{"id":"https://openalex.org/W4411173488","doi":"https://doi.org/10.1109/vts65138.2025.11022822","title":"Periodic Non-Destructive Memory BIST for Automotive Applications","display_name":"Periodic Non-Destructive Memory BIST for Automotive Applications","publication_year":2025,"publication_date":"2025-04-28","ids":{"openalex":"https://openalex.org/W4411173488","doi":"https://doi.org/10.1109/vts65138.2025.11022822"},"language":"en","primary_location":{"id":"doi:10.1109/vts65138.2025.11022822","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts65138.2025.11022822","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE 43rd VLSI Test Symposium (VTS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5108792944","display_name":"Wei Zou","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Zou","raw_affiliation_strings":["Siemens EDA,Wilsonville,OR,United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Wilsonville,OR,United States","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004438248","display_name":"Artur Pogiel","orcid":"https://orcid.org/0000-0001-5271-1566"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Artur Pogiel","raw_affiliation_strings":["Siemens EDA,Poznań,Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Poznań,Poland","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070078901","display_name":"Albert Au","orcid":null},"institutions":[{"id":"https://openalex.org/I2801914806","display_name":"Siemens (Canada)","ror":"https://ror.org/03cpzkh11","country_code":"CA","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I2801914806"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Albert Au","raw_affiliation_strings":["Siemens EDA,Ottawa,Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Ottawa,Canada","institution_ids":["https://openalex.org/I2801914806"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019406427","display_name":"Martin Keim","orcid":"https://orcid.org/0000-0002-0029-135X"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Martin Keim","raw_affiliation_strings":["Siemens EDA,Orlando,FL,United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Siemens EDA,Orlando,FL,United States","institution_ids":["https://openalex.org/I4210137693"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5601725578308105},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5596588253974915},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3710840940475464},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22876420617103577}],"concepts":[{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5601725578308105},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5596588253974915},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3710840940475464},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22876420617103577},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vts65138.2025.11022822","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts65138.2025.11022822","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE 43rd VLSI Test Symposium (VTS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1580083564","https://openalex.org/W1977765666","https://openalex.org/W2126881801","https://openalex.org/W2153199442","https://openalex.org/W2397317995","https://openalex.org/W2541016207","https://openalex.org/W3180787021","https://openalex.org/W4404848498","https://openalex.org/W4404849004"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W4382644535","https://openalex.org/W2522768275","https://openalex.org/W2352938035","https://openalex.org/W2390279801","https://openalex.org/W2351672553","https://openalex.org/W2373392303","https://openalex.org/W2765894405"],"abstract_inverted_index":{"Adherence":[0],"to":[1,45],"the":[2,73,94],"ISO":[3],"26262":[4],"standard":[5],"requires":[6],"periodic":[7],"testing":[8,27,86],"of":[9,65,75],"embedded":[10],"memories":[11],"in":[12],"automobiles,":[13],"which":[14],"must":[15,28],"be":[16],"completed":[17],"within":[18],"short":[19,66],"time":[20],"windows":[21],"during":[22],"normal":[23],"vehicle":[24,46],"operation.":[25],"This":[26,48],"preserve":[29],"memory":[30,81],"contents":[31],"post-test":[32],"and":[33,103,119],"integrate":[34],"test":[35,67,117],"logic":[36],"seamlessly":[37],"with":[38,89,112],"system":[39,91,113],"functionality,":[40],"all":[41],"while":[42],"minimizing":[43],"disruption":[44],"performance.":[47],"paper":[49],"proposes":[50],"a":[51,63,105],"Memory":[52],"Built-In":[53],"Self-Test":[54],"(MBIST)":[55],"architecture":[56,70,95],"that":[57],"addresses":[58],"these":[59],"challenges":[60],"by":[61,99],"using":[62],"series":[64],"bursts.":[68],"The":[69],"dynamically":[71],"adjusts":[72],"length":[74],"each":[76],"burst":[77],"based":[78],"on":[79],"available":[80],"idle":[82],"time,":[83],"ensuring":[84],"efficient":[85],"without":[87],"interfering":[88],"critical":[90],"functions.":[92],"Additionally,":[93],"minimizes":[96],"hardware":[97],"overhead":[98],"reusing":[100],"existing":[101],"resources":[102],"introduces":[104],"direct":[106],"access":[107],"interface":[108],"for":[109],"tighter":[110],"integration":[111],"logic,":[114],"further":[115],"enhancing":[116],"efficiency":[118],"reducing":[120],"latency.":[121]},"counts_by_year":[{"year":2026,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}