{"id":"https://openalex.org/W2941054285","doi":"https://doi.org/10.1109/tvlsi.2019.2904048","title":"MTTF Enhancement Power-C4 Bump Placement Optimization","display_name":"MTTF Enhancement Power-C4 Bump Placement Optimization","publication_year":2019,"publication_date":"2019-04-24","ids":{"openalex":"https://openalex.org/W2941054285","doi":"https://doi.org/10.1109/tvlsi.2019.2904048","mag":"2941054285"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2019.2904048","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2019.2904048","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5005227556","display_name":"Somayeh Rahimipour","orcid":"https://orcid.org/0000-0002-2332-2964"},"institutions":[{"id":"https://openalex.org/I130343225","display_name":"Universiti Putra Malaysia","ror":"https://ror.org/02e91jd64","country_code":"MY","type":"education","lineage":["https://openalex.org/I130343225"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Somayeh Rahimipour","raw_affiliation_strings":["Department of Computer and Communication Systems Engineering, University Putra Malaysia, Serdang, Malaysia"],"raw_orcid":"https://orcid.org/0000-0002-2332-2964","affiliations":[{"raw_affiliation_string":"Department of Computer and Communication Systems Engineering, University Putra Malaysia, Serdang, Malaysia","institution_ids":["https://openalex.org/I130343225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010103014","display_name":"Runjie Zhang","orcid":"https://orcid.org/0000-0001-9777-9660"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Runjie Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100360109","display_name":"Ke Wang","orcid":"https://orcid.org/0000-0002-1956-5031"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ke Wang","raw_affiliation_strings":["Department of Computer Science, University of Virginia, Charlottesville, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Virginia, Charlottesville, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074818897","display_name":"Kevin Skadron","orcid":"https://orcid.org/0000-0002-8091-9302"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kevin Skadron","raw_affiliation_strings":["Department of Computer Science, University of Virginia, Charlottesville, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science, University of Virginia, Charlottesville, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050406307","display_name":"Fakhrul Zaman Rokhani","orcid":"https://orcid.org/0000-0001-6449-8184"},"institutions":[{"id":"https://openalex.org/I130343225","display_name":"Universiti Putra Malaysia","ror":"https://ror.org/02e91jd64","country_code":"MY","type":"education","lineage":["https://openalex.org/I130343225"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Fakhrul Zaman B. Rokhani","raw_affiliation_strings":["Department of Computer and Communication Systems Engineering, University Putra Malaysia, Serdang, Malaysia"],"raw_orcid":"https://orcid.org/0000-0001-6449-8184","affiliations":[{"raw_affiliation_string":"Department of Computer and Communication Systems Engineering, University Putra Malaysia, Serdang, Malaysia","institution_ids":["https://openalex.org/I130343225"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068766978","display_name":"Mircea R. Stan","orcid":"https://orcid.org/0000-0003-0577-9976"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mircea R. Stan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3503,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.58701365,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"27","issue":"7","first_page":"1633","last_page":"1639"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mean-time-between-failures","display_name":"Mean time between failures","score":0.9316649436950684},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7809944152832031},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.6088484525680542},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.593005895614624},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5714532136917114},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5255226492881775},{"id":"https://openalex.org/keywords/voltage-drop","display_name":"Voltage drop","score":0.49386483430862427},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4770071804523468},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.47042059898376465},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46763065457344055},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3787541389465332},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36146867275238037},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.3512091636657715},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3339655101299286},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3049297332763672}],"concepts":[{"id":"https://openalex.org/C44154001","wikidata":"https://www.wikidata.org/wiki/Q754940","display_name":"Mean