{"id":"https://openalex.org/W4413392859","doi":"https://doi.org/10.1109/whc64065.2025.11123214","title":"Evaluating the Performance of a Thermal Contact Sensor in Capturing Thermal Transients for Material Recognition via Heat Transfer","display_name":"Evaluating the Performance of a Thermal Contact Sensor in Capturing Thermal Transients for Material Recognition via Heat Transfer","publication_year":2025,"publication_date":"2025-07-08","ids":{"openalex":"https://openalex.org/W4413392859","doi":"https://doi.org/10.1109/whc64065.2025.11123214"},"language":"en","primary_location":{"id":"doi:10.1109/whc64065.2025.11123214","is_oa":false,"landing_page_url":"https://doi.org/10.1109/whc64065.2025.11123214","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE World Haptics Conference (WHC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066874126","display_name":"Naoki Kameyama","orcid":"https://orcid.org/0009-0009-6858-347X"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Naoki Kameyama","raw_affiliation_strings":["Graduate School of Design, Kyushu University,Fukuoka,Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of Design, Kyushu University,Fukuoka,Japan","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006849806","display_name":"Takayuki Kameoka","orcid":"https://orcid.org/0000-0001-9897-4433"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takayuki Kameoka","raw_affiliation_strings":["Kyushu University,Faculty of Design,Fukuoka,Japan"],"affiliations":[{"raw_affiliation_string":"Kyushu University,Faculty of Design,Fukuoka,Japan","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037726704","display_name":"Hsin-Ni Ho","orcid":"https://orcid.org/0000-0002-9940-9089"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hsin-Ni Ho","raw_affiliation_strings":["Kyushu University,Faculty of Design,Fukuoka,Japan"],"affiliations":[{"raw_affiliation_string":"Kyushu University,Faculty of Design,Fukuoka,Japan","institution_ids":["https://openalex.org/I135598925"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5066874126"],"corresponding_institution_ids":["https://openalex.org/I135598925"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.20420735,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"171","last_page":"177"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.7371000051498413,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.7371000051498413,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11667","display_name":"Advanced Chemical Sensor Technologies","score":0.6625999808311462,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.6392999887466431,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.70884770154953},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.6490561366081238},{"id":"https://openalex.org/keywords/thermal-contact","display_name":"Thermal contact","score":0.568788468837738},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5666654706001282},{"id":"https://openalex.org/keywords/thermal-transfer","display_name":"Thermal transfer","score":0.558103084564209},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38822612166404724},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3482759892940521},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1918511688709259},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.17295727133750916},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.12504178285598755},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.10775840282440186},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1066095232963562}],"concepts":[{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.70884770154953},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6490561366081238},{"id":"https://openalex.org/C142014798","wikidata":"https://www.wikidata.org/wiki/Q7783037","display_name":"Thermal contact","level":3,"score":0.568788468837738},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5666654706001282},{"id":"https://openalex.org/C2779478220","wikidata":"https://www.wikidata.org/wiki/Q3312622","display_name":"Thermal transfer","level":3,"score":0.558103084564209},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38822612166404724},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3482759892940521},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1918511688709259},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17295727133750916},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.12504178285598755},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.10775840282440186},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1066095232963562},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/whc64065.2025.11123214","is_oa":false,"landing_page_url":"https://doi.org/10.1109/whc64065.2025.11123214","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE World Haptics Conference (WHC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6800000071525574}],"awards":[{"id":"https://openalex.org/G5926559902","display_name":null,"funder_award_id":"22H03679","funder_id":"https://openalex.org/F4320334764","funder_display_name":"Japan Society for the Promotion of Science"}],"funders":[{"id":"https://openalex.org/F4320320212","display_name":"Japan Society for the Promotion of Science London","ror":"https://ror.org/02m7axw05"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1992040775","https://openalex.org/W2057731241","https://openalex.org/W2077094904","https://openalex.org/W2080317558","https://openalex.org/W2111505719","https://openalex.org/W2146512768","https://openalex.org/W2147557019","https://openalex.org/W2160541069","https://openalex.org/W2164302525","https://openalex.org/W2274744253","https://openalex.org/W2493132677","https://openalex.org/W2757397971","https://openalex.org/W2806653473","https://openalex.org/W3167327717","https://openalex.org/W3217709109","https://openalex.org/W4253032301","https://openalex.org/W4403992028","https://openalex.org/W4404008186"],"related_works":["https://openalex.org/W3214012737","https://openalex.org/W4206783906","https://openalex.org/W1983766604","https://openalex.org/W2166518054","https://openalex.org/W2071221664","https://openalex.org/W2894681289","https://openalex.org/W2367506447","https://openalex.org/W2625467591","https://openalex.org/W2347735319","https://openalex.org/W2315453694"],"abstract_inverted_index":{"Tactile":[0],"perception":[1],"is":[2],"essential":[3],"for":[4,130,160],"material":[5,19,131,141,174],"recognition,":[6],"with":[7,42,68,145],"thermal":[8,28,38,80,151,154,163],"transients":[9],"playing":[10],"a":[11,27,43,52,139],"key":[12],"role":[13],"in":[14,89,101,169],"conveying":[15],"information":[16],"about":[17],"object":[18],"composition.":[20],"This":[21],"study":[22],"evaluates":[23],"the":[24,34,79,94,102,113,117],"performance":[25],"of":[26,36,46],"contact":[29,41,55,81,144,155],"sensor":[30,82,95,114,156],"designed":[31],"to":[32],"capture":[33],"characteristics":[35,125],"skin":[37],"responses":[39,67,129],"during":[40,110],"wide":[44],"range":[45],"materials.":[47,73],"The":[48,153],"sensor,":[49],"constructed":[50],"using":[51],"heat-resistant":[53],"glass":[54],"surface":[56],"and":[57,96,106,126,172],"an":[58],"integrated":[59],"heating":[60],"system,":[61],"was":[62],"evaluated":[63],"by":[64],"comparing":[65],"temperature":[66,86,108],"human":[69,97,118],"fingers":[70,98],"when":[71],"contacting":[72],"Experimental":[74],"results":[75],"showed":[76],"that":[77],"while":[78],"successfully":[83],"captured":[84],"material-dependent":[85],"responses,":[87],"differences":[88],"heat":[90],"transfer":[91],"dynamics":[92],"between":[93],"were":[99],"observed":[100],"initial":[103],"cooling":[104],"rate":[105],"total":[107],"change":[109],"contact.":[111],"Although":[112],"differs":[115],"from":[116],"finger,":[119],"it":[120],"has":[121,157],"its":[122,136,150],"own":[123],"unique":[124],"provides":[127],"valuable":[128],"recognition.":[132],"To":[133],"further":[134],"enhance":[135],"performance,":[137],"incorporating":[138],"soft":[140],"could":[142,166],"improve":[143],"different":[146],"surfaces,":[147],"potentially":[148],"refining":[149],"response.":[152],"significant":[158],"potential":[159],"creating":[161],"large-scale":[162],"datasets,":[164],"which":[165],"advance":[167],"applications":[168],"haptic":[170],"displays":[171],"robotic":[173],"recognition":[175],"systems.":[176]},"counts_by_year":[],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}