{"id":"https://openalex.org/W2960592935","doi":"https://doi.org/10.1109/vts.2019.8758667","title":"Wafer Pattern Recognition Using Tucker Decomposition","display_name":"Wafer Pattern Recognition Using Tucker Decomposition","publication_year":2019,"publication_date":"2019-04-01","ids":{"openalex":"https://openalex.org/W2960592935","doi":"https://doi.org/10.1109/vts.2019.8758667","mag":"2960592935"},"language":"en","primary_location":{"id":"doi:10.1109/vts.2019.8758667","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2019.8758667","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 37th VLSI Test Symposium (VTS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031565630","display_name":"Ahmed Wahba","orcid":null},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ahmed Wahba","raw_affiliation_strings":["UC Santa Barbara"],"affiliations":[{"raw_affiliation_string":"UC Santa Barbara","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100369642","display_name":"Li-C. Wang","orcid":"https://orcid.org/0000-0003-4851-8004"},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Li-C. Wang","raw_affiliation_strings":["UC Santa Barbara"],"affiliations":[{"raw_affiliation_string":"UC Santa Barbara","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100459107","display_name":"Zheng Zhang","orcid":"https://orcid.org/0000-0002-2292-0030"},"institutions":[{"id":"https://openalex.org/I154570441","display_name":"University of California, Santa Barbara","ror":"https://ror.org/02t274463","country_code":"US","type":"education","lineage":["https://openalex.org/I154570441"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zheng Zhang","raw_affiliation_strings":["UC Santa Barbara"],"affiliations":[{"raw_affiliation_string":"UC Santa Barbara","institution_ids":["https://openalex.org/I154570441"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078270682","display_name":"Nik Sumikawa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210123704","display_name":"NXP (Germany)","ror":"https://ror.org/0268h4j55","country_code":"DE","type":"company","lineage":["https://openalex.org/I109147379","https://openalex.org/I4210123704"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Nik Sumikawa","raw_affiliation_strings":["NXP Semiconductors"],"affiliations":[{"raw_affiliation_string":"NXP Semiconductors","institution_ids":["https://openalex.org/I4210123704"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5031565630"],"corresponding_institution_ids":["https://openalex.org/I154570441"],"apc_list":null,"apc_paid":null,"fwci":1.9261,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.85624837,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10500","display_name":"Sparse and Compressive Sensing Techniques","score":0.9890000224113464,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8120236396789551},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.598426103591919},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.522802472114563},{"id":"https://openalex.org/keywords/projection","display_name":"Projection (relational algebra)","score":0.5213557481765747},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.5132081508636475},{"id":"https://openalex.org/keywords/decomposition","display_name":"Decomposition","score":0.5001764297485352},{"id":"https://openalex.org/keywords/matrix","display_name":"Matrix (chemical analysis)","score":0.488693505525589},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4813281297683716},{"id":"https://openalex.org/keywords/cluster-analysis","display_name":"Cluster analysis","score":0.47855502367019653},{"id":"https://openalex.org/keywords/diagonal","display_name":"Diagonal","score":0.453810453414917},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.45323610305786133},{"id":"https://openalex.org/keywords/analytics","display_name":"Analytics","score":0.4154849350452423},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.41443681716918945},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.39232000708580017},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2152584195137024},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.19149711728096008},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.15821611881256104},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.15118584036827087}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8120236396789551},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.598426103591919},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.522802472114563},{"id":"https://openalex.org/C57493831","wikidata":"https://www.wikidata.org/wiki/Q3134666","display_name":"Projection (relational algebra)","level":2,"score":0.5213557481765747},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.5132081508636475},{"id":"https://openalex.org/C124681953","wikidata":"https://www.wikidata.org/wiki/Q339062","display_name":"Decomposition","level":2,"score":0.5001764297485352},{"id":"https://openalex.org/C106487976","wikidata":"https://www.wikidata.org/wiki/Q685816","display_name":"Matrix (chemical analysis)","level":2,"score":0.488693505525589},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4813281297683716},{"id":"https://openalex.org/C73555534","wikidata":"https://www.wikidata.org/wiki/Q622825","display_name":"Cluster analysis","level":2,"score":0.47855502367019653},{"id":"https://openalex.org/C130367717","wikidata":"https://www.wikidata.org/wiki/Q189791","display_name":"Diagonal","level":2,"score":0.453810453414917},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.45323610305786133},{"id":"https://openalex.org/C79158427","wikidata":"https://www.wikidata.org/wiki/Q485396","display_name":"Analytics","level":2,"score":0.4154849350452423},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.41443681716918945},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.39232000708580017},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2152584195137024},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.19149711728096008},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.15821611881256104},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.15118584036827087},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vts.2019.8758667","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2019.8758667","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE 37th VLSI Test Symposium (VTS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1673923490","https://openalex.org/W1798945469","https://openalex.org/W1963826206","https://openalex.org/W1967683336","https://openalex.org/W2013912476","https://openalex.org/W2018067627","https://openalex.org/W2018282388","https://openalex.org/W2024165284","https://openalex.org/W2037360998","https://openalex.org/W2098502158","https://openalex.org/W2121739212","https://openalex.org/W2432004435","https://openalex.org/W2544286079","https://openalex.org/W2913975675","https://openalex.org/W2963048316","https://openalex.org/W2963373786","https://openalex.org/W4292023222","https://openalex.org/W4298289240","https://openalex.org/W6638060716","https://openalex.org/W6679667936"],"related_works":["https://openalex.org/W2146366317","https://openalex.org/W2070188681","https://openalex.org/W2041316527","https://openalex.org/W2970498257","https://openalex.org/W3066247946","https://openalex.org/W2946551485","https://openalex.org/W1953501065","https://openalex.org/W2164231539","https://openalex.org/W2036313051","https://openalex.org/W1810385482"],"abstract_inverted_index":{"In":[0,43],"production":[1,32],"test":[2],"data":[3],"analytics,":[4],"it":[5],"is":[6,109],"often":[7],"that":[8,70,118],"an":[9],"analysis":[10,38],"involves":[11],"the":[12,31,37,115,134],"recognition":[13],"of":[14,58,83,91,133],"a":[15,19,27,40,48,55,75,80,87,93,101,110,128],"conceptual":[16,129],"pattern":[17,24,77,130],"on":[18,54],"wafer":[20,23,56,76,116],"map.":[21],"A":[22],"may":[25],"hint":[26],"particular":[28],"issue":[29],"in":[30,106,131],"by":[33,79],"itself":[34],"or":[35],"guide":[36],"into":[39,86],"certain":[41],"direction.":[42],"this":[44],"work,":[45],"we":[46],"introduce":[47],"novel":[49,111],"approach":[50,62,108],"to":[51,66,73,97,113,122,126],"recognize":[52,98],"patterns":[53],"map":[57],"pass/fail":[59],"locations.":[60],"Our":[61],"utilizes":[63],"Tucker":[64],"decomposition":[65],"find":[67],"projection":[68],"matrices":[69],"are":[71,95,119],"able":[72],"project":[74],"represented":[78],"small":[81],"set":[82],"training":[84],"samples":[85,117],"nearly-diagonal":[88],"matrix.":[89],"Properties":[90],"such":[92],"matrix":[94],"utilized":[96],"wafers":[99],"with":[100],"similar":[102],"pattern.":[103],"Also":[104],"included":[105],"our":[107],"method":[112],"select":[114],"more":[120],"suitable":[121],"be":[123],"used":[124],"together":[125],"represent":[127],"view":[132],"proposed":[135],"approach.":[136]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}