{"id":"https://openalex.org/W2344039825","doi":"https://doi.org/10.1109/tvlsi.2015.2511065","title":"A Holistic Modeling and Analysis of Optical\u2013Electrical Interfaces for Inter/Intra-chip Interconnects","display_name":"A Holistic Modeling and Analysis of Optical\u2013Electrical Interfaces for Inter/Intra-chip Interconnects","publication_year":2016,"publication_date":"2016-01-21","ids":{"openalex":"https://openalex.org/W2344039825","doi":"https://doi.org/10.1109/tvlsi.2015.2511065","mag":"2344039825"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2015.2511065","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2015.2511065","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101482096","display_name":"Zhehui Wang","orcid":"https://orcid.org/0000-0002-7139-724X"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Zhehui Wang","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013248987","display_name":"Jiang Xu","orcid":"https://orcid.org/0000-0001-9089-7752"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Jiang Xu","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046052033","display_name":"Peng Yang","orcid":"https://orcid.org/0000-0003-3675-3365"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Peng Yang","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016725699","display_name":"Luan H. K. Duong","orcid":"https://orcid.org/0000-0003-4731-1896"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Luan Huu Kinh Duong","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100743754","display_name":"Zhifei Wang","orcid":"https://orcid.org/0000-0002-7069-2140"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Zhifei Wang","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100329024","display_name":"Xuan Wang","orcid":"https://orcid.org/0000-0002-9214-1809"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Xuan Wang","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101881791","display_name":"Zhe Wang","orcid":"https://orcid.org/0000-0002-2752-9970"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Zhe Wang","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100327725","display_name":"Haoran Li","orcid":"https://orcid.org/0000-0002-3478-9260"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Haoran Li","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061927240","display_name":"Rafael K. V. Maeda","orcid":null},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Rafael Kioji Vivas Maeda","raw_affiliation_strings":["Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong"],"affiliations":[{"raw_affiliation_string":"Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong","institution_ids":["https://openalex.org/I200769079"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5101482096"],"corresponding_institution_ids":["https://openalex.org/I200769079"],"apc_list":null,"apc_paid":null,"fwci":1.2863,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.81838455,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"24","issue":"7","first_page":"2462","last_page":"2474"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10232","display_name":"Optical Network Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/serdes","display_name":"SerDes","score":0.7503235936164856},{"id":"https://openalex.org/keywords/bottleneck","display_name":"Bottleneck","score":0.7017048597335815},{"id":"https://openalex.org/keywords/weaving","display_name":"Weaving","score":0.6827400326728821},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6361219882965088},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.6048981547355652},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.593845546245575},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.5054266452789307},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4589169919490814},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4362059235572815},{"id":"https://openalex.org/keywords/optical-switch","display_name":"Optical switch","score":0.4198460876941681},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.34627270698547363},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.29807400703430176},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27884918451309204},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2683420479297638},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.24886742234230042},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2181990146636963},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15498924255371094},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.14028310775756836}],"concepts":[{"id":"https://openalex.org/C19707634","wikidata":"https://www.wikidata.org/wiki/Q6510662","display_name":"SerDes","level":2,"score":0.7503235936164856},{"id":"https://openalex.org/C2780513914","wikidata":"https://www.wikidata.org/wiki/Q18210350","display_name":"Bottleneck","level":2,"score":0.7017048597335815},{"id":"https://openalex.org/C54525549","wikidata":"https://www.wikidata.org/wiki/Q2553445","display_name":"Weaving","level":2,"score":0.6827400326728821},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6361219882965088},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.6048981547355652},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.593845546245575},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.5054266452789307},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4589169919490814},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4362059235572815},{"id":"https://openalex.org/C101336846","wikidata":"https://www.wikidata.org/wiki/Q17105111","display_name":"Optical