{"id":"https://openalex.org/W2887655633","doi":"https://doi.org/10.1109/tvlsi.2018.2858561","title":"A Simplified Yield Model for SRAM Repair in Advanced Technology","display_name":"A Simplified Yield Model for SRAM Repair in Advanced Technology","publication_year":2018,"publication_date":"2018-08-07","ids":{"openalex":"https://openalex.org/W2887655633","doi":"https://doi.org/10.1109/tvlsi.2018.2858561","mag":"2887655633"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2018.2858561","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2018.2858561","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010640656","display_name":"Xiaoyuan Qi","orcid":"https://orcid.org/0000-0002-9970-4037"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Xiaoyuan Qi","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000038857","display_name":"R.J. Rosner","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Raymond J. Rosner","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089889286","display_name":"John Hopkins","orcid":"https://orcid.org/0000-0002-9530-8037"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Hopkins","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110736386","display_name":"J.M. Higman","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jack M. Higman","raw_affiliation_strings":["GLOBALFOUNDRIES, Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Austin, TX, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026634404","display_name":"Rick Mewhirter","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rick Mewhirter","raw_affiliation_strings":["GLOBALFOUNDRIES, Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Essex Junction, VT, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078457859","display_name":"Aaron M. Sinnott","orcid":"https://orcid.org/0000-0002-8887-759X"},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aaron Sinnott","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089775006","display_name":"Binod Kumar G. Nair","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Binod Kumar G. Nair","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112172090","display_name":"Ishtiaq Ahsan","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ishtiaq Ahsan","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052109645","display_name":"Mark E. Lagus","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark Lagus","raw_affiliation_strings":["GLOBALFOUNDRIES, Malta, NY, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, Malta, NY, USA","institution_ids":["https://openalex.org/I35662394"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5010640656"],"corresponding_institution_ids":["https://openalex.org/I35662394"],"apc_list":null,"apc_paid":null,"fwci":0.3863,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.62946167,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"26","issue":"11","first_page":"2494","last_page":"2503"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.9241980910301208},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.7707955241203308},{"id":"https://openalex.org/keywords/weibull-distribution","display_name":"Weibull distribution","score":0.668113112449646},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.49034810066223145},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46195128560066223},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45049065351486206},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3881235122680664},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3530290722846985},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.34463512897491455},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.33493542671203613},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.14212337136268616}],"concepts":[{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.9241980910301208},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.7707955241203308},{"id":"https://openalex.org/C173291955","wikidata":"https://www.wikidata.org/wiki/Q732332","display_name":"Weibull distribution","level":2,"score":0.668113112449646},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.49034810066223145},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46195128560066223},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45049065351486206},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3881235122680664},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3530290722846985},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.34463512897491455},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.33493542671203613},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.14212337136268616},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2018.2858561","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2018.2858561","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320319065","display_name":"Aromatic Plant Research Center","ror":"https://ror.org/05eebgw43"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W1593355900","https://openalex.org/W1966802929","https://openalex.org/W1985431087","https://openalex.org/W2021792911","https://openalex.org/W2042559232","https://openalex.org/W2046045084","https://openalex.org/W2074542373","https://openalex.org/W2081967359","https://openalex.org/W2081978919","https://openalex.org/W2098769965","https://openalex.org/W2100312232","https://openalex.org/W2105539905","https://openalex.org/W2116548611","https://openalex.org/W2124313952","https://openalex.org/W2128188365","https://openalex.org/W2147106466","https://openalex.org/W2153084507","https://openalex.org/W2153259039","https://openalex.org/W2279763551","https://openalex.org/W2525541849","https://openalex.org/W2656689024","https://openalex.org/W4250323044","https://openalex.org/W6682508475"],"related_works":["https://openalex.org/W3083898685","https://openalex.org/W2037820527","https://openalex.org/W2612366884","https://openalex.org/W1550332805","https://openalex.org/W2028776640","https://openalex.org/W818846059","https://openalex.org/W3130536972","https://openalex.org/W2073570371","https://openalex.org/W1993222773","https://openalex.org/W1843313465"],"abstract_inverted_index":{"A":[0,50],"simplified":[1,15,171],"yield":[2],"model":[3,16,38,53,124,172],"for":[4,45,166],"static":[5],"random":[6],"access":[7],"memory":[8],"(SRAM)":[9],"repair":[10,22],"has":[11],"been":[12],"proposed.":[13],"This":[14],"provides":[17,162],"minimum":[18,46,60,114,183],"required":[19,115,182],"redundancy":[20,48,61,116,151,168],"to":[21,41,57,143],"all":[23],"bit":[24],"cell":[25],"failures":[26],"even":[27],"at":[28],"early":[29,164],"stage":[30],"of":[31,107],"technology":[32],"development.":[33],"First,":[34],"a":[35,82,92,148],"negative":[36],"binomial":[37],"is":[39,54,89,117,153,173],"used":[40,142],"illustrate":[42],"the":[43,59,96,104,108,121,126,145,157,181],"idea":[44],"SRAM":[47,69,109,130,150,167,184],"scheme.":[49],"more":[51],"practical":[52],"developed":[55,159],"afterward":[56],"evaluate":[58,180],"based":[62],"on":[63,135],"hard":[64,122],"failure":[65,84,123,128],"fault":[66],"density":[67],"and":[68,77,95,125,132,139,177],"automatic":[70],"pattern":[71],"recognition":[72],"code":[73],"pareto":[74],"in":[75,187],"14-":[76],"7-nm":[78,149],"FinFET":[79],"technology.":[80],"Then,":[81],"low-voltage":[83],"(soft":[85],"failure)":[86],"spatial":[87,105],"distribution":[88,94,98,106],"described":[90],"by":[91,102,119,155],"Weibull":[93,97],"parameters":[99],"are":[100,141],"calculated":[101],"fitting":[103],"soft":[110,127],"failures.":[111],"The":[112,170],"final":[113],"obtained":[118],"combining":[120],"model.":[129,146],"pre-":[131],"postrepair":[133],"data":[134],"14-nm":[136],"test":[137],"chip":[138],"product":[140],"validate":[144],"Finally,":[147],"scheme":[152],"proposed":[154],"applying":[156],"prior":[158],"model,":[160],"which":[161],"an":[163],"reference":[165],"design.":[169],"less":[174],"computation":[175],"intensive":[176],"can":[178],"quickly":[179],"redundancy,":[185],"especially":[186],"advanced":[188],"technologies.":[189]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}