{"id":"https://openalex.org/W3190609540","doi":"https://doi.org/10.1109/tvlsi.2021.3100343","title":"Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC","display_name":"Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC","publication_year":2021,"publication_date":"2021-08-05","ids":{"openalex":"https://openalex.org/W3190609540","doi":"https://doi.org/10.1109/tvlsi.2021.3100343","mag":"3190609540"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2021.3100343","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2021.3100343","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091146878","display_name":"Jai-Ming Lin","orcid":"https://orcid.org/0000-0001-8637-2144"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jai-Ming Lin","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":"https://orcid.org/0000-0001-8637-2144","affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102277882","display_name":"Wei-Yi Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wei-Yi Chang","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042994491","display_name":"Hao-Yuan Hsieh","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hao-Yuan Hsieh","raw_affiliation_strings":["Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075933394","display_name":"Ya-Ting Shyu","orcid":"https://orcid.org/0000-0001-5092-5587"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Ya-Ting Shyu","raw_affiliation_strings":["Industrial Technology Research Institute, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5105618317","display_name":"Yeong-Jar Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yeong-Jar Chang","raw_affiliation_strings":["Industrial Technology Research Institute, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5008813715","display_name":"Juin\u2010Ming Lu","orcid":"https://orcid.org/0000-0002-4219-1349"},"institutions":[{"id":"https://openalex.org/I4210148468","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63","country_code":"TW","type":"nonprofit","lineage":["https://openalex.org/I4210148468"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Juin-Ming Lu","raw_affiliation_strings":["Industrial Technology Research Institute, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Industrial Technology Research Institute, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148468"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2204,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.78878781,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"29","issue":"9","first_page":"1652","last_page":"1664"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.7595677971839905},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6659884452819824},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5800999999046326},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.561535120010376},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.551928699016571},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.527271568775177},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.43513602018356323},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.43287959694862366},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.3876885175704956},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3378119468688965},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22319000959396362},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.09403374791145325}],"concepts":[{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.7595677971839905},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6659884452819824},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5800999999046326},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.561535120010376},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.551928699016571},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.527271568775177},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.43513602018356323},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.43287959694862366},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.3876885175704956},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3378119468688965},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22319000959396362},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.09403374791145325},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2021.3100343","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2021.3100343","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6399999856948853,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G3842295528","display_name":null,"funder_award_id":"108-2221-E-006-147-MY2","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320322214","display_name":"Industrial Technology Research Institute","ror":"https://ror.org/05szzwt63"},{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":53,"referenced_works":["https://openalex.org/W1541633348","https://openalex.org/W1573531917","https://openalex.org/W1859174109","https://openalex.org/W1939710494","https://openalex.org/W1975238662","https://openalex.org/W2006980464","https://openalex.org/W2037771006","https://openalex.org/W2041723838","https://openalex.org/W2042314125","https://openalex.org/W2052753706","https://openalex.org/W2074575703","https://openalex.org/W2090317622","https://openalex.org/W2094042791","https://openalex.org/W2095117703","https://openalex.org/W2095886693","https://openalex.org/W2110090002","https://openalex.org/W2113671003","https://openalex.org/W2114871550","https://openalex.org/W2114910421","https://openalex.org/W2125653639","https://openalex.org/W2127012874","https://openalex.org/W2129021906","https://openalex.org/W2131574455","https://openalex.org/W2142760988","https://openalex.org/W2153770483","https://openalex.org/W2157558963","https://openalex.org/W2160393392","https://openalex.org/W2167190617","https://openalex.org/W2168938583","https://openalex.org/W2532719504","https://openalex.org/W2539349753","https://openalex.org/W2581035600","https://openalex.org/W2607047723","https://openalex.org/W2724714096","https://openalex.org/W2976212630","https://openalex.org/W3003658113","https://openalex.org/W3139358888","https://openalex.org/W3143608171","https://openalex.org/W4205135025","https://openalex.org/W4231590627","https://openalex.org/W4235066485","https://openalex.org/W4238320324","https://openalex.org/W4239055271","https://openalex.org/W4246839582","https://openalex.org/W4255476700","https://openalex.org/W6639194140","https://openalex.org/W6644184184","https://openalex.org/W6674301526","https://openalex.org/W6674354551","https://openalex.org/W6678589545","https://openalex.org/W6681256111","https://openalex.org/W6684891719","https://openalex.org/W6732342490"],"related_works":["https://openalex.org/W2261987718","https://openalex.org/W2028082191","https://openalex.org/W2032655623","https://openalex.org/W2016970881","https://openalex.org/W2886805502","https://openalex.org/W2994788014","https://openalex.org/W2809933636","https://openalex.org/W1965050610","https://openalex.org/W1990789187","https://openalex.org/W2493084514"],"abstract_inverted_index":{"High":[0],"temperature":[1,3,21,103,110,137,156],"or":[2],"nonuniformity":[4],"has":[5],"become":[6],"a":[7,23,30,38,48,105,112,132,158,162],"serious":[8],"threat":[9],"to":[10,41,44,53,70,90,99,134],"performance":[11],"and":[12],"reliability":[13],"of":[14,121,142,157],"high-performance":[15],"integrated":[16],"circuits":[17],"(ICs).":[18],"Since":[19,108],"the":[20,54,62,67,102,109,119,136,149,155,166],"in":[22,76,111,123,165],"3-D":[24,159],"IC":[25,160],"is":[26,88,171],"mainly":[27],"determined":[28],"by":[29],"power":[31,50,73,97],"distribution":[32,51],"across":[33],"tiers,":[34],"this":[35],"article":[36],"proposes":[37],"novel":[39],"method":[40],"allocate":[42],"modules":[43,75,81,98],"tiers":[45,78],"while":[46],"exploring":[47],"better":[49],"according":[52],"hyperparameter":[55],"optimization":[56],"technique.":[57],"In":[58],"addition,":[59],"we":[60,129],"integrate":[61],"sub-3-D":[63],"thermal":[64],"mask":[65],"into":[66],"analytical":[68],"formulation":[69],"interleave":[71],"high":[72,96],"consumption":[74],"contiguous":[77],"during":[79],"distributing":[80],"over":[82],"placement":[83],"regions":[84],"so":[85],"that":[86,148],"it":[87],"possible":[89],"insert":[91],"through-silicon":[92],"vias":[93],"(TSVs)":[94],"around":[95],"further":[100],"reduce":[101,154],"at":[104],"later":[106],"stage.":[107],"tier":[113,126],"will":[114],"be":[115],"changed":[116],"every":[117],"time":[118],"locations":[120,141],"TSVs":[122],"its":[124,169],"lower":[125],"are":[127],"moved,":[128],"also":[130],"propose":[131],"procedure":[133],"update":[135],"map":[138],"before":[139],"refining":[140],"TSVs.":[143],"Experimental":[144],"results":[145],"have":[146],"demonstrated":[147],"proposed":[150],"methodology":[151],"can":[152],"effectively":[153],"with":[161],"slight":[163],"increase":[164],"wirelength.":[167],"Moreover,":[168],"runtime":[170],"quite":[172],"fast.":[173]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":7},{"year":2022,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}