{"id":"https://openalex.org/W4410427551","doi":"https://doi.org/10.1109/tvlsi.2025.3566468","title":"A 3D Unified Analysis Method (3D-UAM) for Wafer-on-Wafer Stacked Near-Memory Structure","display_name":"A 3D Unified Analysis Method (3D-UAM) for Wafer-on-Wafer Stacked Near-Memory Structure","publication_year":2025,"publication_date":"2025-05-16","ids":{"openalex":"https://openalex.org/W4410427551","doi":"https://doi.org/10.1109/tvlsi.2025.3566468"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2025.3566468","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3566468","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101416294","display_name":"Song Wang","orcid":"https://orcid.org/0000-0002-7682-5987"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Song Wang","raw_affiliation_strings":["School of Microelectronics, University of Science and Technology of China, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0002-7682-5987","affiliations":[{"raw_affiliation_string":"School of Microelectronics, University of Science and Technology of China, Hefei, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047044527","display_name":"Yixin Guo","orcid":"https://orcid.org/0000-0001-8887-595X"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yixin Guo","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0001-8887-595X","affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Wei Tao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Tao","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087004940","display_name":"Xuerong Jia","orcid":"https://orcid.org/0009-0001-6652-1859"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuerong Jia","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0001-6652-1859","affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026808971","display_name":"Fujun Bai","orcid":"https://orcid.org/0000-0002-7971-5986"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fujun Bai","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0002-7971-5986","affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037083362","display_name":"Jie Tan","orcid":"https://orcid.org/0000-0003-3603-6147"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Tan","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101820106","display_name":"Yubing Wang","orcid":"https://orcid.org/0000-0003-2444-1030"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yubing Wang","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046818326","display_name":"Liang Bai","orcid":"https://orcid.org/0000-0002-0380-2995"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liang Bai","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104285399","display_name":"Fuzhi Guo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fuzhi Guo","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100453158","display_name":"Qi Liu","orcid":"https://orcid.org/0000-0001-7062-831X"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Liu","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100364845","display_name":"Jin Li","orcid":"https://orcid.org/0000-0003-4461-5309"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jin Li","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104217526","display_name":"Peng Yin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Yin","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044274815","display_name":"Fenning Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fenning Liu","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100374998","display_name":"Jing Liu","orcid":"https://orcid.org/0000-0002-3588-2969"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jing Liu","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037293493","display_name":"Xiaodong Long","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaodong Long","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yanwu Han","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yanwu Han","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109483512","display_name":"Zhongcheng Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhongcheng Yu","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114101772","display_name":"M. D. Cheng","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mengzi Cheng","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0007-6550-3548","affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100423614","display_name":"Song Chen","orcid":"https://orcid.org/0000-0003-0341-3428"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Song Chen","raw_affiliation_strings":["School of Microelectronics, University of Science and Technology of China, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0003-0341-3428","affiliations":[{"raw_affiliation_string":"School of Microelectronics, University of Science and Technology of China, Hefei, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103076876","display_name":"Xiping Jiang","orcid":"https://orcid.org/0000-0002-7942-9576"},"institutions":[{"id":"https://openalex.org/I4210148388","display_name":"Xi'an UniIC Semiconductors (China)","ror":"https://ror.org/04c99ac72","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210148388"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiping Jiang","raw_affiliation_strings":["Xi’an UniIC Semiconductors, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0002-7942-9576","affiliations":[{"raw_affiliation_string":"Xi’an UniIC