time between failures","level":3,"score":0.9316649436950684},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7809944152832031},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.6088484525680542},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.593005895614624},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5714532136917114},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5255226492881775},{"id":"https://openalex.org/C82178898","wikidata":"https://www.wikidata.org/wiki/Q166839","display_name":"Voltage drop","level":3,"score":0.49386483430862427},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4770071804523468},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.47042059898376465},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46763065457344055},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3787541389465332},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36146867275238037},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.3512091636657715},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3339655101299286},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3049297332763672},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2019.2904048","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2019.2904048","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6299999952316284,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W35708471","https://openalex.org/W655037485","https://openalex.org/W659504504","https://openalex.org/W1985270840","https://openalex.org/W1989683188","https://openalex.org/W1999314489","https://openalex.org/W2007719944","https://openalex.org/W2016137694","https://openalex.org/W2018352731","https://openalex.org/W2074342132","https://openalex.org/W2101229326","https://openalex.org/W2138918410","https://openalex.org/W2147657366","https://openalex.org/W2147924310","https://openalex.org/W2151236447","https://openalex.org/W2154857344","https://openalex.org/W2170382128","https://openalex.org/W2342732973","https://openalex.org/W2468837027","https://openalex.org/W2469732947","https://openalex.org/W2540193588","https://openalex.org/W2620552423","https://openalex.org/W3147282303","https://openalex.org/W4205158744","https://openalex.org/W4237906032","https://openalex.org/W6680478177","https://openalex.org/W6681797429","https://openalex.org/W6738446551"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2034080945","https://openalex.org/W1030923862","https://openalex.org/W2541443397","https://openalex.org/W3209466718","https://openalex.org/W2199729044","https://openalex.org/W2565733367","https://openalex.org/W184596386","https://openalex.org/W2392800390","https://openalex.org/W3022248432"],"abstract_inverted_index":{"Constructing":[0],"a":[1,50,75,137,152],"reliable":[2],"power":[3],"delivery":[4],"network":[5],"(PDN)":[6],"is":[7],"increasingly":[8],"challenging":[9],"by":[10,147,169],"further":[11],"technology":[12,182],"scaling.":[13],"PDN":[14],"suffers":[15],"from":[16],"long-term":[17],"reliability":[18],"threats":[19],"such":[20],"as":[21,121,151],"electromigration":[22],"(EM).":[23],"EM":[24,47],"results":[25,161],"in":[26,99,178],"permanent":[27],"failures":[28],"and":[29,34,68,180],"directly":[30],"affects":[31],"chip":[32,42,85],"lifetime":[33],"voltage":[35,53,66,119],"stability.":[36],"Loss":[37],"of":[38,83,144],"limited":[39],"controlled":[40],"collapse":[41],"connection":[43],"(C4)":[44],"pads":[45,127],"to":[46,79,103,124,132,140,156],"makes":[48],"delivering":[49],"stable":[51],"supply":[52],"more":[54,174],"critical.":[55],"The":[56],"C4":[57,109],"bumps":[58],"failure":[59],"mechanism":[60],"depends":[61],"on":[62,87],"current":[63,108,116,179],"density,":[64],"on-chip":[65],"noise,":[67],"temperature.":[69],"In":[70],"this":[71],"paper,":[72],"we":[73],"develop":[74],"statistical":[76],"simulation":[77],"framework":[78],"analyze":[80],"the":[81,100,107,115,122,126,142,149,158,167],"effect":[82],"accurate":[84],"temperature":[86,97,150],"multiple":[88],"power-bump":[89],"wearout.":[90],"Our":[91],"result":[92],"shows":[93],"that":[94,128,163,171],"using":[95],"uniform":[96],"leads,":[98],"pessimistic":[101],"system,":[102],"mean-time-to-failure":[104],"(MTTF).":[105],"Meanwhile,":[106],"pad":[110],"placement":[111],"optimization":[112,145],"algorithms":[113,146],"consider":[114],"source":[117],"or":[118],"drop":[120],"forces":[123],"move":[125,157],"do":[129],"not":[130],"lead":[131],"maximum":[133],"MTTF.":[134],"We":[135],"propose":[136],"new":[138,153],"technique":[139],"improve":[141],"efficiency":[143],"exploring":[148],"virtual":[154],"force":[155],"pads.":[159],"Experimental":[160],"show":[162],"our":[164],"algorithm":[165],"improves":[166],"MTTF":[168],"25.43%":[170],"will":[172],"support":[173],"off-chip":[175],"I/O":[176],"channels":[177],"near-future":[181],"nodes.":[183]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}