{"id":"https://openalex.org/W2949714640","doi":"https://doi.org/10.1109/vlsi-dat.2019.8742078","title":"EUVL Optics: Status and Future Perspectives","display_name":"EUVL Optics: Status and Future Perspectives","publication_year":2019,"publication_date":"2019-04-01","ids":{"openalex":"https://openalex.org/W2949714640","doi":"https://doi.org/10.1109/vlsi-dat.2019.8742078","mag":"2949714640"},"language":"en","primary_location":{"id":"doi:10.1109/vlsi-dat.2019.8742078","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsi-dat.2019.8742078","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087124807","display_name":"Winfried Kaiser","orcid":"https://orcid.org/0009-0006-2194-9305"},"institutions":[{"id":"https://openalex.org/I1302207122","display_name":"Carl Zeiss (Germany)","ror":"https://ror.org/02mp31p96","country_code":"DE","type":"company","lineage":["https://openalex.org/I1302207122"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Winfried Kaiser","raw_affiliation_strings":["Carl Zeiss SMT GmbH"],"affiliations":[{"raw_affiliation_string":"Carl Zeiss SMT GmbH","institution_ids":["https://openalex.org/I1302207122"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5087124807"],"corresponding_institution_ids":["https://openalex.org/I1302207122"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.04274711,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9901000261306763,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/extreme-ultraviolet-lithography","display_name":"Extreme ultraviolet lithography","score":0.9771725535392761},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6896739602088928},{"id":"https://openalex.org/keywords/computational-lithography","display_name":"Computational lithography","score":0.4814847707748413},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.4475647509098053},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.43202993273735046},{"id":"https://openalex.org/keywords/next-generation-lithography","display_name":"Next-generation lithography","score":0.4221112132072449},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.38029003143310547},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3669005036354065},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3270307779312134},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.29263636469841003},{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.2068881094455719},{"id":"https://openalex.org/keywords/electron-beam-lithography","display_name":"Electron-beam lithography","score":0.20069149136543274},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.1734716296195984}],"concepts":[{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.9771725535392761},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6896739602088928},{"id":"https://openalex.org/C182873914","wikidata":"https://www.wikidata.org/wiki/Q5157329","display_name":"Computational lithography","level":5,"score":0.4814847707748413},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.4475647509098053},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.43202993273735046},{"id":"https://openalex.org/C163581340","wikidata":"https://www.wikidata.org/wiki/Q1983848","display_name":"Next-generation lithography","level":5,"score":0.4221112132072449},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.38029003143310547},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3669005036354065},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3270307779312134},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.29263636469841003},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.2068881094455719},{"id":"https://openalex.org/C200274948","wikidata":"https://www.wikidata.org/wiki/Q256845","display_name":"Electron-beam lithography","level":4,"score":0.20069149136543274},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.1734716296195984},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vlsi-dat.2019.8742078","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsi-dat.2019.8742078","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Peace, Justice and strong institutions","id":"https://metadata.un.org/sdg/16","score":0.6600000262260437}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2028711229","https://openalex.org/W2625379356","https://openalex.org/W2379570117","https://openalex.org/W2363991779","https://openalex.org/W2076309478","https://openalex.org/W3190396005","https://openalex.org/W2363718331","https://openalex.org/W1988315734","https://openalex.org/W2149415078","https://openalex.org/W2532313240"],"abstract_inverted_index":{"Summary":[0],"form":[1],"only":[2],"given.":[3],"The":[4,53],"complete":[5],"presentation":[6],"was":[7,36],"not":[8],"made":[9],"available":[10],"for":[11],"publication":[12],"as":[13],"part":[14],"of":[15,42,55],"the":[16,29,46,71],"conference":[17],"proceedings.":[18],"For":[19],"more":[20],"than":[21],"50":[22],"years":[23],"Moore's":[24],"Law":[25],"has":[26],"been":[27],"driving":[28],"steady":[30],"progress":[31],"in":[32,68,78],"semiconductor":[33],"technology.":[34],"This":[35],"enabled":[37],"by":[38],"strong":[39],"resolution":[40],"improvements":[41],"lithography":[43],"optics.":[44],"Currently":[45],"next":[47,72],"big":[48],"technology":[49],"step":[50],"is":[51,65,77],"happening:":[52],"introduction":[54],"EUV":[56,74],"Lithography":[57],"into":[58],"chip":[59],"making.":[60],"High":[61,75],"performance":[62],"EUVL":[63],"optics":[64],"now":[66],"produced":[67],"volume.":[69],"Concurrently":[70],"generation,":[73],"NA,":[76],"development.":[79]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}