{"id":"https://openalex.org/W4286571728","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249","title":"NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging","display_name":"NetFlex: A 22nm Multi-Chiplet Perception Accelerator in High-Density Fan-Out Wafer-Level Packaging","publication_year":2022,"publication_date":"2022-06-12","ids":{"openalex":"https://openalex.org/W4286571728","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249"},"language":"en","primary_location":{"id":"doi:10.1109/vlsitechnologyandcir46769.2022.9830249","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249","pdf_url":null,"source":{"id":"https://openalex.org/S4363605407","display_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016243013","display_name":"Teyuh Chou","orcid":"https://orcid.org/0000-0001-7033-336X"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Teyuh Chou","raw_affiliation_strings":["University of Michigan,Ann Arbor,MI,USA","University of Michigan, Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan,Ann Arbor,MI,USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063342536","display_name":"Wei Tang","orcid":"https://orcid.org/0000-0001-5204-9728"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei Tang","raw_affiliation_strings":["University of Michigan,Ann Arbor,MI,USA","University of Michigan, Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan,Ann Arbor,MI,USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090585637","display_name":"Mihai Rotaru","orcid":"https://orcid.org/0000-0002-4847-1923"},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Mihai D. Rotaru","raw_affiliation_strings":["A*Star,Institute of Microelectronics,Singapore","Institute of Microelectronics, A*Star, Singapore"],"affiliations":[{"raw_affiliation_string":"A*Star,Institute of Microelectronics,Singapore","institution_ids":["https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, A*Star, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041944874","display_name":"Chester Liu","orcid":"https://orcid.org/0000-0003-0115-9630"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chester Liu","raw_affiliation_strings":["University of Michigan,Ann Arbor,MI,USA","University of Michigan, Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan,Ann Arbor,MI,USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007450156","display_name":"Rahul Dutta","orcid":"https://orcid.org/0000-0001-5254-6994"},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Rahul Dutta","raw_affiliation_strings":["A*Star,Institute of Microelectronics,Singapore","Institute of Microelectronics, A*Star, Singapore"],"affiliations":[{"raw_affiliation_string":"A*Star,Institute of Microelectronics,Singapore","institution_ids":["https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, A*Star, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006865108","display_name":"Sharon Lim Pei Siang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Sharon Lim Pei Siang","raw_affiliation_strings":["A*Star,Institute of Microelectronics,Singapore","Institute of Microelectronics, A*Star, Singapore"],"affiliations":[{"raw_affiliation_string":"A*Star,Institute of Microelectronics,Singapore","institution_ids":["https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, A*Star, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079149253","display_name":"David Ho Soon Wee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"David Ho Soon Wee","raw_affiliation_strings":["A*Star,Institute of Microelectronics,Singapore","Institute of Microelectronics, A*Star, Singapore"],"affiliations":[{"raw_affiliation_string":"A*Star,Institute of Microelectronics,Singapore","institution_ids":["https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, A*Star, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Surya Bhattacharya","orcid":null},"institutions":[{"id":"https://openalex.org/I4210090209","display_name":"Institute of Microelectronics","ror":"https://ror.org/009rw8n36","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210090209","https://openalex.org/I91275662"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Surya Bhattacharya","raw_affiliation_strings":["A*Star,Institute of Microelectronics,Singapore","Institute of Microelectronics, A*Star, Singapore"],"affiliations":[{"raw_affiliation_string":"A*Star,Institute of Microelectronics,Singapore","institution_ids":["https://openalex.org/I4210090209"]},{"raw_affiliation_string":"Institute of Microelectronics, A*Star, Singapore","institution_ids":["https://openalex.org/I4210090209"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038110244","display_name":"Zhengya Zhang","orcid":"https://orcid.org/0000-0001-5963-9018"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhengya Zhang","raw_affiliation_strings":["University of Michigan,Ann Arbor,MI,USA","University of Michigan, Ann Arbor, MI, USA"],"affiliations":[{"raw_affiliation_string":"University of Michigan,Ann Arbor,MI,USA","institution_ids":["https://openalex.org/I27837315"]},{"raw_affiliation_string":"University of Michigan, Ann Arbor, MI, USA","institution_ids":["https://openalex.org/I27837315"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5016243013"],"corresponding_institution_ids":["https://openalex.org/I27837315"],"apc_list":null,"apc_paid":null,"fwci":2.559,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.90798707,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"208","last_page":"209"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10531","display_name":"Advanced