{"id":"https://openalex.org/W4406753855","doi":"https://doi.org/10.1109/tvlsi.2025.3529699","title":"A Chiplet Platform for Intelligent Radar/Sonar Leveraging Domain-Specific Reusable Active Interposer","display_name":"A Chiplet Platform for Intelligent Radar/Sonar Leveraging Domain-Specific Reusable Active Interposer","publication_year":2025,"publication_date":"2025-01-23","ids":{"openalex":"https://openalex.org/W4406753855","doi":"https://doi.org/10.1109/tvlsi.2025.3529699"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2025.3529699","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3529699","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114080987","display_name":"Yafei Liu","orcid":"https://orcid.org/0009-0004-9590-8253"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yafei Liu","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0009-0004-9590-8253","affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100712054","display_name":"Dejian Li","orcid":"https://orcid.org/0000-0002-8230-730X"},"institutions":[{"id":"https://openalex.org/I4210089056","display_name":"Beijing Microelectronics Technology Institute","ror":"https://ror.org/007y7ej30","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210089056"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dejian Li","raw_affiliation_strings":["Beijing Smartchip Microelectronics Technology Company Ltd., Beijing, China","Beijing Smartchip Microelectronics Technology Company Ltd, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing Smartchip Microelectronics Technology Company Ltd., Beijing, China","institution_ids":["https://openalex.org/I4210089056"]},{"raw_affiliation_string":"Beijing Smartchip Microelectronics Technology Company Ltd, Beijing, China","institution_ids":["https://openalex.org/I4210089056"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061103594","display_name":"Zheng Yang","orcid":"https://orcid.org/0000-0003-4048-2684"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zheng Yang","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100309553","display_name":"Chaoqin Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210129594","display_name":"Nova Insurance Services (China)","ror":"https://ror.org/033pgsq69","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210129594"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chaoqin Zhang","raw_affiliation_strings":["Beijing Novauto Technology Co., Ltd., Beijing, China","Beijing Novauto Technology Co., Ltd, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing Novauto Technology Co., Ltd., Beijing, China","institution_ids":["https://openalex.org/I4210129594"]},{"raw_affiliation_string":"Beijing Novauto Technology Co., Ltd, Beijing, China","institution_ids":["https://openalex.org/I4210129594"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yunlai Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210126929","display_name":"CE Technologies (United Kingdom)","ror":"https://ror.org/02pw67e25","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210126929"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Yunlai Zhang","raw_affiliation_strings":["NewRadio Technologies Co., Ltd., Beijing, China","NewRadio Technologies Co., Ltd, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"NewRadio Technologies Co., Ltd., Beijing, China","institution_ids":["https://openalex.org/I4210126929"]},{"raw_affiliation_string":"NewRadio Technologies Co., Ltd, Beijing, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100460327","display_name":"Xiangyu Li","orcid":"https://orcid.org/0000-0003-0094-8865"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiangyu Li","raw_affiliation_strings":["School of Integrated Circuits, Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China","Beijing National Research Center for Information Science and Technology, School of Integrated Circuits, Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0003-0094-8865","affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]},{"raw_affiliation_string":"Beijing National Research Center for Information Science and Technology, School of Integrated Circuits, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071321197","display_name":"Mingwei Cao","orcid":"https://orcid.org/0000-0002-8161-0382"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mingwei Cao","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054524841","display_name":"Shouyi Yin","orcid":"https://orcid.org/0000-0003-2309-572X"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shouyi Yin","raw_affiliation_strings":["School of Integrated Circuits, Tsinghua University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0003-2309-572X","affiliations":[{"raw_affiliation_string":"School of Integrated Circuits, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":6.3295,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.96256384,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"33","issue":"4","first_page":"903","last_page":"915"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13293","display_name":"Engineering and Test Systems","score":0.9682999849319458,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13293","display_name":"Engineering and Test Systems","score":0.9682999849319458,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9510999917984009,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9430999755859375,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/radar","display_name":"Radar","score":0.5898492336273193},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.5516841411590576},{"id":"https://openalex.org/keywords/marine-mammals-and-sonar","display_name":"Marine mammals and sonar","score":0.5482266545295715},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5360994338989258},{"id":"https://openalex.org/keywords/domain","display_name":"Domain (mathematical analysis)","score":0.4824991226196289},{"id":"https://openalex.org/keywords/sonar","display_name":"Sonar","score":0.387952983379364},{"id":"https://openalex.org/keywords/remote-sensing","display_name":"Remote