{"id":"https://openalex.org/W7116833739","doi":"https://doi.org/10.1109/tvlsi.2025.3642611","title":"DN-FF: A SEU-Tolerant Flip-Flop Design for Advanced Technology Nodes","display_name":"DN-FF: A SEU-Tolerant Flip-Flop Design for Advanced Technology Nodes","publication_year":2025,"publication_date":"2025-12-23","ids":{"openalex":"https://openalex.org/W7116833739","doi":"https://doi.org/10.1109/tvlsi.2025.3642611"},"language":null,"primary_location":{"id":"doi:10.1109/tvlsi.2025.3642611","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3642611","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079409655","display_name":"Lowry P.-T. Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Lowry P.-T. Wang","raw_affiliation_strings":["Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu City, Taiwan"],"raw_orcid":"https://orcid.org/0009-0006-1334-1332","affiliations":[{"raw_affiliation_string":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu City, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100682308","display_name":"Charles H.\u2010P. Wen","orcid":"https://orcid.org/0000-0003-4623-9941"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Charles H.-P. Wen","raw_affiliation_strings":["Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu City, Taiwan"],"raw_orcid":"https://orcid.org/0000-0003-4623-9941","affiliations":[{"raw_affiliation_string":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu City, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.47648586,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"34","issue":"3","first_page":"1048","last_page":"1052"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.6944000124931335},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.6589000225067139},{"id":"https://openalex.org/keywords/triple-modular-redundancy","display_name":"Triple modular redundancy","score":0.6000999808311462},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5946000218391418},{"id":"https://openalex.org/keywords/aerospace","display_name":"Aerospace","score":0.553600013256073},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.4961000084877014},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.48969998955726624},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.45570001006126404},{"id":"https://openalex.org/keywords/efficient-energy-use","display_name":"Efficient energy use","score":0.4050999879837036}],"concepts":[{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.6944000124931335},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.6589000225067139},{"id":"https://openalex.org/C196371267","wikidata":"https://www.wikidata.org/wiki/Q3998979","display_name":"Triple modular redundancy","level":3,"score":0.6000999808311462},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5946000218391418},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5662999749183655},{"id":"https://openalex.org/C167740415","wikidata":"https://www.wikidata.org/wiki/Q2876213","display_name":"Aerospace","level":2,"score":0.553600013256073},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.4961000084877014},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.48969998955726624},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.47920000553131104},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.45570001006126404},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4174000024795532},{"id":"https://openalex.org/C2742236","wikidata":"https://www.wikidata.org/wiki/Q924713","display_name":"Efficient energy use","level":2,"score":0.4050999879837036},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.39800000190734863},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.38089999556541443},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.37630000710487366},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.35350000858306885},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.33169999718666077},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.3149999976158142},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3107999861240387},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.29010000824928284},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.27559998631477356},{"id":"https://openalex.org/C77304879","wikidata":"https://www.wikidata.org/wiki/Q211485","display_name":"Space technology","level":2,"score":0.27090001106262207},{"id":"https://openalex.org/C131017901","wikidata":"https://www.wikidata.org/wiki/Q170451","display_name":"Logic