{"id":"https://openalex.org/W2792413301","doi":"https://doi.org/10.1109/tvlsi.2018.2800707","title":"Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method","display_name":"Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method","publication_year":2018,"publication_date":"2018-02-23","ids":{"openalex":"https://openalex.org/W2792413301","doi":"https://doi.org/10.1109/tvlsi.2018.2800707","mag":"2792413301"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2018.2800707","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2018.2800707","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013935639","display_name":"Chase Cook","orcid":"https://orcid.org/0000-0002-0734-8398"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Chase Cook","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027081374","display_name":"Zeyu Sun","orcid":"https://orcid.org/0000-0001-7465-1824"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zeyu Sun","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016858790","display_name":"Ertugrul Demircan","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ertugrul Demircan","raw_affiliation_strings":["Physical Verification Group, NXP Semiconductors Inc., Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"Physical Verification Group, NXP Semiconductors Inc., Austin, TX, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036395022","display_name":"Mehul D. Shroff","orcid":"https://orcid.org/0000-0002-7664-8941"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mehul D. Shroff","raw_affiliation_strings":["Intrinsic Reliability Group, NXP Semiconductors Inc., Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"Intrinsic Reliability Group, NXP Semiconductors Inc., Austin, TX, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5013935639"],"corresponding_institution_ids":["https://openalex.org/I103635307"],"apc_list":null,"apc_paid":null,"fwci":1.75,"has_fulltext":false,"cited_by_count":53,"citation_normalized_percentile":{"value":0.84290552,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"26","issue":"5","first_page":"969","last_page":"980"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9922999739646912,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/krylov-subspace","display_name":"Krylov subspace","score":0.7918341159820557},{"id":"https://openalex.org/keywords/discretization","display_name":"Discretization","score":0.591422975063324},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.5049353241920471},{"id":"https://openalex.org/keywords/time-domain","display_name":"Time domain","score":0.5026013851165771},{"id":"https://openalex.org/keywords/copper-interconnect","display_name":"Copper interconnect","score":0.5000879764556885},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.42861056327819824},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4195634126663208},{"id":"https://openalex.org/keywords/piecewise","display_name":"Piecewise","score":0.41271206736564636},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.39488279819488525},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.3812780976295471},{"id":"https://openalex.org/keywords/applied-mathematics","display_name":"Applied mathematics","score":0.3546401858329773},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.2765331268310547},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.23423674702644348},{"id":"https://openalex.org/keywords/iterative-method","display_name":"Iterative method","score":0.13808009028434753}],"concepts":[{"id":"https://openalex.org/C147060835","wikidata":"https://www.wikidata.org/wiki/Q1757151","display_name":"Krylov subspace","level":3,"score":0.7918341159820557},{"id":"https://openalex.org/C73000952","wikidata":"https://www.wikidata.org/wiki/Q17007827","display_name":"Discretization","level":2,"score":0.591422975063324},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.5049353241920471},{"id":"https://openalex.org/C103824480","wikidata":"https://www.wikidata.org/wiki/Q185889","display_name":"Time domain","level":2,"score":0.5026013851165771},{"id":"https://openalex.org/C116372231","wikidata":"https://www.wikidata.org/wiki/Q605757","display_name":"Copper interconnect","level":3,"score":0.5000879764556885},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.42861056327819824},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4195634126663208},{"id":"https://openalex.org/C164660894","wikidata":"https://www.wikidata.org/wiki/Q2037833","display_name":"Piecewise","level":2,"score":0.41271206736564636},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.39488279819488525},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.3812780976295471},{"id":"https://openalex.org/C28826006","wikidata":"https://www.wikidata.org/wiki/Q33521","display_name":"Applied mathematics","level":1,"score":0.3546401858329773},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.2765331268310547},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.23423674702644348},{"id":"https://openalex.org/C159694833","wikidata":"https://www.wikidata.org/wiki/Q2321565","display_name":"Iterative