{"id":"https://openalex.org/W2018538901","doi":"https://doi.org/10.1109/vlsi-dat.2014.6834862","title":"Keep-Out-Zone analysis for three-dimensional ICs","display_name":"Keep-Out-Zone analysis for three-dimensional ICs","publication_year":2014,"publication_date":"2014-04-01","ids":{"openalex":"https://openalex.org/W2018538901","doi":"https://doi.org/10.1109/vlsi-dat.2014.6834862","mag":"2018538901"},"language":"en","primary_location":{"id":"doi:10.1109/vlsi-dat.2014.6834862","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsi-dat.2014.6834862","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://www.researchbank.ac.nz/bitstreams/d43ec496-6f44-4cbf-b400-fa7290974fa7/download","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112768201","display_name":"Mostafa Said","orcid":null},"institutions":[{"id":"https://openalex.org/I32619867","display_name":"Egypt-Japan University of Science and Technology","ror":"https://ror.org/02x66tk73","country_code":"EG","type":"education","lineage":["https://openalex.org/I32619867"]}],"countries":["EG"],"is_corresponding":true,"raw_author_name":"Mostafa Said","raw_affiliation_strings":["Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt","Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt","institution_ids":["https://openalex.org/I32619867"]},{"raw_affiliation_string":"Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt#TAB#","institution_ids":["https://openalex.org/I32619867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103114584","display_name":"Mohamed El-Sayed","orcid":null},"institutions":[{"id":"https://openalex.org/I32619867","display_name":"Egypt-Japan University of Science and Technology","ror":"https://ror.org/02x66tk73","country_code":"EG","type":"education","lineage":["https://openalex.org/I32619867"]}],"countries":["EG"],"is_corresponding":false,"raw_author_name":"Mohamed El-Sayed","raw_affiliation_strings":["Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt","Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt","institution_ids":["https://openalex.org/I32619867"]},{"raw_affiliation_string":"Department of Electronics and Communications, Egypt-Japan University of Science and Technology (E-JUST), Alexandria, Egypt#TAB#","institution_ids":["https://openalex.org/I32619867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070588025","display_name":"Farhad Mehdipour","orcid":"https://orcid.org/0000-0002-0357-6182"},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Farhad Mehdipour","raw_affiliation_strings":["2E-JUST Center, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","E-JUST Center, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan#TAB#"],"affiliations":[{"raw_affiliation_string":"2E-JUST Center, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan","institution_ids":["https://openalex.org/I135598925"]},{"raw_affiliation_string":"E-JUST Center, Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan#TAB#","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5062400897","display_name":"N. Miyakawa","orcid":"https://orcid.org/0000-0002-7088-2438"},"institutions":[{"id":"https://openalex.org/I4210148705","display_name":"Institute of Systems, Information Technologies and Nanotechnologies","ror":"https://ror.org/04j4pme17","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4210148705"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Nobuaki Miyakawa","raw_affiliation_strings":["Institute of Systems, Information Technologies and Nanotechnologies (ISIT), Fukuoka, Japan"],"affiliations":[{"raw_affiliation_string":"Institute of Systems, Information Technologies and Nanotechnologies (ISIT), Fukuoka, Japan","institution_ids":["https://openalex.org/I4210148705"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5112768201"],"corresponding_institution_ids":["https://openalex.org/I32619867"],"apc_list":null,"apc_paid":null,"fwci":0.2093,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.5807465,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.9126638174057007},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.7902095317840576},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.7031220197677612},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4904453456401825},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.47017139196395874},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41201210021972656},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34013962745666504},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.247175395488739},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11024430394172668},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