{"id":"https://openalex.org/W4408305062","doi":"https://doi.org/10.1109/tvlsi.2025.3545604","title":"Thermal Simulator for Advanced Packaging and Chiplet-Based Systems","display_name":"Thermal Simulator for Advanced Packaging and Chiplet-Based Systems","publication_year":2025,"publication_date":"2025-03-11","ids":{"openalex":"https://openalex.org/W4408305062","doi":"https://doi.org/10.1109/tvlsi.2025.3545604"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2025.3545604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3545604","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088527176","display_name":"Yousef Safari","orcid":"https://orcid.org/0000-0002-8352-2538"},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Yousef Safari","raw_affiliation_strings":["Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada"],"raw_orcid":"https://orcid.org/0000-0002-8352-2538","affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5092589603","display_name":"Adam Corbier","orcid":null},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Adam Corbier","raw_affiliation_strings":["Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada"],"raw_orcid":"https://orcid.org/0009-0006-1733-0964","affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104151801","display_name":"Dima Al Saleh","orcid":null},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Dima Al Saleh","raw_affiliation_strings":["Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049340053","display_name":"Fahad Rahman Amik","orcid":"https://orcid.org/0000-0001-8433-0098"},"institutions":[{"id":"https://openalex.org/I5023651","display_name":"McGill University","ror":"https://ror.org/01pxwe438","country_code":"CA","type":"education","lineage":["https://openalex.org/I5023651"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Fahad Rahman Amik","raw_affiliation_strings":["Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada"],"raw_orcid":"https://orcid.org/0000-0001-8433-0098","affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, McGill University, Montreal, QC, Canada","institution_ids":["https://openalex.org/I5023651"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064794690","display_name":"Boris Vaisband","orcid":"https://orcid.org/0000-0002-6176-5918"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Boris Vaisband","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, University of California at Irvine, Irvine, CA, USA"],"raw_orcid":"https://orcid.org/0000-0002-6176-5918","affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of California at Irvine, Irvine, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5088527176"],"corresponding_institution_ids":["https://openalex.org/I5023651"],"apc_list":null,"apc_paid":null,"fwci":1.3062,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.79332664,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":98},"biblio":{"volume":"33","issue":"6","first_page":"1638","last_page":"1650"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9842000007629395,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9842000007629395,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9685999751091003,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4390435516834259},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4374639391899109},{"id":"https://openalex.org/keywords/simulation","display_name":"Simulation","score":0.40147560834884644},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34443679451942444},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2659897804260254},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08275750279426575},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06922775506973267}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4390435516834259},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4374639391899109},{"id":"https://openalex.org/C44154836","wikidata":"https://www.wikidata.org/wiki/Q45045","display_name":"Simulation","level":1,"score":0.40147560834884644},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34443679451942444},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2659897804260254},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08275750279426575},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06922775506973267}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2025.3545604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3545604","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":40,"referenced_works":["https://openalex.org/W1967136720","https://openalex.org/W1987772327","https://openalex.org/W2024479790","https://openalex.org/W2079942837","https://openalex.org/W2082375193","https://openalex.org/W2110090002","https://openalex.org/W2123861683","https://openalex.org/W2129785295","https://openalex.org/W2129960401","https://openalex.org/W2136631982","https://openalex.org/W2139030761","https://openalex.org/W2165388927","https://openalex.org/W2167797964","https://openalex.org/W2320552075","https://openalex.org/W2474451066","https://openalex.org/W2478040551","https://openalex.org/W2518432791","https://openalex.org/W2795549950","https://openalex.org/W2973029716","https://openalex.org/W3003257820","https://openalex.org/W3005962614","https://openalex.org/W3018363946","https://openalex.org/W3035965352","https://openalex.org/W3048317241","https://openalex.org/W3142845206","https://openalex.org/W3158793502","https://openalex.org/W3163019281","https://openalex.org/W3188674373","https://openalex.org/W3191072511","https://openalex.org/W3204960448","https://openalex.org/W4212833482","https://openalex.org/W4256233769","https://openalex.org/W4283710572","https://openalex.org/W4312341102","https://openalex.org/W4312576493","https://openalex.org/W4312786694","https://openalex.org/W4385525510","https://openalex.org/W4385525554","https://openalex.org/W4386953463","https://openalex.org/W6745245109"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Heterogeneous":[0],"chiplet-based":[1,21,126],"integration":[2,65,92],"is":[3,67,94,160,189],"expected":[4],"to":[5,141,162,211],"provide":[6,75],"performance":[7,150],"scalability":[8],"and":[9,80,113,136,157],"cost-effectiveness":[10],"for":[11,44,62,78,90,154],"the":[12,45,51,55,72,143,176,180,212],"next":[13],"generation":[14],"of":[15,20,47,54,110,146,151,179,194,202,207],"microelectronic":[16],"systems.":[17],"Practical":[18],"deployment":[19],"platforms,":[22,93,127],"however,":[23],"requires":[24],"developing":[25],"novel":[26,144],"electronic":[27],"design":[28,48],"automation":[29],"(EDA)":[30],"tools":[31,43,74],"that":[32,117,175,183],"support":[33,77],"advanced":[34,63,81,125],"packaging":[35,82],"approaches.":[36],"Compact":[37],"thermal":[38,60,88,181],"simulators":[39,61],"are":[40,139,184],"essential":[41],"EDA":[42],"evaluation":[46],"alternatives":[49],"at":[50,203],"early":[52],"stages":[53],"design.":[56],"Developing":[57],"efficient":[58,115],"compact":[59],"heterogeneous":[64,91,111],"platforms":[66],"a":[68,86,191,198],"key":[69],"requirement,":[70],"as":[71,209],"available":[73],"limited":[76],"heterogeneity":[79],"technologies.":[83],"ARTSim":[84,99,147,152,187],"2.0,":[85],"robust":[87,106],"simulator":[89],"presented":[95],"in":[96,200],"this":[97],"work.":[98],"2.0":[100,153,188],"includes":[101],"three":[102],"main":[103],"features,":[104],"i.e.,":[105],"hybrid":[107],"meshing,":[108],"modeling":[109],"layers,":[112],"an":[114],"solver":[116],"utilizes":[118],"parallel":[119],"processing.":[120],"Several":[121],"case":[122],"studies":[123],"on":[124],"including":[128],"TSV-based":[129],"3-D":[130],"integrated":[131],"circuits":[132],"(ICs),":[133],"Intel":[134],"EMIB,":[135],"TSMC":[137],"InFO_PoP,":[138],"conducted":[140],"demonstrate":[142],"capabilities":[145],"2.0.":[148],"The":[149],"both":[155],"transient":[156],"steady-state":[158],"conditions":[159],"compared":[161,210],"results":[163,173],"obtained":[164],"from":[165],"state-of-the-art":[166],"finite":[167],"element":[168],"method":[169],"(FEM)":[170],"tools.":[171,214],"Simulation":[172],"confirm":[174],"temperature":[177],"accuracy":[178],"maps":[182],"generated":[185],"by":[186],"within":[190],"maximum":[192],"error":[193],"1.17%":[195],"while":[196],"exhibiting":[197],"reduction":[199],"runtime":[201],"least":[204],"two":[205],"orders":[206],"magnitude,":[208],"FEM":[213]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1}],"updated_date":"2025-12-28T23:10:05.387466","created_date":"2025-10-10T00:00:00"}