{"id":"https://openalex.org/W2616372290","doi":"https://doi.org/10.1109/tvlsi.2017.2699040","title":"End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs","display_name":"End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs","publication_year":2017,"publication_date":"2017-05-16","ids":{"openalex":"https://openalex.org/W2616372290","doi":"https://doi.org/10.1109/tvlsi.2017.2699040","mag":"2616372290"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2017.2699040","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2017.2699040","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101929483","display_name":"Dawei Li","orcid":"https://orcid.org/0000-0003-3749-7615"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Dawei Li","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052840646","display_name":"S. Joshi","orcid":"https://orcid.org/0000-0001-7640-4050"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Siddhartha Joshi","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100377811","display_name":"Ji-Hoon Kim","orcid":"https://orcid.org/0000-0002-9809-1339"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ji-Hoon Kim","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5007998506","display_name":"Seda Ogrenci-Memik","orcid":"https://orcid.org/0000-0001-8327-9585"},"institutions":[{"id":"https://openalex.org/I111979921","display_name":"Northwestern University","ror":"https://ror.org/000e0be47","country_code":"US","type":"education","lineage":["https://openalex.org/I111979921"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seda Ogrenci-Memik","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA","institution_ids":["https://openalex.org/I111979921"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5101929483"],"corresponding_institution_ids":["https://openalex.org/I111979921"],"apc_list":null,"apc_paid":null,"fwci":0.394,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.60000169,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"25","issue":"9","first_page":"2498","last_page":"2511"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5794118046760559},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5538406372070312},{"id":"https://openalex.org/keywords/thermocouple","display_name":"Thermocouple","score":0.5177923440933228},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.46827957034111023},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4358900487422943},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.4234026074409485},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41759106516838074},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.38057437539100647},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3322484493255615},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32003235816955566},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28588375449180603}],"concepts":[{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5794118046760559},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5538406372070312},{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.5177923440933228},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.46827957034111023},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4358900487422943},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.4234026074409485},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41759106516838074},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38057437539100647},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3322484493255615},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32003235816955566},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28588375449180603},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2017.2699040","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2017.2699040","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G5229392887","display_name":null,"funder_award_id":"CCF-1422489","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":69,"referenced_works":["https://openalex.org/W9557252","https://openalex.org/W19673281","https://openalex.org/W115185706","https://openalex.org/W649290676","https://openalex.org/W1035661616","https://openalex.org/W1492544064","https://openalex.org/W1528289474","https://openalex.org/W1532003505","https://openalex.org/W1541633348","https://openalex.org/W1908690613","https://openalex.org/W1972553220","https://openalex.org/W1974733267","https://openalex.org/W1979591196","https://openalex.org/W1983851959","https://openalex.org/W1990336181","https://openalex.org/W1991925378","https://openalex.org/W1993700253","https