{"id":"https://openalex.org/W4410029420","doi":"https://doi.org/10.1109/tvlsi.2025.3562769","title":"Design of Nonvolatile and Multinode-Upset Recoverable Latches Based on Magnetic Tunnel Junction and CMOS","display_name":"Design of Nonvolatile and Multinode-Upset Recoverable Latches Based on Magnetic Tunnel Junction and CMOS","publication_year":2025,"publication_date":"2025-05-02","ids":{"openalex":"https://openalex.org/W4410029420","doi":"https://doi.org/10.1109/tvlsi.2025.3562769"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2025.3562769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3562769","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-05372767/document","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072439444","display_name":"Aibin Yan","orcid":"https://orcid.org/0000-0003-0024-987X"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Aibin Yan","raw_affiliation_strings":["School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0003-0024-987X","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101628513","display_name":"Yongkang Xu","orcid":"https://orcid.org/0009-0002-6408-0196"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yongkang Xu","raw_affiliation_strings":["School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100333647","display_name":"Yue Zhang","orcid":"https://orcid.org/0000-0001-6893-7199"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yue Zhang","raw_affiliation_strings":["School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073320985","display_name":"Na Bai","orcid":"https://orcid.org/0000-0001-9596-8142"},"institutions":[{"id":"https://openalex.org/I143868143","display_name":"Anhui University","ror":"https://ror.org/05th6yx34","country_code":"CN","type":"education","lineage":["https://openalex.org/I143868143"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Na Bai","raw_affiliation_strings":["School of Integrated Circuits, Anhui University, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0001-9596-8142","affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Anhui University, Hefei, China","institution_ids":["https://openalex.org/I143868143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073810494","display_name":"Zhengfeng Huang","orcid":"https://orcid.org/0000-0001-8695-4478"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhengfeng Huang","raw_affiliation_strings":["School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0001-8695-4478","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085987622","display_name":"Tianming Ni","orcid":"https://orcid.org/0000-0001-6272-8660"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianming Ni","raw_affiliation_strings":["School of Integrated Circuits, Anhui Polytechnic University, Wuhu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Anhui Polytechnic University, Wuhu, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005116115","display_name":"Patrick Girard","orcid":"https://orcid.org/0000-0003-0722-8772"},"institutions":[{"id":"https://openalex.org/I19894307","display_name":"Universit\u00e9 de Montpellier","ror":"https://ror.org/051escj72","country_code":"FR","type":"education","lineage":["https://openalex.org/I19894307"]},{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4405261681"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Patrick Girard","raw_affiliation_strings":["LIRMM Laboratory, University of Montpellier, Montpellier, France"],"raw_orcid":"https://orcid.org/0000-0003-0722-8772","affiliations":[{"raw_affiliation_string":"LIRMM Laboratory, University of Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743","https://openalex.org/I19894307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084697545","display_name":"Xiaoqing Wen","orcid":"https://orcid.org/0000-0001-8305-604X"},"institutions":[{"id":"https://openalex.org/I207014233","display_name":"Kyushu Institute of Technology","ror":"https://ror.org/02278tr80","country_code":"JP","type":"education","lineage":["https://openalex.org/I207014233"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Xiaoqing Wen","raw_affiliation_strings":["School of Computer Science and Networks, Kyushu Institute of Technology, Fukuoka, Japan"],"raw_orcid":"https://orcid.org/0000-0001-8305-604X","affiliations":[{"raw_affiliation_string":"School of Computer Science and Networks, Kyushu Institute of Technology, Fukuoka, Japan","institution_ids":["https://openalex.org/I207014233"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.5278,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.80718732,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":97},"biblio":{"volume":"33","issue":"7","first_page":"2079","last_page":"2083"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12405","display_name":"Characterization and Applications of Magnetic Nanoparticles","score":0.9939000010490417,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12692","display_name":"Magnetic Field Sensors Techniques","score":0.9897000193595886,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/upset","display_name":"Upset","score":0.7736648917198181},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7378981113433838},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5587368607521057},{"id":"https://openalex.org/keywords/tunnel-magnetoresistance","display_name":"Tunnel