{"id":"https://openalex.org/W4406495806","doi":"https://doi.org/10.1109/tvlsi.2025.3527976","title":"Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules","display_name":"Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules","publication_year":2025,"publication_date":"2025-01-16","ids":{"openalex":"https://openalex.org/W4406495806","doi":"https://doi.org/10.1109/tvlsi.2025.3527976"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2025.3527976","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3527976","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101422699","display_name":"Zihan Xia","orcid":"https://orcid.org/0009-0009-9092-5106"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Zihan Xia","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053490898","display_name":"Chihun Song","orcid":"https://orcid.org/0000-0001-9586-153X"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chihun Song","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058261604","display_name":"Ram Krishna","orcid":null},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ram Krishna","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019076660","display_name":"Ashita Victor","orcid":"https://orcid.org/0000-0002-0062-1128"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ashita Victor","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5099516358","display_name":"Srujan Penta","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Srujan Penta","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044507102","display_name":"Muhannad S. Bakir","orcid":"https://orcid.org/0000-0002-0380-0842"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Muhannad S. Bakir","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019748322","display_name":"Elyse Rosenbaum","orcid":"https://orcid.org/0000-0002-3919-9833"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Elyse Rosenbaum","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037648751","display_name":"Nam Sung Kim","orcid":"https://orcid.org/0000-0002-0442-5634"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nam Sung Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006712350","display_name":"Mingu Kang","orcid":"https://orcid.org/0000-0001-8104-5136"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mingu Kang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5101422699"],"corresponding_institution_ids":["https://openalex.org/I36258959"],"apc_list":null,"apc_paid":null,"fwci":1.4625,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.8011633,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":"33","issue":"5","first_page":"1202","last_page":"1214"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.8584166765213013},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49519434571266174},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4894829988479614},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.40476590394973755},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.38231462240219116},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.28307926654815674},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21654027700424194}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.8584166765213013},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49519434571266174},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4894829988479614},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.40476590394973755},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.38231462240219116},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.28307926654815674},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21654027700424194}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2025.3527976","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2025.3527976","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5899999737739563,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":39,"referenced_works":["https://openalex.org/W1491007702","https://openalex.org/W1984588379","https://openalex.org/W2014872264","https://openalex.org/W2044444711","https://openalex.org/W2070552259","https://openalex.org/W2071469142","https://openalex.org/W2099992500","https://openalex.org/W2109288479","https://openalex.org/W2111081435","https://openalex.org/W2135818056","https://openalex.org/W2158620667","https://openalex.org/W2193198328","https://openalex.org/W2418958843","https://openalex.org/W2514566830","https://openalex.org/W2561023863","https://openalex.org/W2588191434","https://openalex.org/W2725159389","https://openalex.org/W2982008795","https://openalex.org/W2991479671","https://openalex.org/W3016212306","https://openalex.org/W3042624570","https://openalex.org/W3108101844","https://openalex.org/W3115187376","https://openalex.org/W3138864966","https://openalex.org/W3190062760","https://openalex.org/W4206782120","https://openalex.org/W4238549726","https://openalex.org/W4244395536","https://openalex.org/W4293023438","https://openalex.org/W4380302467","https://openalex.org/W4385525247","https://openalex.org/W4386763434","https://openalex.org/W4387803193","https://openalex.org/W4398169008","https://openalex.org/W4399119843","https://openalex.org/W4400811275","https://openalex.org/W4402743920","https://openalex.org/W6638337918","https://openalex.org/W6859544208"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W3120961607","https://openalex.org/W4401568740","https://openalex.org/W3148568549","https://openalex.org/W2098207691","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W2161286015"],"abstract_inverted_index":{"As":[0],"the":[1,49,73,79,106,167,200,231],"end":[2],"of":[3,36,81],"Moore\u2019s":[4],"law":[5],"approaches,":[6],"chiplet":[7,11,40,95,99],"integration":[8,35,216],"technology":[9,22],"(or":[10],"technology)":[12],"has":[13],"emerged":[14],"to":[15,45,116,206,237],"revolutionize":[16],"future":[17],"semiconductor":[18],"chip":[19],"design.":[20],"Chiplet":[21],"provides":[23],"unique":[24],"advantages":[25,69],"over":[26],"3-D-stacking":[27],"technology,":[28],"including":[29],"a":[30,93,173,218],"more":[31],"cost-efficient":[32],"and":[33,88,113,122,133],"thermal-friendly":[34],"heterogeneous":[37,215],"technologies.":[38,250],"Although":[39],"technologies":[41],"have":[42,54],"already":[43],"begun":[44],"be":[46],"used":[47],"by":[48,92,152,204],"latest":[50],"commercial":[51],"chips,":[52],"they":[53],"not":[55],"been":[56],"explored":[57],"for":[58,70,72],"commodity":[59],"dynamic":[60],"random":[61],"access":[62],"memory":[63],"(DRAM)":[64],"design":[65],"yet.":[66],"Harnessing":[67],"its":[68],"DRAM":[71,83,139,149,196],"first":[74],"time,":[75],"this":[76],"article":[77],"evaluates":[78],"feasibility":[80],"chiplet-based":[82,138,214],"architecture,":[84],"considering":[85],"various":[86],"physical":[87],"electrical":[89],"constraints":[90],"imposed":[91],"standard":[94],"interface":[96],"[i.e.,":[97],"universal":[98],"interconnect":[100],"express":[101],"(UCIe)].":[102],"We":[103],"further":[104],"explore":[105],"DIMM":[107],"architectures":[108],"that":[109,137],"simplify":[110],"module":[111],"packaging":[112],"assembly,":[114],"leading":[115],"reductions":[117],"in":[118,188,210,240],"total":[119],"die":[120],"size":[121],"overall":[123,201,241],"costs.":[124],"The":[125,194,213],"comprehensive":[126],"cross-level":[127],"analysis":[128],"(i.e.,":[129],"device,":[130],"circuit,":[131],"chip,":[132,233],"system":[134,202],"levels)":[135],"shows":[136],"reduces":[140],"<monospace":[141,145,189],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[142,146,154,160,175,181,190,220],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">t_RCD</monospace>":[143],"+":[144],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">t_CAS</monospace>,":[147],"latency-critical":[148],"timing":[150,197],"parameters,":[151],"<inline-formula":[153,174,219],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[155,161,176,182,221],"<tex-math":[156,162,177,183,222],"notation=\"LaTeX\">$1.32\\times":[157],"$":[158,164,179,185,224],"</tex-math></inline-formula>\u2013<inline-formula":[159,180],"notation=\"LaTeX\">$1.39\\times":[163,178],"</tex-math></inline-formula>,":[165],"at":[166,247],"same":[168],"energy":[169],"consumption.":[170],"In":[171],"addition,":[172],"notation=\"LaTeX\">$2.28\\times":[184],"</tex-math></inline-formula>":[186,225],"improvement":[187],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">t_RRD</monospace>":[191],"is":[192],"obtained.":[193],"reduced":[195],"parameters":[198],"improve":[199],"performance":[203],"up":[205,236],"8.8%\u201324.7%":[207],"(geomean":[208],"3.4%\u20138.4%)":[209],"real-life":[211],"benchmarks.":[212],"achieves":[217],"notation=\"LaTeX\">$1.27\\times":[223],"higher":[226],"chip-level":[227],"yield":[228],"compared":[229,243],"with":[230,235,244],"monolithic":[232],"along":[234],"10%":[238],"reduction":[239],"cost":[242],"traditional":[245],"DIMMs":[246],"emerging":[248],"process":[249]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}