method","level":2,"score":0.13808009028434753},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2018.2800707","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2018.2800707","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6660498235","display_name":null,"funder_award_id":"CCF-1527324","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G8380321884","display_name":null,"funder_award_id":"HR0011-16-2-0009","funder_id":"https://openalex.org/F4320332180","funder_display_name":"Defense Advanced Research Projects Agency"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1482398762","https://openalex.org/W1489767088","https://openalex.org/W1524432767","https://openalex.org/W1551480811","https://openalex.org/W1890614305","https://openalex.org/W1978838828","https://openalex.org/W1982104907","https://openalex.org/W1982681545","https://openalex.org/W1993513854","https://openalex.org/W2007719944","https://openalex.org/W2029506076","https://openalex.org/W2033650943","https://openalex.org/W2069576640","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2100756329","https://openalex.org/W2122608783","https://openalex.org/W2150608324","https://openalex.org/W2293477573","https://openalex.org/W2342660339","https://openalex.org/W2343272038","https://openalex.org/W2499331057","https://openalex.org/W2534634653","https://openalex.org/W2587645287","https://openalex.org/W2613570260","https://openalex.org/W3149694916","https://openalex.org/W6639550676"],"related_works":["https://openalex.org/W1982820757","https://openalex.org/W2128384320","https://openalex.org/W2082831914","https://openalex.org/W2075171636","https://openalex.org/W2106480950","https://openalex.org/W2039036129","https://openalex.org/W1994213108","https://openalex.org/W1976947690","https://openalex.org/W2154887827","https://openalex.org/W2034510649"],"abstract_inverted_index":{"Electromigration":[0],"effects":[1],"are":[2],"a":[3,22,27,50,88,131,275],"key":[4],"failure":[5],"mechanism":[6],"for":[7,21,68,74,93,170,222,251,265,281],"copper-based":[8],"dual":[9],"damascene":[10,71],"interconnects":[11],"wires":[12],"in":[13,26,64,139,159,208],"semiconductor":[14],"technologies.":[15],"However,":[16],"accurately":[17],"predicting":[18],"the":[19,35,58,65,98,111,120,140,145,148,160,167,193,204,209,215,230,268],"time-to-failure":[20],"complicated":[23],"interconnect":[24,29,72,249,269],"tree":[25],"VLSI":[28],"layout":[30],"requires":[31],"detailed":[32],"knowledge":[33],"of":[34,147,196,239,267,278],"stress":[36,99,197],"evolutions":[37],"over":[38,242],"time,":[39],"and":[40,46,78,174,185,255],"is":[41,49,108,115,137],"subject":[42],"to":[43,56,97,117,143,235],"time-varying":[44,186],"currents":[45],"temperature.":[47],"This":[48],"challenging":[51],"problem":[52],"as":[53],"one":[54],"needs":[55],"solve":[57],"stress-based":[59],"partial":[60],"differential":[61,126],"equations":[62,127,199],"(PDEs)":[63],"time":[66,161],"domain":[67,142],"confined":[69],"copper":[70],"trees":[73,250,270],"both":[75,171,252],"void":[76,79,172,175,253],"nucleation":[77,173,254],"growth":[80,176,256],"phases.":[81],"To":[82],"mitigate":[83],"this":[84],"problem,":[85],"we":[86,105,190,272],"propose":[87],"novel":[89],"Krylov":[90,133],"subspace-based":[91,134],"method":[92,113,221,232],"fast":[94],"numerical":[95],"solutions":[96],"PDEs.":[100],"The":[101,163],"new":[102],"approach,":[103],"which":[104,114,212],"call":[106],"FastEM,":[107],"based":[109],"on":[110,247],"finite-difference":[112,244],"used":[116],"first":[118],"discretize":[119],"PDEs":[121],"into":[122],"linear":[123,181],"time-invariant":[124],"ordinary":[125],"(ODEs).":[128],"After":[129],"discretization,":[130],"modified":[132],"reduction":[135],"technique":[136],"applied":[138],"frequency":[141,210],"reduce":[144],"size":[146],"original":[149],"system":[150,207],"matrices":[151],"so":[152],"that":[153,192,229,264],"they":[154],"can":[155,165,200,233],"be":[156,201],"efficiently":[157],"simulated":[158],"domain.":[162],"FastEM":[164],"perform":[166],"simulation":[168],"process":[169],"phases":[177,257],"under":[178],"piecewise":[179],"constant":[180],"current":[182],"density":[183],"inputs":[184],"stressing":[187],"temperatures.":[188],"Furthermore,":[189],"show":[191,228,263],"steady-state":[194],"response":[195],"diffusion":[198],"obtained":[202],"from":[203],"resulting":[205],"ODE":[206],"domain,":[211],"agrees":[213],"with":[214,258],"recently":[216],"proposed":[217,231],"voltage-based":[218],"EM":[219,223],"analysis":[220],"immortality":[224],"checks.":[225],"Numerical":[226],"results":[227],"lead":[234],"about":[236],"1-2":[237],"orders":[238],"magnitude":[240],"speed-up":[241],"existing":[243],"time-domain-based":[245],"methods":[246],"large":[248],"negligible":[259],"errors.":[260],"We":[261],"further":[262],"most":[266],"tested;":[271],"only":[273],"need":[274],"small":[276],"number":[277],"dominant":[279],"poles":[280],"sufficient":[282],"accuracy.":[283]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":12},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":3}],"updated_date":"2026-03-28T08:17:26.163206","created_date":"2025-10-10T00:00:00"}