{"id":"https://openalex.org/W2771448003","doi":"https://doi.org/10.1109/tvlsi.2017.2775586","title":"Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs","display_name":"Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs","publication_year":2017,"publication_date":"2017-12-07","ids":{"openalex":"https://openalex.org/W2771448003","doi":"https://doi.org/10.1109/tvlsi.2017.2775586","mag":"2771448003"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2017.2775586","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2017.2775586","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5045007303","display_name":"Shengcheng Wang","orcid":"https://orcid.org/0000-0001-6939-4552"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Shengcheng Wang","raw_affiliation_strings":["Chair of Dependable Nano Computing, Karlsruhe Institute of Technology, Karlsruhe, Germany"],"affiliations":[{"raw_affiliation_string":"Chair of Dependable Nano Computing, Karlsruhe Institute of Technology, Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100412370","display_name":"Taeyoung Kim","orcid":"https://orcid.org/0000-0002-8353-1776"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Taeyoung Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027081374","display_name":"Zeyu Sun","orcid":"https://orcid.org/0000-0001-7465-1824"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zeyu Sun","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064445713","display_name":"Mehdi B. Tahoori","orcid":"https://orcid.org/0000-0002-8829-5610"},"institutions":[{"id":"https://openalex.org/I102335020","display_name":"Karlsruhe Institute of Technology","ror":"https://ror.org/04t3en479","country_code":"DE","type":"education","lineage":["https://openalex.org/I102335020","https://openalex.org/I1305996414"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mehdi B. Tahoori","raw_affiliation_strings":["Chair of Dependable Nano Computing, Karlsruhe Institute of Technology, Karlsruhe, Germany"],"affiliations":[{"raw_affiliation_string":"Chair of Dependable Nano Computing, Karlsruhe Institute of Technology, Karlsruhe, Germany","institution_ids":["https://openalex.org/I102335020"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5045007303"],"corresponding_institution_ids":["https://openalex.org/I102335020"],"apc_list":null,"apc_paid":null,"fwci":0.7167,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.73889849,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"26","issue":"3","first_page":"531","last_page":"543"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9919000267982483,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.814860999584198},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.6761144995689392},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6594803333282471},{"id":"https://openalex.org/keywords/operability","display_name":"Operability","score":0.6292080879211426},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5294287800788879},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5191575884819031},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5135359764099121},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.46511179208755493},{"id":"https://openalex.org/keywords/mean-time-between-failures","display_name":"Mean time between failures","score":0.45057445764541626},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.43576154112815857},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3600894510746002},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.32854270935058594},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2196742296218872},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.21638372540473938},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1483309268951416}],"concepts":[{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.814860999584198},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.6761144995689392},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6594803333282471},{"id":"https://openalex.org/C126231374","wikidata":"https://www.wikidata.org/wiki/Q1061298","display_name":"Operability","level":2,"score":0.6292080879211426},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5294287800788879},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5191575884819031},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5135359764099121},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.46511179208755493},{"id":"https://openalex.org/C44154001","wikidata":"https://www.wikidata.org/wiki/Q754940","display_name":"Mean time between failures","level":3,"score":0.45057445764541626},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.43576154112815857},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3600894510746002},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.32854270935058594},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2196742296218872},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.21638372540473938},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1483309268951416},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2017.2775586","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2017.2775586","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":33,"referenced_works":["https://openalex.org/W1517687623","https://openalex.org/W1543206668","https://openalex.org/W1965451131","https://openalex.org/W1978465272","https://openalex.org/W1987638749","https://openalex.org/W2002967711","https://openalex.org/W2023264348","https://openalex.org/W2029040443","https://openalex.org/W2037677325","https://openalex.org/W2061141647","https://openalex.org/W2062899780","https://openalex.org/W2068262032","https://openalex.org/W2086481541","https://openalex.org/W2091664166","https://openalex.org/W2093127878","https://openalex.org/W2126339718","https://openalex.org/W2151734895","https://openalex.org/W2151755625","https://openalex.org/W2204848021","https://openalex.org/W2295208369","https://openalex.org/W2343272038","https://openalex.org/W2481508967","https://openalex.org/W2538462262","https://openalex.org/W2554597037","https://openalex.org/W2612022394","https://openalex.org/W2766363448","https://openalex.org/W2773119488","https://openalex.org/W3147058567","https://openalex.org/W4241472700","https://openalex.org/W4253549065","https://openalex.org/W4255435342","https://openalex.org/W4361868703","https://openalex.org/W6632276575"],"related_works":["https://openalex.org/W2165108872","https://openalex.org/W1526466920","https://openalex.org/W4286566980","https://openalex.org/W2324711075","https://openalex.org/W2053233382","https://openalex.org/W2034080945","https://openalex.org/W2337334590","https://openalex.org/W2006898677","https://openalex.org/W167642385","https://openalex.org/W2162366020"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"becomes":[2],"a":[3,17,28,35,161],"major":[4],"reliability":[5,67,136,173],"concern":[6],"in":[7,27,38,71,107,138],"3-D":[8,36,125],"integrated":[9],"circuits":[10],"(3-D":[11],"ICs).":[12],"To":[13],"mitigate":[14],"this":[15,53,86],"problem,":[16],"typical":[18],"solution":[19,100],"is":[20,74,101,166],"to":[21,62,77,81,124,147,150,168,174],"use":[22],"through-silicon":[23],"via":[24],"(TSV)":[25],"redundancy":[26,73,110],"reactive":[29,153],"manner,":[30],"maintaining":[31],"the":[32,39,64,128,141,151,184],"operability":[33],"of":[34,41,68,140],"chip":[37],"presence":[40],"EM":[42,88],"failures":[43],"by":[44,93,145],"detecting":[45],"and":[46,112,120,182],"replacing":[47],"faulty":[48],"TSVs":[49,80],"with":[50,155],"spares.":[51],"In":[52,85,159],"paper,":[54],"we":[55],"explore":[56],"an":[57],"alternative,":[58],"more":[59],"preferred":[60],"approach":[61,132,165],"enhance":[63],"EM-related":[65,134,171],"lifetime":[66,135,172],"TSV":[69,109,113,143],"grid,":[70],"which":[72,108],"used":[75],"proactively":[76],"allow":[78],"nonfaulty":[79],"be":[82,91],"temporarily":[83],"deactivated.":[84],"way,":[87],"wear-out":[89],"can":[90],"extended":[92],"exploiting":[94],"its":[95],"recovery":[96,164],"property.":[97],"The":[98],"proposed":[99,167],"based":[102],"on":[103],"two":[104],"consecutive":[105],"stages,":[106],"allocation":[111],"repair":[114,131],"are":[115],"finalized":[116],"at":[117],"both":[118],"design-time":[119],"runtime,":[121],"respectively.":[122],"Applied":[123],"benchmark":[126],"designs,":[127],"recovery-aware":[129],"proactive":[130],"increases":[133],"(measured":[137],"mean-time-to-failure)":[139],"entire":[142],"grid":[144],"up":[146],"12\u00d7":[148],"relative":[149],"conventional":[152],"method,":[154],"similar":[156],"area":[157],"overhead.":[158],"addition,":[160],"runtime":[162],"dynamic":[163],"further":[169],"improve":[170],"account":[175],"for":[176],"stress":[177],"variation":[178],"across":[179],"different":[180],"chips":[181],"over":[183],"operational":[185],"lifetime.":[186]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}