{"id":"https://openalex.org/W2127637822","doi":"https://doi.org/10.1109/vtest.2004.1299262","title":"Design of wireless sub-micron characterization system","display_name":"Design of wireless sub-micron characterization system","publication_year":2004,"publication_date":"2004-06-10","ids":{"openalex":"https://openalex.org/W2127637822","doi":"https://doi.org/10.1109/vtest.2004.1299262","mag":"2127637822"},"language":"en","primary_location":{"id":"doi:10.1109/vtest.2004.1299262","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vtest.2004.1299262","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"22nd IEEE VLSI Test Symposium, 2004. Proceedings.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110255845","display_name":"B. Moore","orcid":null},"institutions":[{"id":"https://openalex.org/I154425047","display_name":"University of Alberta","ror":"https://ror.org/0160cpw27","country_code":"CA","type":"education","lineage":["https://openalex.org/I154425047"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"B. Moore","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Alberta, Edmonton, AB, Canada","[Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada]"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Alberta, Edmonton, AB, Canada","institution_ids":["https://openalex.org/I154425047"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada]","institution_ids":["https://openalex.org/I154425047"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113957001","display_name":"C. Backhouse","orcid":null},"institutions":[{"id":"https://openalex.org/I154425047","display_name":"University of Alberta","ror":"https://ror.org/0160cpw27","country_code":"CA","type":"education","lineage":["https://openalex.org/I154425047"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"C. Backhouse","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Alberta, Edmonton, AB, Canada","[Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada]"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Alberta, Edmonton, AB, Canada","institution_ids":["https://openalex.org/I154425047"]},{"raw_affiliation_string":"[Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada]","institution_ids":["https://openalex.org/I154425047"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5062664944","display_name":"Martin Margala","orcid":"https://orcid.org/0000-0002-0034-0369"},"institutions":[{"id":"https://openalex.org/I5388228","display_name":"University of Rochester","ror":"https://ror.org/022kthw22","country_code":"US","type":"education","lineage":["https://openalex.org/I5388228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Margala","raw_affiliation_strings":["Electrical and Computer Engineering Department, University of Rochester, Rochester, NY, USA","[Electrical and Computer Engineering Department, University of Rochester, Rochester, NY, USA]"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, University of Rochester, Rochester, NY, USA","institution_ids":["https://openalex.org/I5388228"]},{"raw_affiliation_string":"[Electrical and Computer Engineering Department, University of Rochester, Rochester, NY, USA]","institution_ids":["https://openalex.org/I5388228"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5110255845"],"corresponding_institution_ids":["https://openalex.org/I154425047"],"apc_list":null,"apc_paid":null,"fwci":0.9875,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.77847915,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"341","last_page":"346"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5774266719818115},{"id":"https://openalex.org/keywords/pentium","display_name":"Pentium","score":0.5649248957633972},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5626484751701355},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5452490448951721},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5410013198852539},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.5257381200790405},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4877825379371643},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.47952842712402344},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.45895180106163025},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.42168229818344116},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.41550740599632263},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.37378185987472534},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.33538442850112915},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3165464997291565},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.29792654514312744},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08647581934928894}],"concepts":[{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5774266719818115},{"id":"https://openalex.org/C46268123","wikidata":"https://www.wikidata.org/wiki/Q214314","display_name":"Pentium","level":2,"score":0.5649248957633972},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5626484751701355},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5452490448951721},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5410013198852539},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.5257381200790405},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4877825379371643},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.47952842712402344},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.45895180106163025},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.42168229818344116},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.41550740599632263},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.37378185987472534},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.33538442850112915},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3165464997291565},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29792654514312744},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08647581934928894},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vtest.2004.1299262","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vtest.2004.1299262","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"22nd IEEE VLSI Test Symposium, 2004. Proceedings.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8399999737739563}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2057809047","https://openalex.org/W2086103622","https://openalex.org/W2145236323","https://openalex.org/W2156947018","https://openalex.org/W2567126972"],"related_works":["https://openalex.org/W2116620167","https://openalex.org/W2105083391","https://openalex.org/W1930417231","https://openalex.org/W2556440621","https://openalex.org/W2064422425","https://openalex.org/W1988044158","https://openalex.org/W1798614781","https://openalex.org/W1551536576","https://openalex.org/W2144933802","https://openalex.org/W2103584495","https://openalex.org/W2168365801","https://openalex.org/W3151648398","https://openalex.org/W1816183677","https://openalex.org/W2106845104","https://openalex.org/W2149516331","https://openalex.org/W1714959240","https://openalex.org/W2461380370","https://openalex.org/W2161647982","https://openalex.org/W2979663376","https://openalex.org/W2116792211"],"abstract_inverted_index":{"A":[0,56],"wireless":[1,30],"technique":[2,18],"for":[3],"characterization":[4],"of":[5,26,35,73,103],"very":[6],"large":[7],"scale":[8],"ICs":[9],"and":[10,48,89],"wafers":[11],"is":[12,15,59,63,81],"presented.":[13],"Presented":[14,66],"a":[16,104],"test":[17],"that":[19,60],"uses":[20],"standard":[21],"CMOS":[22],"without":[23],"the":[24,94,101],"use":[25],"inductors":[27],"to":[28,83,86],"achieve":[29],"parametric":[31],"testing.":[32],"In":[33],"terms":[34],"existing":[36],"technologies,":[37],"this":[38],"system":[39],"has":[40],"virtually":[41],"no":[42,49],"area":[43,102],"overhead,":[44],"minimal":[45],"power":[46,91],"requirements,":[47],"process":[50],"or":[51],"design":[52],"changes":[53],"are":[54,67],"required.":[55,65],"major":[57],"feature":[58],"wafer/chip":[61],"contact":[62],"not":[64],"specific":[68],"circuit":[69,79],"simulations":[70],"showing":[71],"characteristics":[72],"operation":[74,80],"under":[75],"varying":[76],"conditions.":[77],"The":[78],"shown":[82],"work":[84],"down":[85],"1":[87],"volt":[88],"sub-milliwatt":[90],"level":[92],"at":[93],"same":[95],"time":[96],"as":[97],"being":[98],"1/10,000/sup":[99],"th/":[100],"Pentium":[105],"class":[106],"VLSI":[107],"circuit.":[108]},"counts_by_year":[{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}