switch","level":2,"score":0.4198460876941681},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.34627270698547363},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.29807400703430176},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27884918451309204},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2683420479297638},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.24886742234230042},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2181990146636963},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15498924255371094},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.14028310775756836},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/tvlsi.2015.2511065","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2015.2511065","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-80321","is_oa":false,"landing_page_url":"http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=LinksAMR&SrcApp=PARTNER_APP&DestLinkType=FullRecord&DestApp=WOS&KeyUT=000380031000005","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"},{"id":"pmh:oai:repository.ust.hk:1783.1-80321","is_oa":false,"landing_page_url":"http://repository.ust.hk/ir/Record/1783.1-80321","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":36,"referenced_works":["https://openalex.org/W86246016","https://openalex.org/W1597620877","https://openalex.org/W1633117367","https://openalex.org/W1937724927","https://openalex.org/W1976238733","https://openalex.org/W1983159767","https://openalex.org/W1985648870","https://openalex.org/W1989912502","https://openalex.org/W1992138759","https://openalex.org/W1993878212","https://openalex.org/W1997905069","https://openalex.org/W2000416458","https://openalex.org/W2072569245","https://openalex.org/W2082717069","https://openalex.org/W2088360960","https://openalex.org/W2090865502","https://openalex.org/W2096068274","https://openalex.org/W2096934953","https://openalex.org/W2098802818","https://openalex.org/W2109959084","https://openalex.org/W2110022562","https://openalex.org/W2118428013","https://openalex.org/W2122208095","https://openalex.org/W2126340693","https://openalex.org/W2132466715","https://openalex.org/W2137668082","https://openalex.org/W2139996341","https://openalex.org/W2156803383","https://openalex.org/W2169897011","https://openalex.org/W2172440946","https://openalex.org/W2304732018","https://openalex.org/W2538780543","https://openalex.org/W2565249762","https://openalex.org/W4230728857","https://openalex.org/W4245135378","https://openalex.org/W6651496371"],"related_works":["https://openalex.org/W2952092742","https://openalex.org/W2068981955","https://openalex.org/W67774003","https://openalex.org/W2368396969","https://openalex.org/W2740565117","https://openalex.org/W2365680989","https://openalex.org/W4231951841","https://openalex.org/W2188987414","https://openalex.org/W3200780701","https://openalex.org/W123680842"],"abstract_inverted_index":{"With":[0],"the":[1,8,11,109,116,121],"fast":[2],"development":[3,111],"of":[4,14,33,58,85,112,120,128],"inter/intra-chip":[5],"optical":[6,18,44,96,113,137,159,161],"interconnects,":[7],"gap":[9],"between":[10,38,70],"data":[12,37,67,94],"rates":[13],"electrical":[15,40,155],"interconnects":[16,19,41,114,156],"and":[17,26,42,50,53,62,72,77,87,92,125,157,172],"is":[20],"continuously":[21],"increasing.":[22],"Electrical\u2013optical":[23],"(E-O)":[24],"interfaces":[25,29,55,103,139,163],"optical\u2013electrical":[27],"(O-E)":[28],"are":[30,68,80,99,152],"a":[31,106,141,166,173],"pair":[32],"components":[34],"that":[35,136],"convert":[36],"parallel":[39,71,154],"serial":[43,73],"interconnects.":[45],"This":[46],"paper":[47],"holistically":[48],"models":[49],"analyzes":[51],"E-O":[52,86],"O-E":[54,88],"in":[56,115,169,176],"terms":[57],"energy":[59,123,170],"consumption,":[60],"area,":[61,177],"latency.":[63],"Traditional":[64,102],"interfaces,":[65],"where":[66],"converted":[69],"ports":[74],"by":[75,95],"serializers":[76],"deserializers":[78],"(SerDes),":[79],"studied.":[81],"A":[82],"new":[83,131],"type":[84],"interface,":[89],"which":[90],"serializes":[91],"deserializes":[93],"weaving":[97,138,162],"technologies,":[98],"proposed":[100],"alongside.":[101],"will":[104],"become":[105],"bottleneck":[107],"for":[108],"further":[110],"near":[117],"future":[118],"because":[119],"high":[122],"consumption":[124,171],"large":[126],"area":[127],"SerDes":[129],"necessitating":[130],"technologies.":[132],"Our":[133],"analysis":[134],"shows":[135],"have":[140],"better":[142],"overall":[143],"performance":[144],"than":[145],"traditional":[146,180],"interfaces.":[147,181],"For":[148],"example,":[149],"if":[150],"there":[151],"64":[153],"four":[158],"wavelengths,":[160],"can":[164],"achieve":[165],"81.6%":[167],"improvement":[168,175],"40.8%":[174],"compared":[178],"with":[179]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}