Vision and Imaging","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13114","display_name":"Image Processing Techniques and Applications","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7217928171157837},{"id":"https://openalex.org/keywords/deconvolution","display_name":"Deconvolution","score":0.6621628999710083},{"id":"https://openalex.org/keywords/convolution","display_name":"Convolution (computer science)","score":0.5098609328269958},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5084656476974487},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.46928298473358154},{"id":"https://openalex.org/keywords/acceleration","display_name":"Acceleration","score":0.4331050515174866},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.42774054408073425},{"id":"https://openalex.org/keywords/fan-out","display_name":"Fan-out","score":0.41401058435440063},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38804811239242554},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36095988750457764},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3412756323814392},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.33842936158180237},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32414472103118896},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.26309287548065186},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18931007385253906},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.172929584980011},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10013926029205322},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.09495371580123901}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7217928171157837},{"id":"https://openalex.org/C174576160","wikidata":"https://www.wikidata.org/wiki/Q1183700","display_name":"Deconvolution","level":2,"score":0.6621628999710083},{"id":"https://openalex.org/C45347329","wikidata":"https://www.wikidata.org/wiki/Q5166604","display_name":"Convolution (computer science)","level":3,"score":0.5098609328269958},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5084656476974487},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.46928298473358154},{"id":"https://openalex.org/C117896860","wikidata":"https://www.wikidata.org/wiki/Q11376","display_name":"Acceleration","level":2,"score":0.4331050515174866},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.42774054408073425},{"id":"https://openalex.org/C68812741","wikidata":"https://www.wikidata.org/wiki/Q636609","display_name":"Fan-out","level":3,"score":0.41401058435440063},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38804811239242554},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36095988750457764},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3412756323814392},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.33842936158180237},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32414472103118896},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.26309287548065186},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18931007385253906},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.172929584980011},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10013926029205322},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.09495371580123901},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.0},{"id":"https://openalex.org/C74650414","wikidata":"https://www.wikidata.org/wiki/Q11397","display_name":"Classical mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vlsitechnologyandcir46769.2022.9830249","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830249","pdf_url":null,"source":{"id":"https://openalex.org/S4363605407","display_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.6600000262260437,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2369061952","https://openalex.org/W2367122702","https://openalex.org/W1601492201","https://openalex.org/W2116729961","https://openalex.org/W2132989621","https://openalex.org/W2015447694","https://openalex.org/W2383495548","https://openalex.org/W1907528524","https://openalex.org/W2370645350","https://openalex.org/W1969590113"],"abstract_inverted_index":{"NetFlex":[0,21,39,60,81],"is":[1],"a":[2,11,17,50,72,86],"multi-chiplet":[3,51],"package":[4],"(MCP)":[5],"for":[6,14,94,99],"CNN-based":[7],"perception":[8],"acceleration.":[9],"With":[10],"balanced":[12],"parallelism":[13],"mapping":[15],"and":[16,26,34,44,64,77,97],"flexible":[18],"scheduling,":[19],"the":[20],"chiplet":[22,61],"supports":[23],"convolution,":[24],"deconvolution":[25],"fully":[27],"connected":[28],"layers":[29],"of":[30,75],"different":[31],"shapes,":[32],"sizes":[33],"strides":[35],"at":[36,71],"high":[37],"utilization.":[38],"adopts":[40],"depth-first":[41],"stream":[42],"processing":[43],"an":[45],"efficient":[46],"streaming":[47],"interface":[48],"in":[49,85],"daisy":[52],"chain":[53],"over":[54],"Advanced":[55],"Interface":[56],"Bus.":[57],"A":[58,79],"22nm":[59],"was":[62,83],"fabricated":[63],"measured":[65],"to":[66,91],"achieve":[67],"2.14TOPS/W":[68],"(16b":[69],"OP)":[70],"nominal":[73],"voltage":[74],"0.89V":[76],"492.3MHz.":[78],"four-chiplet":[80],"MCP":[82],"built":[84],"high-density":[87],"fan-out":[88],"wafer-level":[89],"packaging":[90],"demonstrate":[92],"428FPS":[93],"depth":[95],"estimation":[96],"7723FPS":[98],"pose":[100],"estimation.":[101]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}