{"id":"https://openalex.org/W3144953585","doi":"https://doi.org/10.1109/wsc.2008.4736315","title":"Determining an appropriate number of FOUPs in semiconductor wafer fabrication facilities","display_name":"Determining an appropriate number of FOUPs in semiconductor wafer fabrication facilities","publication_year":2008,"publication_date":"2008-12-01","ids":{"openalex":"https://openalex.org/W3144953585","doi":"https://doi.org/10.1109/wsc.2008.4736315","mag":"3144953585"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2008.4736315","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2008.4736315","pdf_url":null,"source":{"id":"https://openalex.org/S4363608392","display_name":"2008 Winter Simulation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 Winter Simulation Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111949864","display_name":"Jens Zimmermann","orcid":null},"institutions":[{"id":"https://openalex.org/I120691247","display_name":"FernUniversit\u00e4t in Hagen","ror":"https://ror.org/04tkkr536","country_code":"DE","type":"education","lineage":["https://openalex.org/I120691247"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jens Zimmermann","raw_affiliation_strings":["Enterprise-wide Software Systems, Department of Mathematics and Computer Science, University of Hagen, Hagen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Enterprise-wide Software Systems, Department of Mathematics and Computer Science, University of Hagen, Hagen, Germany","institution_ids":["https://openalex.org/I120691247"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031603454","display_name":"Scott J. Mason","orcid":"https://orcid.org/0000-0002-8686-9609"},"institutions":[{"id":"https://openalex.org/I120691247","display_name":"FernUniversit\u00e4t in Hagen","ror":"https://ror.org/04tkkr536","country_code":"DE","type":"education","lineage":["https://openalex.org/I120691247"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Scott J. Mason","raw_affiliation_strings":["Enterprise-wide Software Systems, Department of Mathematics and Computer Science, University of Hagen, Hagen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Enterprise-wide Software Systems, Department of Mathematics and Computer Science, University of Hagen, Hagen, Germany","institution_ids":["https://openalex.org/I120691247"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019888542","display_name":"John Fowler","orcid":"https://orcid.org/0000-0002-7112-8031"},"institutions":[{"id":"https://openalex.org/I78715868","display_name":"University of Arkansas at Fayetteville","ror":"https://ror.org/05jbt9m15","country_code":"US","type":"education","lineage":["https://openalex.org/I78715868"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John W. Fowler","raw_affiliation_strings":["Department of Industrial Engineering, University of Arkansas, Fayetteville, AR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering, University of Arkansas, Fayetteville, AR, USA","institution_ids":["https://openalex.org/I78715868"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032060363","display_name":"Lars M\u00f6nch","orcid":null},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lars Monch","raw_affiliation_strings":["Department of Industrial Engineering, Arizona State University, Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.2048,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.9039548,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"2164","last_page":"2170"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12288","display_name":"Optimization and Search Problems","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8396704196929932},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.8358774781227112},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.6351115107536316},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5959877371788025},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5699910521507263},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.459104061126709},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.4119868874549866},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35868579149246216},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2440701127052307},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0860564112663269}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8396704196929932},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.8358774781227112},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.6351115107536316},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5959877371788025},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5699910521507263},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.459104061126709},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.4119868874549866},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35868579149246216},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2440701127052307},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0860564112663269},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/wsc.2008.4736315","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2008.4736315","pdf_url":null,"source":{"id":"https://openalex.org/S4363608392","display_name":"2008 Winter Simulation Conference","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 Winter Simulation Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321870","display_name":"Georg-August-Universit\u00e4t G\u00f6ttingen","ror":"https://ror.org/01y9bpm73"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1964243794","https://openalex.org/W1973270385","https://openalex.org/W2008838974","https://openalex.org/W2020310393","https://openalex.org/W2074984607","https://openalex.org/W2078193562","https://openalex.org/W2118138832","https://openalex.org/W2130834789","https://openalex.org/W2157486392","https://openalex.org/W3152082099"],"related_works":["https://openalex.org/W2146435486","https://openalex.org/W2170726572","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W2992897358","https://openalex.org/W2394172622","https://openalex.org/W1594978932","https://openalex.org/W2083418455","https://openalex.org/W2140718007"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"multiple":[3],"orders":[4,22,29],"per":[5],"job":[6,27,52,59,66],"type":[7],"formation":[8],"and":[9,53,92],"release":[10,79],"strategies":[11],"are":[12,23],"described":[13],"for":[14,75,86],"semiconductor":[15],"wafer":[16,62],"fabrication":[17],"facilities":[18],"(wafer":[19],"fabs).":[20],"Different":[21],"grouped":[24],"into":[25],"one":[26],"because":[28],"of":[30,40,73],"an":[31,70],"individual":[32],"customer":[33],"very":[34],"often":[35],"fill":[36],"only":[37],"a":[38,41,76],"portion":[39],"front-opening":[42],"unified":[43],"pod":[44],"(FOUP).":[45],"A":[46],"FOUP":[47],"is":[48,54],"assigned":[49],"to":[50,56],"each":[51],"used":[55],"move":[57],"the":[58,61,65],"throughout":[60],"fab":[63],"after":[64],"formation.":[67],"We":[68],"determine":[69],"appropriate":[71],"number":[72],"FOUPs":[74],"given":[77],"order":[78],"rate":[80],"that":[81],"will":[82],"yield":[83],"acceptable":[84],"values":[85],"on-time":[87],"delivery":[88],"performance,":[89],"cycle":[90],"time,":[91],"throughput":[93],"via":[94],"discrete":[95],"event":[96],"simulation.":[97]},"counts_by_year":[{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}