{"id":"https://openalex.org/W2957991552","doi":"https://doi.org/10.1109/vts.2019.8758670","title":"On Cyclic Scan Integrity Tests for EDT-based Compression","display_name":"On Cyclic Scan Integrity Tests for EDT-based Compression","publication_year":2019,"publication_date":"2019-04-01","ids":{"openalex":"https://openalex.org/W2957991552","doi":"https://doi.org/10.1109/vts.2019.8758670","mag":"2957991552"},"language":"en","primary_location":{"id":"doi:10.1109/vts.2019.8758670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2019.8758670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 37th VLSI Test Symposium (VTS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046691899","display_name":"Grzegorz Mrugalski","orcid":"https://orcid.org/0000-0001-9378-127X"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Grzegorz Mrugalski","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080960636","display_name":"Janusz Rajski","orcid":"https://orcid.org/0000-0003-2124-447X"},"institutions":[{"id":"https://openalex.org/I4210137693","display_name":"Siemens (United States)","ror":"https://ror.org/04axb7e79","country_code":"US","type":"company","lineage":["https://openalex.org/I1325886976","https://openalex.org/I4210137693"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Janusz Rajski","raw_affiliation_strings":["Mentor, A Siemens Business, Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor, A Siemens Business, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210137693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028356877","display_name":"Maciej Trawka","orcid":"https://orcid.org/0000-0001-6811-2170"},"institutions":[{"id":"https://openalex.org/I4210125238","display_name":"Gdynia Maritime University","ror":"https://ror.org/02vscf791","country_code":"PL","type":"education","lineage":["https://openalex.org/I4210125238"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Maciej Trawka","raw_affiliation_strings":["Gdynia Maritime University, Gdynia, Poland"],"affiliations":[{"raw_affiliation_string":"Gdynia Maritime University, Gdynia, Poland","institution_ids":["https://openalex.org/I4210125238"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072675590","display_name":"Jerzy Tyszer","orcid":"https://orcid.org/0000-0001-9722-2344"},"institutions":[{"id":"https://openalex.org/I46597724","display_name":"Pozna\u0144 University of Technology","ror":"https://ror.org/00p7p3302","country_code":"PL","type":"education","lineage":["https://openalex.org/I46597724"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Jerzy Tyszer","raw_affiliation_strings":["Pozna\u0144 University of Technology, Pozna\u0144, Poland"],"affiliations":[{"raw_affiliation_string":"Pozna\u0144 University of Technology, Pozna\u0144, Poland","institution_ids":["https://openalex.org/I46597724"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5020407423"],"corresponding_institution_ids":["https://openalex.org/I4210137693"],"apc_list":null,"apc_paid":null,"fwci":1.4446,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.80746152,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"55","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.6124488711357117},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5398328900337219},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.5070154666900635},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4977722465991974},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.479595810174942},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.4701398015022278},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.46048247814178467},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.44329187273979187},{"id":"https://openalex.org/keywords/data-integrity","display_name":"Data integrity","score":0.4199369251728058},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4131866991519928},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.410577654838562},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.347700834274292},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3086155652999878},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.15531766414642334},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09937679767608643},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.09486168622970581},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.0943620502948761}],"concepts":[{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.6124488711357117},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5398328900337219},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.5070154666900635},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4977722465991974},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.479595810174942},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.4701398015022278},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.46048247814178467},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44329187273979187},{"id":"https://openalex.org/C33762810","wikidata":"https://www.wikidata.org/wiki/Q461671","display_name":"Data integrity","level":2,"score":0.4199369251728058},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4131866991519928},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.410577654838562},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.347700834274292},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3086155652999878},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.15531766414642334},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09937679767608643},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.09486168622970581},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0943620502948761},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vts.2019.8758670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2019.8758670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 37th VLSI Test Symposium (VTS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6600000262260437,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W1983122941","https://openalex.org/W2037589385","https://openalex.org/W2038232991","https://openalex.org/W2064235357","https://openalex.org/W2071464394","https://openalex.org/W2098385231","https://openalex.org/W2099226121","https://openalex.org/W2101900253","https://openalex.org/W2108361034","https://openalex.org/W2121266668","https://openalex.org/W2142308491","https://openalex.org/W2153126169","https://openalex.org/W2536095564","https://openalex.org/W2762263503","https://openalex.org/W3111651134","https://openalex.org/W3114029434","https://openalex.org/W3115209132","https://openalex.org/W3116478505","https://openalex.org/W4300938752","https://openalex.org/W6666474464","https://openalex.org/W6678162679","https://openalex.org/W6728617004","https://openalex.org/W6787219859","https://openalex.org/W6787399944","https://openalex.org/W6787425853","https://openalex.org/W6845537742"],"related_works":["https://openalex.org/W2163047760","https://openalex.org/W2955439067","https://openalex.org/W2035832568","https://openalex.org/W1606802855","https://openalex.org/W3121464923","https://openalex.org/W1519923721","https://openalex.org/W3147676363","https://openalex.org/W2542602675","https://openalex.org/W2025078381","https://openalex.org/W4312107582"],"abstract_inverted_index":{"The":[0,112,134],"semiconductor":[1],"industry":[2],"ramping":[3],"up":[4],"design":[5],"capabilities":[6],"for":[7,69,97],"emerging":[8],"technologies":[9],"is":[10,34],"facing":[11],"unprecedented":[12],"test":[13,61,70,85,99,126,151],"quality":[14],"and":[15,25,43,59,75,92,108,122,128,142],"yield":[16,23,44,76],"management":[17],"challenges.":[18],"To":[19],"facilitate":[20],"diagnosis":[21],"of":[22,38,104,119,148],"issues":[24],"to":[26,82,89],"enable":[27,90],"repair":[28],"processes,":[29],"an":[30],"accurate":[31],"defect":[32],"isolation":[33],"needed":[35],"with":[36],"support":[37,130],"more":[39,52],"advanced":[40,53,98,131],"test,":[41],"diagnostic,":[42],"analysis":[45],"tools.":[46],"Scan":[47],"remains":[48],"instrumental":[49],"in":[50],"developing":[51],"DFT":[54],"technologies,":[55],"including":[56,101],"logic":[57],"BIST":[58],"on-chip":[60,84],"data":[62,86],"compression.":[63],"Its":[64],"reliable":[65],"operations":[66],"are":[67],"essential":[68],"pattern":[71],"bring-up,":[72],"failure":[73],"analysis,":[74],"learning.":[77],"This":[78],"paper":[79],"demonstrates":[80],"how":[81],"re-architect":[83],"compression":[87],"environment":[88],"multiple":[91],"repeated":[93],"scan":[94,120],"integrity":[95],"tests":[96],"procedures,":[100],"various":[102],"forms":[103],"stroboscopic":[105],"electron-beam":[106],"imaging":[107],"laser":[109],"voltage":[110],"imaging.":[111],"presented":[113],"approach":[114],"avoids":[115],"the":[116,146,149],"repetitive":[117],"loading":[118],"chains":[121],"therefore":[123],"reduces":[124],"significantly":[125],"time":[127],"may":[129],"diagnostic":[132],"techniques.":[133],"new":[135],"solution":[136],"has":[137],"virtually":[138],"no":[139],"area":[140],"overhead,":[141],"does":[143],"not":[144],"compromise":[145],"performance":[147],"original":[150],"logic.":[152]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}