Semiconductors, Xi’an, China","institution_ids":["https://openalex.org/I4210148388"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.06378667,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"33","issue":"8","first_page":"2186","last_page":"2199"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9860000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9860000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9656000137329102,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9545999765396118,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.9266780614852905},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5745348930358887},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.45153480768203735},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.42178183794021606},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35770294070243835},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32779058814048767},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2183477282524109},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.14027518033981323}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.9266780614852905},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5745348930358887},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.45153480768203735},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42178183794021606},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35770294070243835},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32779058814048767},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2183477282524109},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.14027518033981323}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2025.3566468","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3566468","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1085865041","display_name":null,"funder_award_id":"92473114","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":46,"referenced_works":["https://openalex.org/W1993815004","https://openalex.org/W2179691660","https://openalex.org/W2622148586","https://openalex.org/W2737694977","https://openalex.org/W2805362231","https://openalex.org/W2921796727","https://openalex.org/W2947256767","https://openalex.org/W3011687903","https://openalex.org/W3013080934","https://openalex.org/W3015213525","https://openalex.org/W3033898041","https://openalex.org/W3095571208","https://openalex.org/W3108655216","https://openalex.org/W3134274954","https://openalex.org/W3136346557","https://openalex.org/W3174762441","https://openalex.org/W3202731849","https://openalex.org/W3210415351","https://openalex.org/W4200550987","https://openalex.org/W4210588783","https://openalex.org/W4220702013","https://openalex.org/W4220972538","https://openalex.org/W4223527846","https://openalex.org/W4229447288","https://openalex.org/W4293146975","https://openalex.org/W4293251144","https://openalex.org/W4295037214","https://openalex.org/W4306938157","https://openalex.org/W4312532564","https://openalex.org/W4312831647","https://openalex.org/W4321499783","https://openalex.org/W4322727956","https://openalex.org/W4382502002","https://openalex.org/W4385192563","https://openalex.org/W4385452958","https://openalex.org/W4385567949","https://openalex.org/W4386826409","https://openalex.org/W4388282125","https://openalex.org/W4391594310","https://openalex.org/W4393145114","https://openalex.org/W4393167311","https://openalex.org/W4393405473","https://openalex.org/W4393407316","https://openalex.org/W4398142203","https://openalex.org/W4402041074","https://openalex.org/W4403136431"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W4404995717","https://openalex.org/W2016187641","https://openalex.org/W4404725684","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W4409278740","https://openalex.org/W2898370298","https://openalex.org/W4410118003","https://openalex.org/W2137437058"],"abstract_inverted_index":{"The":[0,75,93,115],"wafer-on-wafer":[1],"(WoW)":[2],"stacked":[3,51,111,139],"structure":[4,52,130],"exhibits":[5],"pioneering":[6],"advantages":[7],"in":[8,14],"near-memory":[9],"computing":[10],"but":[11],"encounters":[12],"challenges":[13],"3D":[15,35,49,59,90],"analysis":[16,37,46,84,102,135],"due":[17],"to":[18],"the":[19,26,48,66,78,86,89,96,104,109,118,137],"miniaturization":[20],"of":[21,28,77,88,95,117],"vertical":[22,29,60],"connection":[23,61],"structures":[24],"and":[25,72,131],"simplification":[27],"drivers.":[30],"This":[31],"article":[32],"introduces":[33],"a":[34,57,126],"unified":[36],"method":[38],"(3D-UAM),":[39],"which":[40],"facilitates":[41],"standard-cell-level":[42],"signal":[43],"integrity":[44,133],"(SI)":[45],"across":[47],"WoW":[50,110,129,138],"with":[53,85,103],"hybrid":[54],"processes,":[55],"including":[56],"comprehensive":[58],"theoretical":[62],"model":[63],"that":[64],"bridges":[65],"dynamic":[67],"random":[68],"access":[69],"memory":[70],"(DRAM)":[71],"logic":[73],"netlists.":[74],"accuracy":[76],"3D-UAM":[79,97,119],"is":[80,98,120],"confirmed":[81],"through":[82,100,122],"consistency":[83],"results":[87,107],"field":[91],"model.":[92],"authenticity":[94],"validated":[99],"correlation":[101],"physical":[105],"test":[106,113],"from":[108],"DRAM":[112,128],"chip.":[114],"practicality":[116],"demonstrated":[121],"channel":[123],"optimization":[124],"on":[125],"20-layer":[127],"power":[132],"(PI)":[134],"for":[136],"structure.":[140]},"counts_by_year":[],"updated_date":"2026-07-21T08:15:58.654021","created_date":"2025-10-10T00:00:00"}