sensing","score":0.3568735718727112},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3330857455730438},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.3094256520271301},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.19944241642951965},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.1733386218547821},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15210378170013428},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09004995226860046}],"concepts":[{"id":"https://openalex.org/C554190296","wikidata":"https://www.wikidata.org/wiki/Q47528","display_name":"Radar","level":2,"score":0.5898492336273193},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.5516841411590576},{"id":"https://openalex.org/C137184094","wikidata":"https://www.wikidata.org/wiki/Q6764300","display_name":"Marine mammals and sonar","level":3,"score":0.5482266545295715},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5360994338989258},{"id":"https://openalex.org/C36503486","wikidata":"https://www.wikidata.org/wiki/Q11235244","display_name":"Domain (mathematical analysis)","level":2,"score":0.4824991226196289},{"id":"https://openalex.org/C555745239","wikidata":"https://www.wikidata.org/wiki/Q133220","display_name":"Sonar","level":2,"score":0.387952983379364},{"id":"https://openalex.org/C62649853","wikidata":"https://www.wikidata.org/wiki/Q199687","display_name":"Remote sensing","level":1,"score":0.3568735718727112},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3330857455730438},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.3094256520271301},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.19944241642951965},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.1733386218547821},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15210378170013428},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09004995226860046},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2025.3529699","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3529699","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7599999904632568,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1970734438","https://openalex.org/W2004076644","https://openalex.org/W2234584938","https://openalex.org/W2469690627","https://openalex.org/W2532719504","https://openalex.org/W2940196061","https://openalex.org/W2946055491","https://openalex.org/W2963255460","https://openalex.org/W2996407519","https://openalex.org/W3005962614","https://openalex.org/W3006667757","https://openalex.org/W3008954557","https://openalex.org/W3015587302","https://openalex.org/W3035788522","https://openalex.org/W3075394774","https://openalex.org/W3092226368","https://openalex.org/W3111684448","https://openalex.org/W3132197712","https://openalex.org/W3161519665","https://openalex.org/W3188178661","https://openalex.org/W3192636176","https://openalex.org/W4200622472","https://openalex.org/W4224213002","https://openalex.org/W4244395536","https://openalex.org/W4280633094","https://openalex.org/W4293023438","https://openalex.org/W4296209134","https://openalex.org/W4297097386","https://openalex.org/W4362653371","https://openalex.org/W4391932394"],"related_works":["https://openalex.org/W2392611223","https://openalex.org/W2049105424","https://openalex.org/W2362175816","https://openalex.org/W2016800904","https://openalex.org/W4285109196","https://openalex.org/W3003593517","https://openalex.org/W3197465599","https://openalex.org/W2999206242","https://openalex.org/W2041835195","https://openalex.org/W580836668"],"abstract_inverted_index":{"Through":[0],"chiplet":[1,61],"reuse,":[2],"chiplet-based":[3],"system":[4,145,194],"designs":[5],"have":[6],"emerged":[7],"as":[8],"a":[9,44,55,60,139,159,163,216],"cost-effective":[10],"solution":[11],"for":[12,54,69,92,230],"system-on-chips":[13],"(SoCs),":[14],"yet":[15],"considerable":[16],"silicon":[17],"interposer":[18,48],"costs":[19],"often":[20,34],"negate":[21],"the":[22,31,70,101,112,129,151,173,210,225],"benefits.":[23],"Though":[24],"general":[25],"reusable":[26,46,220],"interposers":[27],"(GRIs)":[28],"can":[29],"lower":[30],"cost,":[32],"they":[33],"compromise":[35],"on":[36,64,150],"performance":[37,157],"and":[38,80,88,97,114,123,131,181,191,208],"energy":[39,125,189],"efficiency.":[40],"In":[41],"this":[42],"article,":[43],"domain-specific":[45],"active":[47,66],"(active":[49],"DSRI)":[50],"approach":[51,186,229],"is":[52,75,176],"proposed":[53,152],"better":[56],"cost-efficiency":[57],"tradeoff.":[58],"Moreover,":[59],"platform":[62,85,94],"based":[63],"an":[65],"DSRI":[67],"designed":[68],"intelligent":[71],"radar/sonar":[72],"(IRS)":[73],"domain":[74],"introduced":[76],"to":[77,99,118,158],"facilitate":[78],"rapid":[79],"customized":[81,140],"SoC":[82,135,148],"development.":[83],"This":[84,214],"offers":[86],"flexible":[87],"energy-efficient":[89],"interconnections":[90],"tailored":[91],"IRS,":[93],"infrastructure":[95],"functions,":[96],"peripherals":[98],"simplify":[100],"chiplets.":[102],"Furthermore,":[103],"it":[104,154],"integrates":[105],"lightweight,":[106],"composable":[107],"standard":[108],"3-D":[109,174],"interfaces":[110],"across":[111],"chiplets":[113,221],"interposer,":[115],"delivering":[116],"up":[117],"96-Gb/s":[119],"bandwidth,":[120],"11.1-ns":[121],"latency,":[122],"0.62-pJ/bit":[124],"efficiency,":[126],"well":[127],"controlling":[128],"cost":[130,211],"power":[132],"penalties":[133],"of":[134,167,172,219,227],"partition.":[136],"Demonstrated":[137],"with":[138,162],"hand":[141],"gesture":[142],"recognition":[143,164],"sonar":[144],"(HGRSS)":[146],"baseband":[147],"implemented":[149],"platform,":[153],"achieves":[155],"similar":[156],"monolithic":[160],"SoC,":[161],"frame":[165],"rate":[166],"6286":[168],"frames/s,":[169],"where":[170],"overhead":[171],"interface":[175],"only":[177],"6.86%":[178],"in":[179,183,222],"area":[180],"4.84%":[182],"power.":[184],"Our":[185],"proves":[187],"cost-effective,":[188],"efficient,":[190],"customizable,":[192],"moving":[193],"volume":[195],"breakeven":[196],"point":[197],"forward":[198],"by":[199,212],"<inline-formula":[200],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[201],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[202],"<tex-math":[203],"notation=\"LaTeX\">$3.22\\sim":[204],"3.36$":[205],"</tex-math></inline-formula>":[206],"times,":[207],"reducing":[209],"58.5%~59.8%.":[213],"represents":[215],"pioneering":[217],"demonstration":[218],"HGRSS,":[223],"showcasing":[224],"potential":[226],"our":[228],"broader":[231],"domains.":[232]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":6}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}