex.org/keywords/material-handling","display_name":"Material handling","score":0.5251992344856262},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4971618950366974},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.4933854639530182},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4562280774116516},{"id":"https://openalex.org/keywords/productivity","display_name":"Productivity","score":0.4388800859451294},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.37660813331604004},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3750388026237488},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3701186776161194},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12069728970527649},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1136840283870697}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8279728889465332},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.5692641735076904},{"id":"https://openalex.org/C40149104","wikidata":"https://www.wikidata.org/wiki/Q5620977","display_name":"Factory (object-oriented programming)","level":2,"score":0.5661649703979492},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5588563084602356},{"id":"https://openalex.org/C2983137510","wikidata":"https://www.wikidata.org/wiki/Q1413942","display_name":"Material handling","level":2,"score":0.5251992344856262},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4971618950366974},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4933854639530182},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4562280774116516},{"id":"https://openalex.org/C204983608","wikidata":"https://www.wikidata.org/wiki/Q2111958","display_name":"Productivity","level":2,"score":0.4388800859451294},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.37660813331604004},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3750388026237488},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3701186776161194},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12069728970527649},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1136840283870697},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/wsc.2010.5678953","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2010.5678953","pdf_url":null,"source":{"id":"https://openalex.org/S4363608948","display_name":"Proceedings of the 2010 Winter Simulation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2010 Winter Simulation Conference","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.416.1935","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.416.1935","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://www.informs-sim.org/wsc10papers/237.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4300000071525574,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1565613622","https://openalex.org/W2102765644","https://openalex.org/W2138574698","https://openalex.org/W4252879955"],"related_works":["https://openalex.org/W2170726572","https://openalex.org/W2146435486","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W3154519833","https://openalex.org/W4240972148","https://openalex.org/W2111778165","https://openalex.org/W1558523943","https://openalex.org/W2009470228"],"abstract_inverted_index":{"The":[0,73],"automated":[1],"material":[2],"handling":[3],"system":[4],"(AMHS)":[5],"may":[6],"become":[7],"a":[8],"critical":[9],"factor":[10],"that":[11],"constrains":[12],"the":[13,31,54,57,71,92,96,101,104,126,130],"capacity":[14],"of":[15,35,42,95,103,132],"12-wafer-lot":[16,55,105,139],"systems.":[17],"In":[18],"this":[19],"paper,":[20],"AMHS":[21,74,98,116,123],"productivity":[22,75],"detractors":[23,76],"affecting":[24],"small":[25],"lot":[26],"manufacturing":[27],"are":[28],"studied,":[29],"including":[30],"track":[32],"layout,":[33],"number":[34,41],"vehicles,":[36],"empty":[37],"vehicle":[38],"management":[39],"rules,":[40],"stockers,":[43],"stocker":[44],"capacity,":[45],"among":[46],"others.":[47],"Linked":[48],"simulation":[49],"models":[50],"were":[51,79],"developed":[52],"for":[53,81],"and":[56,67,84,114],"25-wafer-lot":[58,97],"systems,":[59],"using":[60],"AutoSched":[61],"AP":[62],"to":[63,69,100],"simulate":[64,70],"wafer":[65,133],"processing":[66],"AutoMod":[68],"AMHS.":[72],"under":[77],"study":[78],"varied":[80],"experimental":[82],"purposes,":[83],"each":[85],"scenario":[86],"was":[87],"quantitatively":[88],"analyzed.":[89],"Changes":[90],"in":[91,108,129],"factory":[93],"logistics":[94],"led":[99],"development":[102],"AMHS,":[106],"resulting":[107],"less":[109],"congestion":[110],"around":[111],"high-throughput":[112],"areas":[113],"faster":[115],"delivery":[117],"speeds.":[118],"Simulation":[119],"results":[120],"showed":[121],"improved":[122],"performance":[124],"despite":[125],"significant":[127],"increase":[128],"amount":[131],"moves":[134],"per":[135],"hour":[136],"caused":[137],"by":[138],"manufacturing.":[140]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}