{"id":"https://openalex.org/W2137926373","doi":"https://doi.org/10.1109/vts.2002.1011113","title":"Statistical post-processing at wafersort-an alternative to burn-in and a manufacturable solution to test limit setting for sub-micron technologies","display_name":"Statistical post-processing at wafersort-an alternative to burn-in and a manufacturable solution to test limit setting for sub-micron technologies","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2137926373","doi":"https://doi.org/10.1109/vts.2002.1011113","mag":"2137926373"},"language":"en","primary_location":{"id":"doi:10.1109/vts.2002.1011113","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2002.1011113","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings 20th IEEE VLSI Test Symposium (VTS 2002)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5040957547","display_name":"R. Madge","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R. Madge","raw_affiliation_strings":["LSI Logic Corporation, Gresham, OR, USA","LSI Logic Corp., Gresham, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LSI Logic Corporation, Gresham, OR, USA","institution_ids":[]},{"raw_affiliation_string":"LSI Logic Corp., Gresham, OR, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016440687","display_name":"Madan M. Rehani","orcid":"https://orcid.org/0000-0003-3519-1516"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"M. Rehani","raw_affiliation_strings":["LSI Logic Corporation, Gresham, OR, USA","LSI Logic Corp., Gresham, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LSI Logic Corporation, Gresham, OR, USA","institution_ids":[]},{"raw_affiliation_string":"LSI Logic Corp., Gresham, OR, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049760892","display_name":"K. Cota","orcid":"https://orcid.org/0000-0001-6266-0539"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K. Cota","raw_affiliation_strings":["LSI Logic Corporation, Gresham, OR, USA","LSI Logic Corp., Gresham, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"LSI Logic Corporation, Gresham, OR, USA","institution_ids":[]},{"raw_affiliation_string":"LSI Logic Corp., Gresham, OR, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001994622","display_name":"W.R. Daasch","orcid":null},"institutions":[{"id":"https://openalex.org/I126345244","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02","country_code":"US","type":"education","lineage":["https://openalex.org/I126345244"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"W.R. Daasch","raw_affiliation_strings":["Electrical and Computer Engineering Department, Portland State University, USA","PORTLAND STATE UNIVERSITY,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Portland State University, USA","institution_ids":["https://openalex.org/I126345244"]},{"raw_affiliation_string":"PORTLAND STATE UNIVERSITY,","institution_ids":["https://openalex.org/I126345244"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":91,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"69","last_page":"74"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11443","display_name":"Advanced Statistical Process Monitoring","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/1804","display_name":"Statistics, Probability and Uncertainty"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/iddq-testing","display_name":"Iddq testing","score":0.9635685682296753},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6721610426902771},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5935646295547485},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.593174397945404},{"id":"https://openalex.org/keywords/outlier","display_name":"Outlier","score":0.545860230922699},{"id":"https://openalex.org/keywords/burn-in","display_name":"Burn-in","score":0.5038439631462097},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4679383635520935},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.41507041454315186},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4057297110557556},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.22795051336288452},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.1008254885673523}],"concepts":[{"id":"https://openalex.org/C206678392","wikidata":"https://www.wikidata.org/wiki/Q5987815","display_name":"Iddq testing","level":3,"score":0.9635685682296753},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6721610426902771},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5935646295547485},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.593174397945404},{"id":"https://openalex.org/C79337645","wikidata":"https://www.wikidata.org/wiki/Q779824","display_name":"Outlier","level":2,"score":0.545860230922699},{"id":"https://openalex.org/C179707776","wikidata":"https://www.wikidata.org/wiki/Q662895","display_name":"Burn-in","level":2,"score":0.5038439631462097},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4679383635520935},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.41507041454315186},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4057297110557556},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.22795051336288452},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1008254885673523},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vts.2002.1011113","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vts.2002.1011113","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings 20th IEEE VLSI Test Symposium (VTS 2002)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1527363716","https://openalex.org/W1990945016","https://openalex.org/W2098171066","https://openalex.org/W2099245847","https://openalex.org/W2115243262","https://openalex.org/W2120859640","https://openalex.org/W2130404536","https://openalex.org/W2132751984","https://openalex.org/W2168209902"],"related_works":["https://openalex.org/W2127913861","https://openalex.org/W2542038790","https://openalex.org/W2034200035","https://openalex.org/W2075762290","https://openalex.org/W1968794093","https://openalex.org/W2102383741","https://openalex.org/W2111156521","https://openalex.org/W2096030306","https://openalex.org/W2106369940","https://openalex.org/W2078319745"],"abstract_inverted_index":{"In":[0],"sub-micron":[1],"CMOS":[2,99],"processes,":[3],"it":[4],"has":[5],"become":[6],"increasingly":[7],"difficult":[8],"to":[9,23,43],"identify":[10],"and":[11,33,56,69,88,119,125],"separate":[12],"outliers":[13],"from":[14,51],"the":[15,24,47,70,86],"intrinsic":[16],"distribution":[17],"at":[18,92],"test.":[19],"This":[20,83],"is":[21],"due":[22],"increasing":[25],"inadequacy":[26],"of":[27,90,102],"reliability":[28],"screens":[29],"such":[30,65],"as":[31,66,75,77],"burn-in":[32],"IDDQ":[34,63,68],"testing.":[35],"Statistical":[36],"Post-Processing":[37,59],"(SPP)":[38],"methods":[39],"have":[40,105],"been":[41,106],"developed":[42],"run":[44],"off-tester":[45],"using":[46],"raw":[48],"data":[49,117,120,124,132],"generated":[50],"Automatic":[52],"Test":[53],"Equipment":[54],"(ATE)":[55],"wafersort":[57],"maps.":[58],"modules":[60],"include":[61,109],"advanced":[62],"tests":[64],"Delta":[67],"Nearest":[71],"Neighbor":[72],"Residual":[73],"(NNR),":[74],"well":[76],"other":[78],"non-IDDQ":[79],"based":[80],"reliability-focused":[81],"modules.":[82],"work":[84],"presents":[85],"application":[87],"results":[89],"SPP":[91,141],"LSI":[93],"Logic":[94],"on":[95],"0.18":[96],"/spl":[97],"mu/m":[98],"products.":[100],"Challenges":[101],"production":[103],"implementation":[104,142],"overcome,":[107],"which":[108],"\"user":[110],"definable\"":[111],"adaptive":[112],"threshold":[113],"limits,":[114],"handling":[115],"multiple":[116],"sources,":[118],"flow":[121],"management.":[122],"Burn-in":[123],"customer":[126],"Defects":[127],"per":[128],"Million":[129],"units":[130],"(DPM)":[131],"show":[133],"a":[134],"30-60%":[135],"decrease":[136],"in":[137],"failure":[138],"rate":[139],"with":[140,143],"very":[144],"acceptable":[145],"yield":[146],"loss.":[147]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":9},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}