://openalex.org/W2002435556","https://openalex.org/W2009828642","https://openalex.org/W2041214634","https://openalex.org/W2044564201","https://openalex.org/W2049114603","https://openalex.org/W2051338340","https://openalex.org/W2054917994","https://openalex.org/W2055862872","https://openalex.org/W2059452522","https://openalex.org/W2065312134","https://openalex.org/W2069342025","https://openalex.org/W2078624863","https://openalex.org/W2093036342","https://openalex.org/W2099883803","https://openalex.org/W2102481439","https://openalex.org/W2102727118","https://openalex.org/W2104543858","https://openalex.org/W2106253506","https://openalex.org/W2107687035","https://openalex.org/W2125927885","https://openalex.org/W2129782853","https://openalex.org/W2130787363","https://openalex.org/W2134438338","https://openalex.org/W2141505721","https://openalex.org/W2143996180","https://openalex.org/W2158521105","https://openalex.org/W2163542585","https://openalex.org/W2164217202","https://openalex.org/W2169219063","https://openalex.org/W2206789639","https://openalex.org/W2261256093","https://openalex.org/W2291569289","https://openalex.org/W2487518805","https://openalex.org/W2490313200","https://openalex.org/W2507103732","https://openalex.org/W2549447336","https://openalex.org/W2713529857","https://openalex.org/W2729014657","https://openalex.org/W2744363458","https://openalex.org/W3139853852","https://openalex.org/W3140903683","https://openalex.org/W3143230181","https://openalex.org/W4240335978","https://openalex.org/W4240666929","https://openalex.org/W4256233769","https://openalex.org/W6629382394","https://openalex.org/W6631773002","https://openalex.org/W6639947262","https://openalex.org/W6675480343","https://openalex.org/W6740702125","https://openalex.org/W6742534659","https://openalex.org/W6792941224"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2778007986","https://openalex.org/W2104813155","https://openalex.org/W4241611182","https://openalex.org/W2888620174","https://openalex.org/W1975899710","https://openalex.org/W2059015032","https://openalex.org/W4239706042","https://openalex.org/W4232186619","https://openalex.org/W4256502225"],"abstract_inverted_index":{"Solutions":[0],"to":[1,33,49,189],"the":[2,38,68,73,97,103,106,119,123,134,141,179,182],"integration":[3],"challenges":[4],"of":[5,35,84,105,122,145,181,194],"a":[6,62,158,190],"new":[7],"thermal":[8,50,75,85,107,153,183],"sensor":[9,69,124,135],"technology":[10],"into":[11],"3-D":[12,39,80],"integrated":[13],"circuits":[14],"(ICs)":[15],"will":[16,46],"be":[17,47],"discussed":[18],"in":[19,54,58,173,185],"this":[20,146],"paper.":[21],"Our":[22],"proposed":[23],"architecture":[24],"uses":[25],"bimetallic":[26],"thin-film":[27],"thermocouples,":[28],"which":[29],"are":[30,110],"thermally":[31],"linked":[32],"points":[34],"measurement":[36],"throughout":[37],"stack":[40],"with":[41,72,133,148],"dedicated":[42],"vias.":[43],"These":[44],"vias":[45,52],"similar":[48],"through-silicon":[51],"(TSVs)":[53],"structure,":[55],"yet":[56],"different":[57],"functionality.":[59],"We":[60,139],"propose":[61],"low-overhead":[63],"design":[64],"methodology":[65],"by":[66],"linking":[67],"placement":[70],"task":[71],"existing":[74],"TSV":[76,86,108],"planning":[77],"phase":[78],"for":[79,96],"ICs.":[81],"A":[82],"fraction":[83],"resources":[87,109],"is":[88],"decoupled":[89],"from":[90],"their":[91],"original":[92],"use":[93],"and":[94,143,155],"repurposed":[95],"temperature":[98,174,192],"sensing":[99],"infrastructure.":[100],"Tradeoffs":[101],"concerning":[102],"reduction":[104],"investigated.":[111],"Furthermore,":[112],"we":[113,162,165],"present":[114],"an":[115],"end-to-end":[116],"system,":[117],"including":[118],"physical":[120],"realization":[121],"network":[125],"as":[126,128],"well":[127],"its":[129],"analog":[130],"interface":[131,147],"circuitry":[132],"data":[136],"sampling":[137],"unit.":[138],"demonstrate":[140,163],"operation":[142],"correctness":[144],"transistor-level":[149],"simulations.":[150],"Next,":[151],"through":[152],"modeling":[154],"simulation":[156],"using":[157],"state-of-the-art":[159],"tool":[160],"(FloTHERM),":[161],"that":[164],"can":[166],"achieve":[167],"high":[168],"accuracy":[169],"(1":[170],"\u00b0C":[171],"error)":[172],"tracking":[175],"while":[176],"still":[177],"maintaining":[178],"effectiveness":[180],"TSVs":[184],"heat":[186],"management":[187],"(conforming":[188],"peak":[191],"constraint":[193],"95":[195],"\u00b0C).":[196]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2}],"updated_date":"2026-04-02T15:55:50.835912","created_date":"2025-10-10T00:00:00"}