{"id":"https://openalex.org/W3140564856","doi":"https://doi.org/10.1109/tvlsi.2020.2995094","title":"Architecture of Cobweb-Based Redundant TSV for Clustered Faults","display_name":"Architecture of Cobweb-Based Redundant TSV for Clustered Faults","publication_year":2020,"publication_date":"2020-06-09","ids":{"openalex":"https://openalex.org/W3140564856","doi":"https://doi.org/10.1109/tvlsi.2020.2995094","mag":"3140564856"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2020.2995094","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2020.2995094","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085987622","display_name":"Tianming Ni","orcid":"https://orcid.org/0000-0001-6272-8660"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianming Ni","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China"],"raw_orcid":"https://orcid.org/0000-0001-6272-8660","affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100440896","display_name":"Dongsheng Liu","orcid":"https://orcid.org/0000-0001-5571-1932"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongsheng Liu","raw_affiliation_strings":["School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031010282","display_name":"Qi Xu","orcid":"https://orcid.org/0000-0002-0375-9800"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Xu","raw_affiliation_strings":["School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0002-0375-9800","affiliations":[{"raw_affiliation_string":"School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]},{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073810494","display_name":"Zhengfeng Huang","orcid":"https://orcid.org/0000-0001-8695-4478"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhengfeng Huang","raw_affiliation_strings":["School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]},{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100736309","display_name":"Huaguo Liang","orcid":"https://orcid.org/0000-0002-0307-7236"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huaguo Liang","raw_affiliation_strings":["School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","School of Microelectronics, Hefei University of Technology, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0002-0307-7236","affiliations":[{"raw_affiliation_string":"School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]},{"raw_affiliation_string":"School of Microelectronics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072439444","display_name":"Aibin Yan","orcid":"https://orcid.org/0000-0003-0024-987X"},"institutions":[{"id":"https://openalex.org/I143868143","display_name":"Anhui University","ror":"https://ror.org/05th6yx34","country_code":"CN","type":"education","lineage":["https://openalex.org/I143868143"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Aibin Yan","raw_affiliation_strings":["School of Computer Science and Technology, Anhui University, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0003-0024-987X","affiliations":[{"raw_affiliation_string":"School of Computer Science and Technology, Anhui University, Hefei, China","institution_ids":["https://openalex.org/I143868143"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":13.93,"has_fulltext":false,"cited_by_count":150,"citation_normalized_percentile":{"value":0.99366804,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":100},"biblio":{"volume":"28","issue":"7","first_page":"1736","last_page":"1739"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/router","display_name":"Router","score":0.8684713244438171},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5160734057426453},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.48160549998283386},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.472561776638031},{"id":"https://openalex.org/keywords/ring","display_name":"Ring (chemistry)","score":0.4480281472206116},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.432756245136261},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.3813689947128296},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3057973384857178},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.30247923731803894},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.23346087336540222},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.11645898222923279},{"id":"https://openalex.org/keywords/geography","display_name":"Geography","score":0.0837850272655487}],"concepts":[{"id":"https://openalex.org/C2775896111","wikidata":"https://www.wikidata.org/wiki/Q642560","display_name":"Router","level":2,"score":0.8684713244438171},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5160734057426453},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.48160549998283386},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.472561776638031},{"id":"https://openalex.org/C2780378348","wikidata":"https://www.wikidata.org/wiki/Q25351438","display_name":"Ring (chemistry)","level":2,"score":0.4480281472206116},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.432756245136261},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.3813689947128296},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3057973384857178},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30247923731803894},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.23346087336540222},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.11645898222923279},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0837850272655487},{"id":"https://openalex.org/C166957645","wikidata":"https://www.wikidata.org/wiki/Q23498","display_name":"Archaeology","level":1,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2020.2995094","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2020.2995094","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G1546832378","display_name":null,"funder_award_id":"61874163","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G3909525237","display_name":null,"funder_award_id":"61974001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4570662887","display_name":null,"funder_award_id":"61904047","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6260214469","display_name":null,"funder_award_id":"61874156","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6637131806","display_name":null,"funder_award_id":"61674048","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G744300498","display_name":"\u96c6\u6210\u7535\u8def\u8fd1\u4f3c\u8ba1\u7b97\u57fa\u7840\u7406\u8bba\u4e0e\u8bbe\u8ba1\u65b9\u6cd5","funder_award_id":"61834006","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G875980750","display_name":null,"funder_award_id":"61904001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G98675533","display_name":null,"funder_award_id":"1908085QF272","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320334897","display_name":"Natural Science Foundation of Anhui Province","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2062899780","https://openalex.org/W2097634964","https://openalex.org/W2288330210","https://openalex.org/W2397543037","https://openalex.org/W2516697505","https://openalex.org/W2592071954","https://openalex.org/W2603758940","https://openalex.org/W2773038018","https://openalex.org/W2979746556","https://openalex.org/W2997958323","https://openalex.org/W3001290849"],"related_works":["https://openalex.org/W2122026593","https://openalex.org/W2582203024","https://openalex.org/W1588358165","https://openalex.org/W4237683758","https://openalex.org/W2370711413","https://openalex.org/W2052038519","https://openalex.org/W2375932043","https://openalex.org/W2841075164","https://openalex.org/W1980506749","https://openalex.org/W2375594474"],"abstract_inverted_index":{"In":[0],"this":[1],"brief,":[2],"a":[3],"cobweb-based":[4],"redundant":[5],"through-silicon-via":[6],"(TSV)":[7],"design":[8,62],"is":[9,44],"proposed":[10,41,61],"with":[11,71],"efficient":[12],"hardware":[13,68],"as":[14,16],"well":[15],"high":[17],"repair":[18,21,37],"rate":[19,38],"to":[20],"clustered":[22,34],"faulty":[23],"TSVs":[24],"(FTSVs).":[25],"The":[26],"experimental":[27],"simulation":[28],"results":[29],"demonstrate":[30],"that":[31,50],"for":[32],"highly":[33],"faults,":[35],"the":[36,40,52,60,72,75],"of":[39,51],"RTSV":[42,56],"method":[43],"48.59%":[45],"and":[46,54,66,74],"1.75%":[47],"higher":[48],"than":[49],"ring-based":[53,76],"router-based":[55,73],"methods,":[57],"respectively.":[58,78],"Furthermore,":[59],"can":[63],"achieve":[64],"63.93%":[65],"16.34%":[67],"reductions":[69],"compared":[70],"design,":[77]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":14},{"year":2022,"cited_by_count":49},{"year":2021,"cited_by_count":48},{"year":2020,"cited_by_count":27}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}