{"id":"https://openalex.org/W2944547677","doi":"https://doi.org/10.1109/uv.2018.8709326","title":"Design, manufacturing and recycling in product lifecycle: New challenges and trends","display_name":"Design, manufacturing and recycling in product lifecycle: New challenges and trends","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2944547677","doi":"https://doi.org/10.1109/uv.2018.8709326","mag":"2944547677"},"language":"en","primary_location":{"id":"doi:10.1109/uv.2018.8709326","is_oa":false,"landing_page_url":"https://doi.org/10.1109/uv.2018.8709326","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 4th International Conference on Universal Village (UV)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010857391","display_name":"Longfei Zhou","orcid":"https://orcid.org/0000-0001-5322-8429"},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Longfei Zhou","raw_affiliation_strings":["Computer Science & Artificial Intelligence Laboratory Massachusetts Institute of Technology Cambridge, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science & Artificial Intelligence Laboratory Massachusetts Institute of Technology Cambridge, MA, USA","institution_ids":["https://openalex.org/I63966007"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Shengsheng Cao","orcid":null},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shengsheng Cao","raw_affiliation_strings":["Institute of Education Tsinghua University Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Education Tsinghua University Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112435315","display_name":"Jiaxin Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiaxin Liu","raw_affiliation_strings":["University of Electronic Science and Technology of China Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Electronic Science and Technology of China Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102327610","display_name":"Tian Tan","orcid":"https://orcid.org/0009-0006-7639-6867"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tian Tan","raw_affiliation_strings":["International Recycling GLE Group Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"International Recycling GLE Group Orlando, FL, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087366165","display_name":"Fuxin Du","orcid":"https://orcid.org/0000-0001-9781-9677"},"institutions":[{"id":"https://openalex.org/I21945476","display_name":"Shanghai Normal University","ror":"https://ror.org/01cxqmw89","country_code":"CN","type":"education","lineage":["https://openalex.org/I21945476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fuxin Du","raw_affiliation_strings":["Coll. of Inf., Mech. & Electr. Eng., Shanghai Normal Univ., Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Coll. of Inf., Mech. & Electr. Eng., Shanghai Normal Univ., Shanghai, China","institution_ids":["https://openalex.org/I21945476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103835188","display_name":"Yajun Fang","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yajun Fang","raw_affiliation_strings":["Comput. Sci. & Artificial Intell. Lab., Massachusetts Inst. of Technol., Boston, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Comput. Sci. & Artificial Intell. Lab., Massachusetts Inst. of Technol., Boston, MA, USA","institution_ids":["https://openalex.org/I1343180700","https://openalex.org/I63966007"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100418969","display_name":"Zhang Li","orcid":"https://orcid.org/0000-0003-1989-6102"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lin Zhang","raw_affiliation_strings":["Sch. of Autom. Sci. & Electr. Eng., Beihang Univ., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Sch. of Autom. Sci. & Electr. Eng., Beihang Univ., Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.995199978351593,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/product-lifecycle","display_name":"Product lifecycle","score":0.81253981590271},{"id":"https://openalex.org/keywords/application-lifecycle-management","display_name":"Application lifecycle management","score":0.6544823050498962},{"id":"https://openalex.org/keywords/process-development-execution-system","display_name":"Process development execution system","score":0.6352699398994446},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.5730161070823669},{"id":"https://openalex.org/keywords/product-management","display_name":"Product management","score":0.5422175526618958},{"id":"https://openalex.org/keywords/product-design","display_name":"Product design","score":0.5344793796539307},{"id":"https://openalex.org/keywords/product-design-specification","display_name":"Product design specification","score":0.5322660803794861},{"id":"https://openalex.org/keywords/product","display_name":"Product (mathematics)","score":0.5167893171310425},{"id":"https://openalex.org/keywords/new-product-development","display_name":"New product development","score":0.5083877444267273},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.4661406874656677},{"id":"https://openalex.org/keywords/product-cost-management","display_name":"Product cost management","score":0.4618600308895111},{"id":"https://openalex.org/keywords/cloud-manufacturing","display_name":"Cloud manufacturing","score":0.45653682947158813},{"id":"https://openalex.org/keywords/advanced-manufacturing","display_name":"Advanced manufacturing","score":0.45047271251678467},{"id":"https://openalex.org/keywords/system-lifecycle","display_name":"System