0643010139465332}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.9126638174057007},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.7902095317840576},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.7031220197677612},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4904453456401825},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.47017139196395874},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41201210021972656},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34013962745666504},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.247175395488739},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11024430394172668},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0643010139465332},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/vlsi-dat.2014.6834862","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsi-dat.2014.6834862","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Technical Papers of 2014 International Symposium on VLSI Design, Automation and Test","raw_type":"proceedings-article"},{"id":"pmh:oai:researchbank.ac.nz:10652/3816","is_oa":true,"landing_page_url":"https://hdl.handle.net/10652/3816","pdf_url":"https://www.researchbank.ac.nz/bitstreams/d43ec496-6f44-4cbf-b400-fa7290974fa7/download","source":{"id":"https://openalex.org/S4306401628","display_name":"Unitec Research Bank (Unitec Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I872614749","host_organization_name":"Unitec Institute of Technology","host_organization_lineage":["https://openalex.org/I872614749"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Paper"}],"best_oa_location":{"id":"pmh:oai:researchbank.ac.nz:10652/3816","is_oa":true,"landing_page_url":"https://hdl.handle.net/10652/3816","pdf_url":"https://www.researchbank.ac.nz/bitstreams/d43ec496-6f44-4cbf-b400-fa7290974fa7/download","source":{"id":"https://openalex.org/S4306401628","display_name":"Unitec Research Bank (Unitec Institute of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I872614749","host_organization_name":"Unitec Institute of Technology","host_organization_lineage":["https://openalex.org/I872614749"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Paper"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2018538901.pdf","grobid_xml":"https://content.openalex.org/works/W2018538901.grobid-xml"},"referenced_works_count":11,"referenced_works":["https://openalex.org/W1971322722","https://openalex.org/W1988354418","https://openalex.org/W2060637631","https://openalex.org/W2069570088","https://openalex.org/W2072155733","https://openalex.org/W2074256944","https://openalex.org/W2119428232","https://openalex.org/W2170509098","https://openalex.org/W2475401371","https://openalex.org/W3148440458","https://openalex.org/W4253374773"],"related_works":["https://openalex.org/W2082914599","https://openalex.org/W2756570351","https://openalex.org/W2606427896","https://openalex.org/W2007805353","https://openalex.org/W2132500134","https://openalex.org/W2387433897","https://openalex.org/W2008392873","https://openalex.org/W2100589902","https://openalex.org/W2034830227","https://openalex.org/W2029923468"],"abstract_inverted_index":{"One":[0],"of":[1,4,26,81,109,121,126,142],"main":[2,13],"challenges":[3],"3D-integration":[5],"is":[6,21,32,92,115,128],"the":[7,16,24,29,33,39,50,56,63,69,73,79,85,107,124],"area":[8,47,66,110],"overhead":[9,36,48,83,101,111],"which":[10,20],"has":[11],"two":[12],"causes:":[14],"first":[15],"huge":[17],"TSV":[18],"diameter":[19],"usually":[22],"in":[23,65],"range":[25],"microns,":[27],"and":[28,59,71,89,139],"second":[30],"reason":[31],"Keep-Out-Zone":[34],"(KOZ)":[35],"due":[37],"to":[38,119],"high":[40],"induced":[41],"thermal":[42],"stresses":[43],"during":[44],"fabrication.":[45],"The":[46],"besides":[49],"fabrication":[51,60,74,90,140],"process":[52],"itself":[53],"inversely":[54],"affects":[55],"overall":[57,86,137],"yield":[58,70,138],"cost,":[61],"so":[62],"increase":[64,72],"will":[67],"reduce":[68],"cost.":[75],"In":[76],"this":[77],"paper,":[78],"effect":[80],"KOZ":[82,100,114,127],"on":[84,135],"area,":[87],"yield,":[88],"cost":[91,141],"investigated.":[93],"Also":[94],"various":[95],"parameters":[96],"that":[97,106,120],"might":[98],"change":[99],"are":[102],"examined.":[103],"We":[104],"show":[105],"share":[108],"caused":[112],"by":[113],"considerably":[116],"higher":[117],"compared":[118],"TSVs.":[122],"Further,":[123],"impact":[125],"considered":[129],"for":[130],"obtaining":[131],"more":[132],"accurate":[133],"estimation":[134],"W2W":[136],"a":[143],"3D-IC.":[144]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}