gate","level":2,"score":0.2702000141143799},{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.26499998569488525},{"id":"https://openalex.org/C2776221188","wikidata":"https://www.wikidata.org/wiki/Q21072556","display_name":"Design space exploration","level":2,"score":0.2646999955177307},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2612999975681305},{"id":"https://openalex.org/C165696696","wikidata":"https://www.wikidata.org/wiki/Q11287","display_name":"Exploit","level":2,"score":0.2605000138282776},{"id":"https://openalex.org/C2778520156","wikidata":"https://www.wikidata.org/wiki/Q449343","display_name":"Automotive electronics","level":3,"score":0.25529998540878296},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2529999911785126}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2025.3642611","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3642611","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6707428097724915,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G6328731076","display_name":null,"funder_award_id":"NSTC 114-2640-E-A49-001-","funder_id":"https://openalex.org/F4320336569","funder_display_name":"Shenzhen Science and Technology Innovation Program"},{"id":"https://openalex.org/G7904363345","display_name":null,"funder_award_id":"NSTC 114-2221-E-A49-171-MY2","funder_id":"https://openalex.org/F4320331164","funder_display_name":"National Science and Technology Council"}],"funders":[{"id":"https://openalex.org/F4320331164","display_name":"National Science and Technology Council","ror":"https://ror.org/00wnb9798"},{"id":"https://openalex.org/F4320336569","display_name":"Shenzhen Science and Technology Innovation Program","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"Single-event":[0],"upsets":[1],"(SEUs)":[2],"pose":[3],"a":[4,79,111,152,166],"critical":[5],"reliability":[6],"threat":[7],"in":[8,90,155],"advanced":[9,53],"automotive":[10,174],"and":[11,25,110,126,147,169,175],"space":[12,34],"electronics.":[13],"While":[14],"existing":[15],"SEU-tolerant":[16],"latch":[17],"designs,":[18],"such":[19],"as":[20],"those":[21],"based":[22],"on":[23],"C-elements":[24],"unique":[26],"modules,":[27],"often":[28],"fail":[29],"to":[30,102,130],"meet":[31],"the":[32,156],"stringent":[33],"radiation":[35],"standards":[36],"(linear":[37],"energy":[38],"transfer":[39],"(LET)":[40],"<inline-formula":[41],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[42],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[43],"<tex-math":[44],"notation=\"LaTeX\">$=":[45],"60~\\text":[46],"{MeV}":[47],"\\cdot":[48],"\\text":[49],"{cm}^{2}$</tex-math>":[50],"</inline-formula>/mg)":[51],"at":[52],"fin":[54],"field-effect":[55],"transistor":[56],"(FinFET)":[57],"technology":[58],"nodes,":[59],"triple":[60],"modular":[61],"redundancy":[62],"(TMR)":[63],"achieves":[64,117],"sufficient":[65],"tolerance":[66],"but":[67],"incurs":[68],"significant":[69],"overhead.":[70],"To":[71],"address":[72],"these":[73],"limitations,":[74],"this":[75],"brief":[76],"introduces":[77],"DN-FF,":[78],"novel":[80],"detection-node":[81],"flip-flop":[82],"(DN-FF)":[83],"architecture":[84],"that":[85,138],"leverages":[86],"reduced":[87,99],"node":[88],"spacing":[89],"modern":[91],"processes":[92],"for":[93,172],"complete":[94],"SEU":[95],"immunity":[96],"with":[97],"significantly":[98,121],"overhead":[100],"compared":[101,129],"TMR.":[103],"Incorporating":[104],"strategically":[105],"placed":[106],"detection":[107,113],"nodes":[108],"(DNs)":[109],"dedicated":[112],"circuit":[114],"(DC),":[115],"DN-FF":[116,139,165],"robust":[118],"radiation-hardness":[119],"while":[120],"reducing":[122],"physical":[123],"area,":[124],"delay,":[125],"power":[127,148],"consumption":[128],"traditional":[131],"TMR-based":[132],"solutions.":[133],"The":[134],"experimental":[135],"results":[136],"demonstrate":[137],"reduces":[140],"area":[141],"by":[142,145,149],"8.2%,":[143],"delay":[144],"18.4%,":[146],"15.9%,":[150],"delivering":[151],"37%":[153],"improvement":[154],"overall":[157],"area\u2013delay\u2013power":[158],"quality":[159],"(ADPQ)":[160],"metric.":[161],"These":[162],"advantages":[163],"make":[164],"compact,":[167],"high-performance,":[168],"reliable":[170],"solution":[171],"demanding":[173],"aerospace":[176],"applications.":[177]},"counts_by_year":[],"updated_date":"2026-02-26T06:29:33.603293","created_date":"2025-12-23T00:00:00"}