{"id":"https://openalex.org/W2109200975","doi":"https://doi.org/10.1109/wsc.2003.1261576","title":"An approach to robust layout planning of AMHS","display_name":"An approach to robust layout planning of AMHS","publication_year":2003,"publication_date":"2003-01-01","ids":{"openalex":"https://openalex.org/W2109200975","doi":"https://doi.org/10.1109/wsc.2003.1261576","mag":"2109200975"},"language":"en","primary_location":{"id":"doi:10.1109/wsc.2003.1261576","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2003.1261576","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2003 Winter Simulation Conference, 2003.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5097314835","display_name":"Sturm","orcid":null},"institutions":[{"id":"https://openalex.org/I3018473509","display_name":"Fraunhofer Institute for Manufacturing Engineering and Automation","ror":"https://ror.org/01rvqha10","country_code":"DE","type":"facility","lineage":["https://openalex.org/I3018473509","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Sturm","raw_affiliation_strings":["Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany","institution_ids":["https://openalex.org/I3018473509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5097204032","display_name":"Seidelmann","orcid":null},"institutions":[{"id":"https://openalex.org/I3018473509","display_name":"Fraunhofer Institute for Manufacturing Engineering and Automation","ror":"https://ror.org/01rvqha10","country_code":"DE","type":"facility","lineage":["https://openalex.org/I3018473509","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Seidelmann","raw_affiliation_strings":["Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany","institution_ids":["https://openalex.org/I3018473509"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5097314836","display_name":"Dorner","orcid":null},"institutions":[{"id":"https://openalex.org/I3018473509","display_name":"Fraunhofer Institute for Manufacturing Engineering and Automation","ror":"https://ror.org/01rvqha10","country_code":"DE","type":"facility","lineage":["https://openalex.org/I3018473509","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Dorner","raw_affiliation_strings":["Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany","institution_ids":["https://openalex.org/I3018473509"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5097176256","display_name":"Reddig","orcid":null},"institutions":[{"id":"https://openalex.org/I3018473509","display_name":"Fraunhofer Institute for Manufacturing Engineering and Automation","ror":"https://ror.org/01rvqha10","country_code":"DE","type":"facility","lineage":["https://openalex.org/I3018473509","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Reddig","raw_affiliation_strings":["Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Dept. Cleanroom Manuf., Fraunhofer IPA, Stuttgart, Germany","institution_ids":["https://openalex.org/I3018473509"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5097314835"],"corresponding_institution_ids":["https://openalex.org/I3018473509"],"apc_list":null,"apc_paid":null,"fwci":1.5519,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.84795861,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12782","display_name":"Assembly Line Balancing Optimization","score":0.9876000285148621,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/material-handling","display_name":"Material handling","score":0.712856650352478},{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.6170737147331238},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.5102541446685791},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5082211494445801},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.5068688988685608},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.42131394147872925},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.40833091735839844},{"id":"https://openalex.org/keywords/industrial-engineering","display_name":"Industrial engineering","score":0.4024554193019867},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.37981367111206055},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3562316596508026},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.33043935894966125}],"concepts":[{"id":"https://openalex.org/C2983137510","wikidata":"https://www.wikidata.org/wiki/Q1413942","display_name":"Material handling","level":2,"score":0.712856650352478},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.6170737147331238},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.5102541446685791},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5082211494445801},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5068688988685608},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.42131394147872925},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.40833091735839844},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.4024554193019867},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.37981367111206055},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3562316596508026},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.33043935894966125},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/wsc.2003.1261576","is_oa":false,"landing_page_url":"https://doi.org/10.1109/wsc.2003.1261576","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2003 Winter Simulation Conference, 2003.","raw_type":"proceedings-article"},{"id":"pmh:oai:fraunhofer.de:N-20937","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-20937.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IPA","raw_type":"Conference Paper"},{"id":"pmh:oai:publica.fraunhofer.de:publica/342382","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/342382","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.41999998688697815}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1540354521","https://openalex.org/W1986408413","https://openalex.org/W2042857504","https://openalex.org/W2066747652","https://openalex.org/W6987219930"],"related_works":["https://openalex.org/W2146435486","https://openalex.org/W2170726572","https://openalex.org/W2006086900","https://openalex.org/W1483119123","https://openalex.org/W3154519833","https://openalex.org/W4240972148","https://openalex.org/W2111778165","https://openalex.org/W1558523943","https://openalex.org/W2501790393","https://openalex.org/W2009470228"],"abstract_inverted_index":{"The":[0,90],"simulation-based":[1],"layout":[2,27],"planning":[3,31,60,75],"of":[4,29,48],"automated":[5],"material":[6],"handling":[7],"systems":[8],"(AMHS)":[9],"for":[10,21,46,77,83],"microelectronics":[11],"and":[12,23,41,95],"semiconductor":[13],"manufacturing":[14],"demands":[15],"adequate":[16],"simulation":[17,39],"models.":[18],"An":[19],"approach":[20,45,53,76],"measuring":[22],"quantifying":[24],"the":[25,63,66,74],"AMHS":[26,49,80,102],"performance":[28,50],"alternative":[30,59],"variants":[32],"is":[33,54,69],"required.":[34],"Fraunhofer":[35],"IPA":[36],"has":[37],"developed":[38],"methods":[40],"a":[42],"three":[43],"level":[44],"calculation":[47],"metrics.":[51],"This":[52],"very":[55,70],"efficient":[56],"when":[57],"comparing":[58],"variants,":[61],"although":[62],"difference":[64],"in":[65,86],"configuration":[67],"change":[68],"small.":[71],"We":[72],"outline":[73],"two":[78],"typical":[79],"designs":[81],"used":[82,92],"interbay":[84],"transportation":[85],"200mm":[87],"wafer":[88],"fabs.":[89],"models":[91],"are":[93],"generic":[94],"can":[96],"be":[97],"adapted":[98],"easily":[99],"to":[100],"different":[101],"solutions.":[103]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-04-05T17:49:38.594831","created_date":"2025-10-10T00:00:00"}