magnetoresistance","score":0.47744518518447876},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3671477437019348},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3471866846084595},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3383287787437439},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1431351900100708},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.1404050588607788}],"concepts":[{"id":"https://openalex.org/C2778002589","wikidata":"https://www.wikidata.org/wiki/Q2406791","display_name":"Upset","level":2,"score":0.7736648917198181},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7378981113433838},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5587368607521057},{"id":"https://openalex.org/C56202322","wikidata":"https://www.wikidata.org/wiki/Q1884383","display_name":"Tunnel magnetoresistance","level":3,"score":0.47744518518447876},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3671477437019348},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3471866846084595},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3383287787437439},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1431351900100708},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.1404050588607788},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tvlsi.2025.3562769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3562769","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},{"id":"pmh:oai:HAL:lirmm-05372767v1","is_oa":true,"landing_page_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-05372767","pdf_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-05372767/document","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2025, 33 (7), pp.2079-2083. ⟨10.1109/TVLSI.2025.3562769⟩","raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":{"id":"pmh:oai:HAL:lirmm-05372767v1","is_oa":true,"landing_page_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-05372767","pdf_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-05372767/document","source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2025, 33 (7), pp.2079-2083. ⟨10.1109/TVLSI.2025.3562769⟩","raw_type":"info:eu-repo/semantics/article"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2595105183","display_name":null,"funder_award_id":"62274052","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G2747975400","display_name":null,"funder_award_id":"62027815","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4466268022","display_name":null,"funder_award_id":"202304a05020003","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7059867690","display_name":null,"funder_award_id":"62174001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4410029420.pdf","grobid_xml":"https://content.openalex.org/works/W4410029420.grobid-xml"},"referenced_works_count":18,"referenced_works":["https://openalex.org/W101262089","https://openalex.org/W2112388836","https://openalex.org/W2303314981","https://openalex.org/W2613758857","https://openalex.org/W2769731910","https://openalex.org/W2783914575","https://openalex.org/W2888910753","https://openalex.org/W2895216356","https://openalex.org/W2954322948","https://openalex.org/W2980855339","https://openalex.org/W3010963881","https://openalex.org/W3110013108","https://openalex.org/W4387757633","https://openalex.org/W4391468693","https://openalex.org/W4394564081","https://openalex.org/W4399110696","https://openalex.org/W4401943659","https://openalex.org/W4406727903"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2028180791","https://openalex.org/W607682241","https://openalex.org/W320153218","https://openalex.org/W2352434195","https://openalex.org/W2619155","https://openalex.org/W2361293896","https://openalex.org/W1968403090","https://openalex.org/W1490775144","https://openalex.org/W2139254480"],"abstract_inverted_index":{"Spintronic":[0],"devices,":[1],"such":[2],"as":[3,21,36,38],"magnetic":[4],"tunnel":[5],"junctions":[6],"(MTJs),":[7],"are":[8,28],"promising":[9],"for":[10],"space":[11],"applications":[12],"due":[13],"to":[14,31],"their":[15],"radiation":[16],"hardness":[17],"and":[18,48,56,63,77],"nonvolatility.":[19],"However,":[20],"semiconductor":[22],"technology":[23],"advances,":[24],"CMOS":[25],"peripheral":[26],"circuits":[27],"becoming":[29],"vulnerable":[30],"double":[32],"node":[33,40],"upset":[34,41],"(DNU)":[35],"well":[37],"triple":[39],"(TNU).":[42],"This":[43],"brief":[44],"proposes":[45],"two":[46],"nonvolatile":[47],"robust":[49],"latch":[50],"designs":[51,60],"primarily":[52],"composed":[53],"of":[54],"MTJs":[55],"C-elements":[57],"(CEs).":[58],"Both":[59],"offer":[61],"nonvolatility":[62,76],"self-recovery":[64],"from":[65],"multiple-node":[66,81],"upsets.":[67],"Simulation":[68],"results":[69],"demonstrate":[70],"that":[71],"the":[72],"proposed":[73],"latches":[74],"provide":[75],"complete":[78],"protection":[79],"against":[80],"upsets":[82],"with":[83],"balanced":[84],"overhead.":[85]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}