lifecycle","score":0.4447649419307709},{"id":"https://openalex.org/keywords/integrated-computer-aided-manufacturing","display_name":"Integrated Computer-Aided Manufacturing","score":0.43459439277648926},{"id":"https://openalex.org/keywords/product-engineering","display_name":"Product engineering","score":0.4107278883457184},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4050788879394531},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3992632329463959},{"id":"https://openalex.org/keywords/cloud-computing","display_name":"Cloud computing","score":0.3941258192062378},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.19343018531799316},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.06791359186172485}],"concepts":[{"id":"https://openalex.org/C194304873","wikidata":"https://www.wikidata.org/wiki/Q1967338","display_name":"Product lifecycle","level":3,"score":0.81253981590271},{"id":"https://openalex.org/C30452754","wikidata":"https://www.wikidata.org/wiki/Q621590","display_name":"Application lifecycle management","level":3,"score":0.6544823050498962},{"id":"https://openalex.org/C201547687","wikidata":"https://www.wikidata.org/wiki/Q7247240","display_name":"Process development execution system","level":3,"score":0.6352699398994446},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.5730161070823669},{"id":"https://openalex.org/C545102676","wikidata":"https://www.wikidata.org/wiki/Q1780667","display_name":"Product management","level":3,"score":0.5422175526618958},{"id":"https://openalex.org/C120823896","wikidata":"https://www.wikidata.org/wiki/Q1043226","display_name":"Product design","level":3,"score":0.5344793796539307},{"id":"https://openalex.org/C45135082","wikidata":"https://www.wikidata.org/wiki/Q16960030","display_name":"Product design specification","level":4,"score":0.5322660803794861},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.5167893171310425},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.5083877444267273},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4661406874656677},{"id":"https://openalex.org/C129875596","wikidata":"https://www.wikidata.org/wiki/Q7247753","display_name":"Product cost management","level":4,"score":0.4618600308895111},{"id":"https://openalex.org/C2778819808","wikidata":"https://www.wikidata.org/wiki/Q5135707","display_name":"Cloud manufacturing","level":3,"score":0.45653682947158813},{"id":"https://openalex.org/C77854861","wikidata":"https://www.wikidata.org/wiki/Q4686346","display_name":"Advanced manufacturing","level":2,"score":0.45047271251678467},{"id":"https://openalex.org/C35280785","wikidata":"https://www.wikidata.org/wiki/Q559486","display_name":"System lifecycle","level":4,"score":0.4447649419307709},{"id":"https://openalex.org/C150256626","wikidata":"https://www.wikidata.org/wiki/Q6042822","display_name":"Integrated Computer-Aided Manufacturing","level":3,"score":0.43459439277648926},{"id":"https://openalex.org/C121615247","wikidata":"https://www.wikidata.org/wiki/Q7247761","display_name":"Product engineering","level":4,"score":0.4107278883457184},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4050788879394531},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3992632329463959},{"id":"https://openalex.org/C79974875","wikidata":"https://www.wikidata.org/wiki/Q483639","display_name":"Cloud computing","level":2,"score":0.3941258192062378},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.19343018531799316},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.06791359186172485},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/uv.2018.8709326","is_oa":false,"landing_page_url":"https://doi.org/10.1109/uv.2018.8709326","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 4th International Conference on Universal Village (UV)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2073606875","https://openalex.org/W2100585318","https://openalex.org/W2131077880","https://openalex.org/W2748946742","https://openalex.org/W2771973835","https://openalex.org/W2788313200"],"related_works":["https://openalex.org/W2006997784","https://openalex.org/W2088099448","https://openalex.org/W2377019842","https://openalex.org/W2381526485","https://openalex.org/W2749265467","https://openalex.org/W2919763864","https://openalex.org/W2015346596","https://openalex.org/W2079801865","https://openalex.org/W2794754646","https://openalex.org/W2553606283"],"abstract_inverted_index":{"Development":[0],"of":[1,7,46,51,61],"new":[2,16,41,57,62,94,114],"technologies":[3,63],"such":[4,96],"as":[5,97],"Internet":[6],"Things,":[8],"Cloud-based":[9],"Platform":[10],"and":[11,18,27,43,56,68,83,93,100,111],"Artificial":[12],"Intelligence":[13],"has":[14],"brought":[15],"challenges":[17,42,89],"opportunities":[19],"to":[20],"the":[21,30,35,78,107,113],"whole":[22],"product":[23,36,47,65,74],"lifecycle.":[24,37],"Design,":[25],"manufacturing":[26,55,91,99],"recycling":[28,110],"are":[29,70],"most":[31],"important":[32],"stages":[33],"in":[34,49,90,109],"This":[38],"paper":[39],"analyzes":[40],"development":[44],"trends":[45,95],"lifecycle":[48,66],"terms":[50],"individualized":[52],"design,":[53,75],"intelligent":[54,101],"recycling.":[58],"The":[59],"effects":[60],"on":[64],"management":[67],"optimization":[69],"also":[71],"discussed.":[72],"In":[73,85,103],"we":[76,87,105],"discussed":[77,112],"relationship":[79],"between":[80],"requirements,":[81],"design":[82],"products.":[84],"manufacturing,":[86],"analyzed":[88],"processes":[92],"cloud":[98],"manufacturing.":[102],"recycling,":[104],"reviewed":[106],"problems":[108],"methods.":[115]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}